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公开(公告)号：US20160201209A1
公开(公告)日：2016-07-14
申请号：US15079533
申请日：2016-03-24
Applicant: Rohm and Haas Electronic Materials LLC
Inventor： Julia KOZHUKH , Zuhra I. NIAZIMBETOVA , Maria Anna RZEZNIK
CPC classification number: C25D3/38 , C07C279/08 , C07C279/18 , C07C311/64 , C07C335/24 , C07D303/10 , C25D3/02 , C25D3/32 , C25D3/56 , C25D3/565 , C25D3/60 , C25D5/02 , C25D5/54 , C25D5/56 , C25D7/123 , H05K3/188 , H05K3/424 , H05K2201/09509 , H05K2201/09563
Abstract: Reaction products of guanidine compounds or salts thereof, polyepoxide compounds and polyhalogen compounds may be used as levelers in metal electroplating baths, such as copper electroplating baths, to provide good throwing power. Such reaction products may plate with good surface properties of the metal deposits and good physical reliability.
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公开(公告)号：US20140093647A1
公开(公告)日：2014-04-03
申请号：US14042527
申请日：2013-09-30
Applicant: Rohm and Haas Electronic Materials LLC
Inventor： Maria Anna RZEZNIK , Philip D. KNUDSEN , Xuesong WANG , Martin W. BAYES , Yuhsin TSAI
IPC: C23C18/18
CPC classification number: C23C18/18 , C08G12/00 , C09D179/02 , C23C18/165 , C23C18/1651 , C23C18/1653 , C23C18/1893 , C23C18/40
Abstract: A method for forming a polymerized film on a surface of a non-conductive material and subsequently forming an electroless metal plating film on the surface is described. The method includes the step of contacting the surface of the material with a solution including (A) an amine compound having at least two functional groups, where at least one of the functional groups is an amino group, and (B) an aromatic compound having at least one hydroxyl group on the aromatic ring.
Abstract translation: 描述了在非导电材料的表面上形成聚合膜并随后在表面上形成化学镀金属膜的方法。 该方法包括使材料的表面与包含（A）具有至少两个官能团的胺化合物的溶液接触的步骤，其中至少一个官能团是氨基，和（B）具有 芳环上至少有一个羟基。
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公开(公告)号：US20160332153A1
公开(公告)日：2016-11-17
申请号：US15221705
申请日：2016-07-28
Applicant: Rohm and Haas Electronic Materials LLC
Inventor： Feng LIU , Maria Anna RZEZNIK
IPC: B01J33/00 , B01J23/50 , B01J35/00 , C23C18/50 , C23C18/30 , C23C18/32 , C23C18/38 , C23C18/40 , B01J23/44 , C23C18/34
CPC classification number: B01J33/00 , B01J23/40 , B01J23/44 , B01J23/48 , B01J23/50 , B01J35/0013 , B01J37/16 , C23C18/1607 , C23C18/2086 , C23C18/30 , C23C18/32 , C23C18/34 , C23C18/38 , C23C18/40 , C23C18/48 , C23C18/50
Abstract: Aqueous catalysts of nanoparticles of precious metals and stabilizers of flavonoid derivatives are used to electrolessly plate metal on non-conductive substrates. Such substrates include printed circuit boards.
Abstract translation: 使用贵金属纳米颗粒和类黄酮衍生物稳定剂的水性催化剂在非导电基材上无电镀金属。 这样的基板包括印刷电路板。
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公开(公告)号：US20160186345A1
公开(公告)日：2016-06-30
申请号：US14585227
申请日：2014-12-30
Applicant: Rohm and Haas Electronic Materials LLC
Inventor： Weijing LU , Zuhra I. NIAZIMBETOVA , Maria Anna RZEZNIK
CPC classification number: C25D3/38 , C25D3/58 , C25D3/60 , C25D5/38 , H05K3/188 , H05K3/241 , H05K3/423
Abstract: Sulfonamide based polymers are reaction products of sulfonamides and epoxides. The polymers may be used as levelers in copper electroplating baths, to provide good throwing power. Such reaction products may plate copper or copper alloys with good surface properties and good physical reliability.
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公开(公告)号：US20150159288A1
公开(公告)日：2015-06-11
申请号：US14098555
申请日：2013-12-06
Applicant: Rohm and Haas Electronic Materials LLC
Inventor： Julia KOZHUKH , Zuhra I. NIAZIMBETOVA , Maria Anna RZEZNIK
CPC classification number: C25D3/32 , C07D239/48 , C07D403/12 , C07D403/14 , C25D3/38 , C25D3/58 , C25D3/60 , C25D5/02 , C25D7/123 , H05K3/423
Abstract: Reaction products of halogenated pyrimidines and nucleophilic linker units are included in metal electroplating baths to provide good throwing power. The electroplating baths can be used to plate metal, such as copper, tin and alloys thereof on printed circuit boards and semiconductors and fill through-holes and vias.
Abstract translation: 卤化嘧啶和亲核接头单元的反应产物包括在金属电镀浴中，以提供良好的抛光力。 电镀浴可用于在印刷电路板和半导体上镀金属，例如铜，锡及其合金，并填充通孔和通孔。
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Patent Agency Ranking
公开(公告)号：US20140027298A1
公开(公告)日：2014-01-30
申请号：US14040091
申请日：2013-09-27
Applicant: Rohm and Haas Electronic Materials LLC
Inventor： Zuhra I. NIAZIMBETOVA , Maria Anna RZEZNIK
IPC: C25D3/38
Abstract: This invention relates to copper plating baths containing a leveling agent that is a reaction product of one or more of certain cyclodiaza-compounds with one or more epoxide-containing compounds useful to deposit copper on the surface of a conductive layer. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. This invention also relates to methods of depositing copper layers using such copper plating baths.
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公开(公告)号：US20190100499A1
公开(公告)日：2019-04-04
申请号：US16112847
申请日：2018-10-11
Inventor： Lingli DUAN , Chen CHEN , Shaoguang FENG , Zhkhra I. NIAZIMBETOVA , Maria Anna RZEZNIK
IPC: C07D265/33 , C07D413/12 , C25D7/00 , C25D7/12 , C07D241/04 , C09D179/08 , C25D3/32 , C08G73/10 , C08G73/02 , C25D3/38
CPC classification number: C07D265/33 , C07D241/04 , C07D413/12 , C08G73/028 , C08G73/0293 , C08G73/10 , C09D179/08 , C25D3/32 , C25D3/38 , C25D7/00 , C25D7/123
Abstract: Reaction products of primary and secondary diamines and bisanhydrides are included as additives in metal electroplating baths. The metal electroplating baths have good throwing power and deposit metal layers having substantially planar surfaces. The metal plating baths may be used to deposit metal on substrates with surface features such as through-holes and vias.
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公开(公告)号：US20160186346A1
公开(公告)日：2016-06-30
申请号：US14585228
申请日：2014-12-30
Applicant: Rohm and Haas Electronic Materials LLC
Inventor： Zuhra I. NIAZIMBETOVA , Maria Anna RZEZNIK
IPC: C25D3/38 , C07D303/04 , C07D303/18 , C25D3/58 , C25D7/00
CPC classification number: C25D3/38 , C07D303/04 , C07D303/18 , C25D3/32 , C25D3/58 , C25D7/123
Abstract: Reaction products of one or more amino acids and one or more epoxies are included in copper and copper alloy electroplating baths to provide good throwing power. Such reaction products may plate copper and copper alloys with good surface properties and good physical reliability.
Abstract translation: 一种或多种氨基酸和一种或多种环氧化物的反应产物包括在铜和铜合金电镀浴中以提供良好的投掷能力。 这种反应产物可以对具有良好表面性能和良好物理可靠性的铜和铜合金进行镀覆。
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9.发明申请REACTION PRODUCTS OF GUANIDINE COMPOUNDS OR SALTS THEREOF, POLYEPOXIDES AND POLYHALOGENS 有权化合物或其盐，其中多环氧化物和多羟基化合物的反应产物公开(公告)号：US20150136611A1
公开(公告)日：2015-05-21
申请号：US14086951
申请日：2013-11-21
Applicant: Rohm and Haas Electronic Materials LLC
Inventor： Julia KOZHUKH , Zuhra I. NIAZIMBETOVA , Maria Anna RZEZNIK
IPC: C07C279/08 , C07C335/24 , C07C311/64 , C25D3/38 , C07C279/18
CPC classification number: C25D3/38 , C07C279/08 , C07C279/18 , C07C311/64 , C07C335/24 , C07D303/10 , C25D3/02 , C25D3/32 , C25D3/56 , C25D3/565 , C25D3/60 , C25D5/02 , C25D5/54 , C25D5/56 , C25D7/123 , H05K3/188 , H05K3/424 , H05K2201/09509 , H05K2201/09563
Abstract: Reaction products of guanidine compounds or salts thereof, polyepoxide compounds and polyhalogen compounds may be used as levelers in metal electroplating baths, such as copper electroplating baths, to provide good throwing power. Such reaction products may plate with good surface properties of the metal deposits and good physical reliability.
Abstract translation: 胍化合物或其盐，聚环氧化物化合物和多卤素化合物的反应产物可用作金属电镀浴中的均化剂，例如电镀铜浴，以提供良好的投掷力。 这样的反应产物可能具有良好的金属沉积物的表面性质并具有良好的物理可靠性。
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10.发明申请CATALYSTS FOR ELECTROLESS METALLIZATION CONTAINING IMINODIACETIC ACID AND DERIVATIVES 审中-公开含有氨基酸和衍生物的电解金属化催化剂公开(公告)号：US20150024123A1
公开(公告)日：2015-01-22
申请号：US13943771
申请日：2013-07-16
Applicant: Rohm and Haas Electronic Materials LLC
Inventor： Kristen M. MILUM , Donald E. CLEARY , Maria Anna RZEZNIK
CPC classification number: B01J31/28 , B01J31/04 , B01J31/223 , B01J31/2243 , B01J31/2252 , B01J31/26 , B01J2531/17 , B01J2531/18 , B01J2531/824 , B01J2531/828 , C23C18/1633 , C23C18/1653 , C23C18/1837 , C23C18/1886 , C23C18/2073 , C23C18/30 , C23C18/32 , C23C18/38 , C23C18/44
Abstract: Catalysts include iminodiacetic acid and derivatives thereof as ligands for metal ions which have catalytic activity. The catalysts may be used to electrolessly plate metal on metal clad and un-clad substrates.
Abstract translation: 催化剂包括亚氨基二乙酸及其衍生物作为具有催化活性的金属离子的配体。 催化剂可用于在金属包覆和未包覆的基底上无电镀金属。
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