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公开(公告)号：US20240355728A1
公开(公告)日：2024-10-24
申请号：US18451263
申请日：2023-08-17
发明人： Kai-Chun Chang , Hsieh-Hung Hsieh , Tzu-Jin Yeh , Ching-Chung Hsu , Chung-Long Chang , Hua-Chou Tseng
IPC分类号： H01L23/522 , H01L23/00 , H01L23/528 , H01L23/532
CPC分类号： H01L23/5227 , H01L23/5283 , H01L23/5286 , H01L23/53219 , H01L23/53233 , H01L24/05 , H01L24/13 , H01L2224/02313 , H01L2224/02331 , H01L2224/0235 , H01L2224/02373 , H01L2224/02375 , H01L2224/02381 , H01L2224/0239 , H01L2224/05548 , H01L2224/05557 , H01L2224/13007 , H01L2924/30107
摘要： A semiconductor structure includes a circuit with a redistribution layer (RDL) formed over the circuit. The redistribution layer comprises a plurality of metal layers. An inductor is formed in a topmost metal layer, and the circuit is located directly under the inductor. An under bump metallization (UBM) layer formed on the topmost metal layer and a conductive connector formed on the UBM layer.
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公开(公告)号：US11646312B2
公开(公告)日：2023-05-09
申请号：US17403732
申请日：2021-08-16
发明人： Chia-Chung Chen , Chi-Feng Huang , Victor Chiang Liang , Fu-Huan Tsai , Hsieh-Hung Hsieh , Tzu-Jin Yeh , Han-Min Tsai , Hong-Lin Chu
IPC分类号： H01L27/088 , H01L21/8234 , H01L29/167 , H01L29/10 , H01L29/423 , H01L29/417 , H03D7/14 , H01L29/66 , H01L29/78 , H01L21/8238
CPC分类号： H01L27/0886 , H01L21/823412 , H01L21/823431 , H01L29/1033 , H01L29/167 , H01L29/41783 , H01L29/42376 , H01L29/66795 , H01L29/785 , H03D7/1441 , H03D7/1458 , H01L21/823807 , H01L21/823821
摘要： A method for manufacturing a semiconductor device includes forming one or more fins extending in a first direction over a substrate. The one or more fins include a first region along the first direction and second regions on both sides of the first region along the first direction. A dopant is implanted in the first region of the fins but not in the second regions. A gate structure overlies the first region of the fins and source/drains are formed on the second regions of the fins.
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公开(公告)号：US10756672B2
公开(公告)日：2020-08-25
申请号：US15950585
申请日：2018-04-11
发明人： Yi-Hsuan Liu , Hsieh-Hung Hsieh , Chewn-Pu Jou , Fu-Lung Hsueh
摘要： A varainductor includes a signal line, a ground plane, and a floating plane over a substrate. The ground plane is disposed on a side of the signal line, and the first floating plane is disposed between the ground plane and the signal line. An array of switches includes at least two switches configured to selectively electrically connect the ground plane to the floating plane.
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公开(公告)号：US09831832B2
公开(公告)日：2017-11-28
申请号：US14700546
申请日：2015-04-30
发明人： Yi-Hsuan Liu , Hsieh-Hung Hsieh , Tzu-Jin Yeh
CPC分类号： H03F1/0205 , H03F1/0261 , H03F1/223 , H03F1/347 , H03F3/193 , H03F2200/117 , H03F2200/168 , H03F2200/18 , H03F2200/294 , H03F2200/451
摘要： A low noise amplifier (LNA) includes a first transistor and a second transistor. A source of the second transistor is connected to a drain of the first transistor. The LNA further includes a feedback transformer. A gate of the first transistor is connected to a primary winding of the feedback transformer and a gate of the second transistor is connected to a secondary winding of the feedback transformer.
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公开(公告)号：US09705466B2
公开(公告)日：2017-07-11
申请号：US14630946
申请日：2015-02-25
发明人： Yen-Jen Chen , Chi-Feng Huang , Hsiao-Chun Lee , Hsieh-Hung Hsieh , Tzu-Jin Yeh
CPC分类号： H03H1/00 , H01L23/585 , H01L23/66 , H01L28/10 , H01L28/40 , H01L2223/6672 , H03H3/00 , H03H7/0115 , H03H2001/0064
摘要： A semiconductor device comprises a guarded circuit. The semiconductor device also comprises a guard ring surrounding the guarded circuit. The semiconductor device further comprises a resonant circuit coupled with the guard ring. The resonant circuit comprises an input node coupled with the guard ring. The resonant circuit also comprises an inductor. The resonant circuit further comprises a capacitor coupled with the inductor. The resonant circuit additionally comprises a ground node configured to carry a ground voltage. The inductor and the capacitor are coupled between the input node and the ground node.
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公开(公告)号：US09098757B2
公开(公告)日：2015-08-04
申请号：US13926596
申请日：2013-06-25
发明人： Tsung-Hsiung Lee , Kuang-Kai Yen , Shi-Hung Wang , Yung-Hsu Chuang , Huan-Neng Chen , Wei-Li Chen , Shih-Hung Lan , Yi-Hsuan Liu , Fan-Ming Kuo , Hsieh-Hung Hsieh , Chewn-Pu Jou , Fu-Lung Hsueh
IPC分类号： G01R31/26 , G06K7/00 , G01R31/265 , G01R31/302
CPC分类号： G06K7/0095 , G01R31/2656 , G01R31/3025
摘要： A semiconductor wafer includes a plurality of dies. Each of the plurality of dies includes a radio frequency identification (RFID) tag circuit and a coil. The RFID tag circuit includes a tag core, an RF front-end circuit, an ID decoder, a comparator and conductive line for a unique ID. The RF front-end circuit is configured to receive electromagnetic signals through the coil in each of the plurality of dies and to convert the received electromagnetic signals into commands. The ID decoder is configured to receive the commands and to generate an expect ID. The comparator is configured to compare the unique ID with the expect ID to generate a comparison result. The comparison result is arranged to decide if the tag core is configured to receive commands.
摘要翻译： 半导体晶片包括多个管芯。 多个管芯中的每一个都包括射频识别（RFID）标签电路和线圈。 RFID标签电路包括标签芯，RF前端电路，ID解码器，用于唯一ID的比较器和导线。 RF前端电路被配置为通过多个管芯中的每一个中的线圈接收电磁信号，并将接收到的电磁信号转换为命令。 ID解码器被配置为接收命令并产生期望ID。 比较器被配置为将唯一ID与期望ID进行比较以产生比较结果。 布置比较结果来确定标签核心是否配置为接收命令。
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公开(公告)号：US20140225676A1
公开(公告)日：2014-08-14
申请号：US14252886
申请日：2014-04-15
发明人： Hsieh-Hung Hsieh , Ming Hsien Tsai , Tzu-Jin Yeh , Chewn-Pu Jou , Fu-Lung Hsueh
IPC分类号： H03L7/06
CPC分类号： G01R31/2824 , H03L5/00
摘要： A device comprises a radio frequency peak detector configured to receive an ac signal from a voltage controlled oscillator and generate a dc value proportional to the ac signal at an output of the radio frequency peak detector and a feedback control unit coupled between an output of the radio frequency peak detector and an input of the voltage controlled oscillator.
摘要翻译： 一种设备包括：射频峰值检测器，被配置为从压控振荡器接收交流信号，并在射频峰值检测器的输出处产生与ac信号成比例的直流值，以及反馈控制单元，其耦合在无线电 频率峰值检测器和压控振荡器的输入。
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公开(公告)号：US11768235B2
公开(公告)日：2023-09-26
申请号：US18151959
申请日：2023-01-09
发明人： Hsieh-Hung Hsieh , Yen-Jen Chen , Tzu-Jin Yeh
IPC分类号： G01R31/28
CPC分类号： G01R31/2884 , G01R31/2853 , G01R31/2879
摘要： An IC includes a plurality of pads at a top surface of a semiconductor wafer, an amplifier configured to receive a first AC signal at an input terminal, and output a second AC signal at an output terminal, a first detection circuit coupled to the input terminal and configured to output a first DC voltage to a first pad of the plurality of pads responsive to the first AC signal, and a second detection circuit coupled to the output terminal and configured to output a second DC voltage to a second pad of the plurality of pads responsive to the second AC signal.
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公开(公告)号：US11555848B2
公开(公告)日：2023-01-17
申请号：US17376338
申请日：2021-07-15
发明人： Hsieh-Hung Hsieh , Yen-Jen Chen , Tzu-Jin Yeh
IPC分类号： G01R31/28
摘要： A test circuit includes an oscillator configured to generate an oscillation signal, a device-under-test (DUT) configured to output an AC signal based on the oscillation signal, a first detection circuit configured to generate a first DC voltage having a first value based on the oscillation signal, and a second detection circuit configured to generate a second DC voltage having a second value based on the AC signal.
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公开(公告)号：US09304164B2
公开(公告)日：2016-04-05
申请号：US13655047
申请日：2012-10-18
发明人： Tsung-Hsiung Li , Kuang-Kai Yen , Yi-Hsuan Liu , Hsieh-Hung Hsieh , Chewn-Pu Jou , Fu-Lung Hsueh
IPC分类号： G01R1/067 , G01R31/20 , G06K7/10 , G01R31/302 , G01R31/3185
CPC分类号： G01R1/06711 , G01R31/2607 , G01R31/28 , G01R31/3025 , G01R31/318511
摘要： A semiconductor wafer includes a plurality of dies and at least one test probe. Each of the plurality of dies includes a radio frequency identification (RFID) tag circuit. The at least one test probe includes a plurality of probe pads. The plurality of probe pads is configured to transmit power signals and data to each of the plurality of dies, and to receive test results from each of the plurality of dies. The data are transmitted to each of the plurality of dies in a serial manner. The test results of each of the plurality of dies are also transmitted to the plurality of probe pads in a serial manner.
摘要翻译： 半导体晶片包括多个管芯和至少一个测试探针。 多个管芯中的每一个都包括射频识别（RFID）标签电路。 所述至少一个测试探针包括多个探针垫。 多个探针焊盘被配置为将功率信号和数据传送到多个管芯中的每一个，并且从多个管芯中的每一个接收测试结果。 以串行方式将数据发送到多个管芯中的每一个。 多个管芯中的每一个的测试结果也以串行方式传输到多个探针焊盘。
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