公开(公告)号：US11366381B2

公开(公告)日：2022-06-21

申请号：US16395244

申请日：2019-04-26

申请人： Unimicron Technology Corp.

发明人： Pu-Ju Lin ,  Shih-Lian Cheng ,  Yu-Hua Chen ,  Cheng-Ta Ko ,  Jui-Jung Chien ,  Wei-Tse Ho

IPC分类号： B32B37/00 ,  G03F1/50 ,  H05K3/06 ,  H05K3/24 ,  H05K3/00 ,  H05K3/10 ,  H05K3/12 ,  H05K3/18 ,  H05K3/42 ,  G03F7/20 ,  G01K7/24 ,  G01K15/00

摘要： A mask structure and a manufacturing method of the mask structure are provided. The mask structure includes a transparent substrate, a patterned metal layer, and a plurality of microlens structures. The patterned metal layer is disposed on the transparent substrate and exposing a portion of the transparent substrate. The microlens structures are disposed on the transparent substrate exposed by a portion of the patterned metal layer and being in contact with the portion of the patterned metal layer.

公开(公告)号：US20180070452A1

公开(公告)日：2018-03-08

申请号：US15256757

申请日：2016-09-06

申请人： Unimicron Technology Corp.

发明人： Pu-Ju Lin ,  Shih-Lian Cheng ,  Yu-Hua Chen ,  Cheng-Ta Ko ,  Jui-Jung Chien ,  Wei-Tse Ho

IPC分类号： H05K3/06 ,  H05K3/10 ,  H05K3/42 ,  H05K3/24 ,  G03F7/16 ,  G03F7/20 ,  G03F7/09 ,  G03F7/32 ,  G03F7/40 ,  G03F1/50 ,  G03F1/76

CPC分类号： G03F1/50 ,  G01K7/24 ,  G01K15/007 ,  G03F7/2032 ,  G03F7/2047 ,  H05K3/0023 ,  H05K3/064 ,  H05K3/107 ,  H05K3/1275 ,  H05K3/182 ,  H05K3/241 ,  H05K3/422

摘要： A manufacturing method of a circuit substrate is provided. A substrate is provided. A positive photoresist layer is coated on the substrate. Once exposure process is performed on the positive photoresist layer disposed on the substrate so as to simultaneously form concaves with at least two different depths.

公开(公告)号：US20190250502A1

公开(公告)日：2019-08-15

申请号：US16395244

申请日：2019-04-26

申请人： Unimicron Technology Corp.

发明人： Pu-Ju Lin ,  Shih-Lian Cheng ,  Yu-Hua Chen ,  Cheng-Ta Ko ,  Jui-Jung Chien ,  Wei-Tse Ho

IPC分类号： G03F1/50 ,  G03F7/20 ,  H05K3/42 ,  H05K3/18 ,  H05K3/12 ,  H05K3/10 ,  H05K3/00 ,  G01K15/00 ,  G01K7/24 ,  H05K3/24 ,  H05K3/06

CPC分类号： G03F1/50 ,  G01K7/24 ,  G01K15/007 ,  G03F7/2032 ,  G03F7/2047 ,  H05K3/0023 ,  H05K3/064 ,  H05K3/107 ,  H05K3/1275 ,  H05K3/182 ,  H05K3/241 ,  H05K3/422 ,  Y10T29/49124

摘要： A mask structure and a manufacturing method of the mask structure are provided. The mask structure includes a transparent substrate, a patterned metal layer, and a plurality of microlens structures. The patterned metal layer is disposed on the transparent substrate and exposing a portion of the transparent substrate. The microlens structures are disposed on the transparent substrate exposed by a portion of the patterned metal layer and being in contact with the portion of the patterned metal layer.

公开(公告)号：US10324370B2

公开(公告)日：2019-06-18

申请号：US15256757

申请日：2016-09-06

申请人： Unimicron Technology Corp.

发明人： Pu-Ju Lin ,  Shih-Lian Cheng ,  Yu-Hua Chen ,  Cheng-Ta Ko ,  Jui-Jung Chien ,  Wei-Tse Ho

IPC分类号： H05K3/00 ,  G03F1/50 ,  H05K3/06 ,  H05K3/24 ,  G01K7/24 ,  G01K15/00 ,  H05K3/10 ,  H05K3/12 ,  H05K3/18 ,  H05K3/42 ,  G03F7/20

摘要： A manufacturing method of a circuit substrate is provided. A substrate is provided. A positive photoresist layer is coated on the substrate. Once exposure process is performed on the positive photoresist layer disposed on the substrate so as to simultaneously form concaves with at least two different depths.