公开(公告)号：US20140093647A1

公开(公告)日：2014-04-03

申请号：US14042527

申请日：2013-09-30

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Maria Anna RZEZNIK ,  Philip D. KNUDSEN ,  Xuesong WANG ,  Martin W. BAYES ,  Yuhsin TSAI

IPC: C23C18/18

CPC classification number: C23C18/18 ,  C08G12/00 ,  C09D179/02 ,  C23C18/165 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1893 ,  C23C18/40

Abstract: A method for forming a polymerized film on a surface of a non-conductive material and subsequently forming an electroless metal plating film on the surface is described. The method includes the step of contacting the surface of the material with a solution including (A) an amine compound having at least two functional groups, where at least one of the functional groups is an amino group, and (B) an aromatic compound having at least one hydroxyl group on the aromatic ring.

Abstract translation: 描述了在非导电材料的表面上形成聚合膜并随后在表面上形成化学镀金属膜的方法。 该方法包括使材料的表面与包含（A）具有至少两个官能团的胺化合物的溶液接触的步骤，其中至少一个官能团是氨基，和（B）具有 芳环上至少有一个羟基。