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公开(公告)号：US20240110286A1
公开(公告)日：2024-04-04
申请号：US18372909
申请日：2023-09-26
IPC分类号： C23C18/16
CPC分类号： C23C18/1628 , C23C18/1617 , C23C18/1642 , C23C18/1676 , C23C18/168
摘要： The invention relates to a depositing station comprising a basin arrangement (11) having a basin (13) forming a processing chamber (12) and serving to receive a solution of a metal, in particular nickel, zinc, palladium, gold or the like, dissolved in a liquid, for a, preferably electroless, deposition on an object receivable in the processing chamber, in particular on a terminal face of a wafer receivable in the processing chamber, the basin having at least one inlet (17) for introducing the solution into the basin, the basin having a perforation (18) which forms at least part of the inlet of the basin and which is configured to homogeneously introduce the solution into the processing chamber. Furthermore, the invention relates to a device for producing contact metallizations on terminal faces of wafers, comprising at least one depositing station.
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公开(公告)号：US20170127515A1
公开(公告)日：2017-05-04
申请号：US15400218
申请日：2017-01-06
发明人： Gil MARKOVICH , Daniel AZULAI , Olga KRICHEVSKI
IPC分类号： H05K1/09 , C23C18/40 , C23C18/44 , H01L29/786 , C23C18/16 , H01B1/02 , H05K1/02 , C23C18/34 , C23C18/48
CPC分类号： H05K1/09 , C23C18/14 , C23C18/166 , C23C18/1667 , C23C18/1676 , C23C18/34 , C23C18/40 , C23C18/44 , C23C18/48 , H01B1/02 , H01L29/786 , H05K1/0274 , H05K3/105 , H05K3/182 , H05K2201/0108 , H05K2201/0257 , H05K2201/026 , H05K2201/10121 , H05K2201/10128 , H05K2201/10166 , H05K2203/013 , H05K2203/1157 , H05K2203/125 , Y10T428/24917
摘要： A conductive nanowire film having a high aspect-ratio metal is described. The nanowire film is produced by inducing metal reduction in a concentrated surfactant solution containing metal precursor ions, a surfactant and a reducing agent. The metal nanostructures demonstrate utility in a great variety of applications.
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公开(公告)号：US20170121822A1
公开(公告)日：2017-05-04
申请号：US15333303
申请日：2016-10-25
CPC分类号： C23C18/1619 , C23C18/1675 , C23C18/1676 , C23C18/168 , C23C18/1683 , C23C18/31 , C23C18/52
摘要： A plating apparatus can suppress a time period during which a plating liquid is used in a plating from being reduced. In the plating apparatus 1, after a plating liquid supply unit 53 supplies, to a substrate W1, a plating liquid which exerts a preset plating performance within a preset concentration range and which has an initial temperature adjusted to be lower than a preset plating temperature; and an initial concentration adjusted such that a concentration of the plating liquid at a moment when a temperature of the plating liquid has reached the preset plating temperature is equal to or higher than a lower limit of the preset concentration range and equal to or below a median value of the preset concentration range, a plating liquid heating unit 63 heats the plating liquid supplied to the substrate W1 to the preset plating temperature.
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公开(公告)号：US20160369405A1
公开(公告)日：2016-12-22
申请号：US14899099
申请日：2014-06-18
申请人： NEXEON LIMITED
发明人： David William Bent
CPC分类号： C23C18/42 , B01J2/006 , C23C18/08 , C23C18/1619 , C23C18/1635 , C23C18/1639 , C23C18/1676 , C23C18/168 , C23C18/1689 , C23C18/54
摘要： The present invention relates to a method of forming a metal coated particle, to metal coated particles prepared according to the method and the use of these metal coated particles. The method comprising the steps of:providing a source of base particles to be coated; providing a source of a metal-comprising coating particles; and feeding the base particles specified in step (a) and the source of metal comprising coating particles specified in step (b) into a continuous reactor including heat exchange means to cause contact of the base particles with the source of coating particles thereby to form the metal coated particles. The coated particles include a homogeneous coating and can be used in a variety of applications.
摘要翻译： 形成金属涂覆颗粒的方法包括以下步骤：提供待涂覆的基础颗粒源; 提供含金属的涂层颗粒的来源; 并将步骤（a）中规定的基础颗粒和包含步骤（b）中规定的涂布颗粒的金属源进料到包括热交换装置的连续反应器中，以使基础颗粒与涂层颗粒的源接触，从而形成 金属涂层颗粒。 基础颗粒可以选自硅，锗，锡，铝，镓，锌等，并且金属包覆颗粒的来源可以选自银，铜，铂，铁，钴，铑，钒，镍，钌， 铱和金。 涂覆的颗粒包括均匀的涂层并且可以用于各种应用中。 还示出了覆膜颗粒和用于执行该方法的装置。
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公开(公告)号：US20150232994A1
公开(公告)日：2015-08-20
申请号：US14129698
申请日：2012-06-04
CPC分类号： C23C18/163 , C23C18/1619 , C23C18/1632 , C23C18/1655 , C23C18/1669 , C23C18/1675 , C23C18/1676 , C23C18/168 , C23C18/18 , C23C18/50 , H05K3/187 , H05K2203/0165 , H05K2203/072 , H05K2203/075
摘要： A plating apparatus can perform a plating process on an entire surface of a substrate uniformly. A plating apparatus 20 includes a substrate holding/rotating device 110 configured to hold and rotate a substrate 2; a discharging device 21 configured to discharge a plating liquid toward the substrate 2 held on the substrate holding/rotating device 110; and a controller 160 configured to control the substrate holding/rotating device 110 and the discharging device 21. Further, the discharging device 21 includes a first nozzle 40 having a multiple number of discharge openings 41 arranged in a radial direction of the substrate 2 or having a discharge opening 42 extended in the radial direction of the substrate 2; and a second nozzle 45 having a discharge opening 46 configured to be positioned closer to a central portion of the substrate 2 than the discharge opening of the first nozzle 40.
摘要翻译： 电镀装置可以均匀地对基板的整个表面进行电镀处理。 电镀装置20包括被配置为保持和旋转衬底2的衬底保持/旋转装置110; 排出装置21，被配置为将电镀液体朝向保持在基板保持旋转装置110上的基板2排出; 以及配置为控制基板保持/旋转装置110和排出装置21的控制器160.此外，排出装置21包括：第一喷嘴40，其具有沿基板2的径向配置的多个排出口41，或具有 沿基板2的径向延伸的排出口42; 以及第二喷嘴45，其具有被配置为比第一喷嘴40的排出口更靠近基板2的中心部分的排出口46。
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公开(公告)号：US20150147476A1
公开(公告)日：2015-05-28
申请号：US14404205
申请日：2013-05-27
IPC分类号： C23C18/16
CPC分类号： C23C18/1619 , C23C18/1633 , C23C18/1651 , C23C18/1676 , C23C18/1683 , C23C18/1893 , C23C18/50 , H01L21/288 , H01L21/76843 , H01L21/76898
摘要： A plating method can improve uniformity in a thickness of a plating layer formed on an inner surface of a recess. The plating method includes a loading process of loading the substrate in which the recess is formed into a casing; and a plating process of supplying a plating liquid to the substrate and forming a plating layer having a specific function on an inner surface of the recess. The plating process includes a first plating process of supplying a first plating liquid to the substrate and forming a first plating layer; and a second plating process of supplying a second plating liquid to the substrate and forming a second plating layer on the first plating layer after the first plating process. Further, a concentration of an additive contained in the first plating liquid is different from a concentration of an additive contained in the second plating liquid.
摘要翻译： 电镀方法可以提高形成在凹部的内表面上的镀层的厚度的均匀性。 电镀方法包括将形成有凹部的基板装载到壳体中的装载工序; 以及向所述基板供给电镀液体并在所述凹部的内表面形成具有特定功能的镀层的电镀工序。 电镀工艺包括：向基板供给第一电镀液并形成第一镀层的第一电镀工序; 以及第二电镀工艺，其在所述第一电镀工艺之后，将第二电镀液体供应到所述衬底并在所述第一镀层上形成第二镀层。 此外，第一电镀液中所含的添加剂的浓度与第二电镀液中所含的添加剂的浓度不同。
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公开(公告)号：US20140134345A1
公开(公告)日：2014-05-15
申请号：US14129623
申请日：2012-06-04
CPC分类号： B05C5/001 , B05D1/02 , C23C18/1619 , C23C18/1669 , C23C18/1676 , C23C18/168
摘要： A plating apparatus of performing a plating process by supplying a plating liquid onto a substrate includes a substrate holding/rotating device configured to hold and rotate the substrate; a discharging device configured to discharge the plating liquid toward the substrate; a plating liquid supplying device configured to supply the plating liquid to the discharging device; and a controller configured to control the discharging device and the plating liquid supplying device. Further, the discharging device includes a first nozzle having a discharge opening, and a second nozzle having a discharge opening configured to be positioned closer to a central portion of the substrate than the discharge opening of the first nozzle. Furthermore, the plating liquid supplying device is configured to set a temperature of the plating liquid supplied to the first nozzle to be higher than a temperature of the plating liquid supplied to the second nozzle.
摘要翻译： 通过将电镀液体供给到基板上进行电镀处理的电镀装置包括：基板保持旋转装置，其构造成保持和旋转基板; 排出装置，被配置为将所述电镀液体朝向所述基板排出; 电镀液供给装置，其配置为将电镀液体供给到排出装置; 以及控制器，其被配置为控制所述排出装置和所述电镀液供给装置。 此外，排出装置包括具有排出口的第一喷嘴和具有排出口的第二喷嘴，其被配置为比第一喷嘴的排出口更靠近基板的中心部分。 此外，电镀液供给装置被配置为将供给到第一喷嘴的电镀液的温度设定为高于供给到第二喷嘴的电镀液的温度。
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公开(公告)号：US20110129763A1
公开(公告)日：2011-06-02
申请号：US12752728
申请日：2010-04-01
申请人： Jae Seung Lee , Yung-Eun Sung , Tae-Yeol Jeon , Hee-Young Park
发明人： Jae Seung Lee , Yung-Eun Sung , Tae-Yeol Jeon , Hee-Young Park
CPC分类号： C23C18/08 , B22F1/025 , B22F9/24 , C23C18/1635 , C23C18/1676 , H01M4/90 , H01M4/9083 , H01M4/92 , H01M4/926 , Y10T428/2982 , Y10T428/2991
摘要： The present invention features a method for preparing core-shell nanoparticles supported on carbon. In particular, the present invention features a method for preparing core-shell nanoparticles supported on carbon, including: dispersing core nanoparticle powder supported on carbon in ethanol; adding a metal precursor which forms a shell and hydroquinone thereto; and mixing and reducing the same. Preferably, the disclosed method for preparing core-shell nanoparticles supported on carbon enables coating of transition metal nanoparticles including platinum on the surface of core metal nanoparticles at a monolayer level. Prepared core-shell nanoparticles of the present invention may be useful as catalysts or electrode materials of fuel cells.
摘要翻译： 本发明的特征在于制备负载在碳上的核 - 壳纳米颗粒的方法。 特别地，本发明的特征在于一种制备负载在碳上的核 - 壳纳米粒子的方法，包括：将负载在碳上的核心纳米颗粒粉末分散在乙醇中; 加入形成壳和氢醌的金属前体; 并进行混合和还原。 优选地，所公开的用于制备负载在碳上的核 - 壳纳米粒子的方法使得能够在单层水平上在核心金属纳米颗粒的表面上涂覆包括铂的过渡金属纳米颗粒。 本发明的制备的核 - 壳纳米颗粒可用作燃料电池的催化剂或电极材料。
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9.发明授权Method and apparatus for growing a composite metal sulphide photocatalyst thin film 有权用于生长复合金属硫化物光催化剂薄膜的方法和装置公开(公告)号：US07677198B2
公开(公告)日：2010-03-16
申请号：US11287854
申请日：2005-11-28
CPC分类号： C23C18/02 , B05D5/061 , C23C18/1204 , C23C18/1241 , C23C18/1245 , C23C18/1291 , C23C18/1295 , C23C18/14 , C23C18/1637 , C23C18/1667 , C23C18/1676 , C23C18/168
摘要： A method and apparatus are provided for growing a composite metal sulphide photcatalyst thin film, wherein photochemical deposition and chemical bath deposition are both performed for growing the composite metal sulphide thin film, such as (AgInS2)x/(ZnS)2(1-x), wherein x is 0-1.
摘要翻译： 提供了一种用于生长复合金属硫化物光催化剂薄膜的方法和装置，其中光化学沉积和化学浴沉积都用于生长复合金属硫化物薄膜，例如（AgInS 2）x /（ZnS）2（1-x ），其中x为0-1。
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公开(公告)号：US20070295731A1
公开(公告)日：2007-12-27
申请号：US11899146
申请日：2007-09-04
申请人： Michael Hanson
发明人： Michael Hanson
IPC分类号： A47J27/00
CPC分类号： A47J36/02 , A47J36/025 , C23C18/1676 , C23C18/1806 , C23C18/1844 , C23C18/36
摘要： Electroless-nickel-plated cast iron cookware, wherein a substrate consisting of a skillet, pot, pan or the like, is coated by cleaning and deoxidizing the surface of the cookware substrate, rinsing the substrate, soaking the substrate in a dilute potassium carbonate solution, and applying an electroless nickel coating to the surface of the metal substrate. The nickel-plated cast iron cookware product is also disclosed.
摘要翻译： 通过对炊具基材的表面进行清洗和脱氧，冲洗基材，将基材浸泡在稀碳酸钾溶液中，进行包括由煎锅，锅，锅等组成的基板的无电镀镍铸铁炊具 并且将金属镍涂层施加到金属基板的表面上。 还公开了镀镍铸铁炊具产品。
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