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公开(公告)号：US12095711B2
公开(公告)日：2024-09-17
申请号：US18190881
申请日：2023-03-27
发明人： Huan-Neng Chen , William Wu Shen , Chewn-Pu Jou , Feng Wei Kuo , Lan-Chou Cho , Tze-Chiang Huang , Jack Liu , Yun-Han Lee
CPC分类号： H04L5/14 , H04W52/0261 , Y02D30/70
摘要： An integrated circuit includes first through fourth devices positioned over one or more substrates, a first radio frequency interconnect (RFI) including a first transmitter included in the first device, a first receiver included in the second device, and a first guided transmission medium coupled to each of the first transmitter and the first receiver, a second RFI including a second transmitter included in the first device, a second receiver included in the third device, and a second guided transmission medium coupled to each of the second transmitter and the second receiver, and a third RFI including a third transmitter included in the first device, a third receiver included in the fourth device, and the second guided transmission medium coupled to each of the third transmitter and the third receiver.
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公开(公告)号：US11824021B2
公开(公告)日：2023-11-21
申请号：US18056264
申请日：2022-11-17
发明人： Huan-Neng Chen , Wen-Shiang Liao
IPC分类号： H01L23/66 , H01L21/48 , H01L23/498 , H01L23/538 , H01L23/00 , H01L25/00 , H01P3/12 , H01L25/18
CPC分类号： H01L23/66 , H01L21/4857 , H01L23/49822 , H01L23/5383 , H01L23/5386 , H01L24/13 , H01L25/50 , H01P3/121 , H01L25/18 , H01L2223/6627 , H01L2223/6677
摘要： A method of manufacturing the semiconductor structure includes: providing a substrate; forming a first conductive via and a second conductive via extending in the substrate; depositing a first dielectric layer over the substrate and the first and second conductive vias; receiving a waveguide; moving the waveguide to a location over the first dielectric layer and aligning the waveguide with a position of the first dielectric layer; attaching the waveguide to the position of the first dielectric layer; forming a first conductive member and a second conductive member over the waveguide, the first conductive member and the second conductive member being in contact with the waveguide; and etching a backside of the substrate to electrically expose the first and second conductive vias. The first conductive member or the second conductive member is electrically connected to the first or second conductive via.
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公开(公告)号：US11764173B2
公开(公告)日：2023-09-19
申请号：US17809903
申请日：2022-06-30
发明人： Huan-Neng Chen , Wen-Shiang Liao
IPC分类号： H01L23/66 , H01L21/48 , H01L23/538 , H01P3/12 , H01L23/498 , H01L23/00 , H01L25/00 , H01L25/18
CPC分类号： H01L23/66 , H01L21/4857 , H01L23/49822 , H01L23/5383 , H01L23/5386 , H01L24/13 , H01L25/50 , H01P3/121 , H01L25/18 , H01L2223/6627 , H01L2223/6677
摘要： A semiconductor structure includes: a substrate; a first dielectric layer over the substrate; a waveguide over the first dielectric layer; a second dielectric layer over the first dielectric layer and laterally surrounding the waveguide; a first conductive member and a second conductive member over the second dielectric layer and the waveguide, the first conductive member and the second conductive member being in contact with the waveguide; a conductive bump on one side of the substrate and electrically connected to the first conductive member or the second conductive member; and a conductive via extending through the substrate and electrically connecting the conductive bump to the first conductive member or the second conductive member. The waveguide is configured to transmit an electromagnetic signal between the first conductive member and the second conductive member.
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公开(公告)号：US20230194908A1
公开(公告)日：2023-06-22
申请号：US18166472
申请日：2023-02-08
发明人： Lan-Chou Cho , Chewn-Pu Jou , Feng-Wei KUO , Huan-Neng Chen , Min-Hsiang Hsu
IPC分类号： G02F1/025
CPC分类号： G02F1/025 , G02F2201/302 , G02F1/0151
摘要： An optical modulator includes a carrier and a waveguide disposed on the carrier. The waveguide includes a first optical coupling region, a second optical coupling region, first regions, and second regions. The first optical coupling region is doped with first dopants. The second optical coupling region abuts the first optical coupling region and is doped with second dopants. The first dopants and the second dopants are of different conductivity type. The first regions are doped with the first dopants and are arrange adjacent to the first optical coupling region. The first regions have respective increasing doping concentrations as distances of the first regions increase from the first optical coupling region. The second regions are doped with the second dopants and are arranged adjacent to the second optical coupling region. The second regions have respective increasing doping concentrations as distances of the second regions increase from the second optical coupling region.
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公开(公告)号：US11508677B2
公开(公告)日：2022-11-22
申请号：US16818826
申请日：2020-03-13
发明人： Huan-Neng Chen , Wen-Shiang Liao
IPC分类号： H01L23/66 , H01L21/48 , H01L23/538 , H01L23/00 , H01P3/12 , H01L23/498 , H01L25/00 , H01L25/18
摘要： A semiconductor structure and a method of forming the same are provided. A method of manufacturing the semiconductor structure includes: providing a substrate; depositing a first dielectric layer over the substrate; attaching a waveguide to the first dielectric layer; depositing a second dielectric layer to laterally surround the waveguide; and forming a first conductive member and a second conductive member over the second dielectric layer and the waveguide, wherein the first conductive member and the second conductive member are in contact with the waveguide. The waveguide is configured to transmit an electromagnetic signal between the first conductive member and the second conductive member.
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公开(公告)号：US20210063777A1
公开(公告)日：2021-03-04
申请号：US17094816
申请日：2020-11-11
发明人： Lan-Chou Cho , Chewn-Pu Jou , Feng-Wei Kuo , Huan-Neng Chen , Min-Hsiang Hsu
IPC分类号： G02F1/025
摘要： An optical modulator includes a dielectric layer and a waveguide. The waveguide is disposed on the dielectric layer. The waveguide includes an electrical coupling portion, a slab portion, and an optical coupling portion. The slab portion is sandwiched between the electrical coupling portion and the optical coupling portion. The slab portion has at least two sub-portions having different heights. A maximum height of the slab portion is smaller than a height of the electrical coupling portion.
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公开(公告)号：US10665380B2
公开(公告)日：2020-05-26
申请号：US16372765
申请日：2019-04-02
发明人： Hsiao-Tsung Yen , Huan-Neng Chen , Yu-Ling Lin , Chin-Wei Kuo , Mei-Show Chen , Ho-Hsiang Chen , Min-Chie Jeng
IPC分类号： H01F27/28 , H01F17/00 , H01L23/522
摘要： A device includes a substrate, and a vertical inductor over the substrate. The vertical inductor includes a plurality of parts formed of metal, wherein each of the parts extends in one of a plurality of planes perpendicular to a major surface of the substrate. Metal lines interconnect neighboring ones of the plurality of parts of the vertical inductor.
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公开(公告)号：US20200083318A1
公开(公告)日：2020-03-12
申请号：US16682381
申请日：2019-11-13
发明人： Chewn-Pu Jou , Chih-Hsin Ko , Po-Wen Chiu , Chao-Ching Cheng , Chun-Chieh Lu , Chi-Feng Huang , Huan-Neng Chen , Fu-Lung Hsueh , Clement Hsingjen Wann
IPC分类号： H01L49/02 , H01L23/528 , H01G4/008 , H01G4/005 , H01L23/522 , H01L23/532
摘要： A capacitor includes a first graphene structure having a first plurality of graphene layers. The capacitor further includes a dielectric layer over the first graphene structure. The capacitor further includes a second graphene structure over the dielectric layer, wherein the second graphene structure has a second plurality of graphene layers.
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公开(公告)号：US10510827B2
公开(公告)日：2019-12-17
申请号：US16100532
申请日：2018-08-10
发明人： Chewn-Pu Jou , Chih-Hsin Ko , Po-Wen Chiu , Chao-Ching Cheng , Chun-Chieh Lu , Chi-Feng Huang , Huan-Neng Chen , Fu-Lung Hsueh , Clement Hsingjen Wann
IPC分类号： H01L23/52 , H01G4/00 , H01L49/02 , H01L23/528 , H01G4/008 , H01G4/005 , H01L23/522 , H01L23/532 , H01L21/768
摘要： A capacitor includes a first graphene structure having a first plurality of graphene layers. The capacitor further includes a dielectric layer over the first graphene structure. The capacitor further includes a second graphene structure over the dielectric layer, wherein the second graphene structure has a second plurality of graphene layers.
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公开(公告)号：US10298277B2
公开(公告)日：2019-05-21
申请号：US15377283
申请日：2016-12-13
发明人： Lan-Chou Cho , Chewn-Pu Jou , Feng Wei Kuo , Huan-Neng Chen , William Wu Shen
摘要： A circuit includes a transmitter associated with a carrier of a radio frequency interconnect, a transmission channel communicatively coupled with the transmitter, and a receiver communicatively coupled with the transmission channel, the receiver also being associated with the carrier of the radio frequency interconnect. A combiner on a transmitter-side of the transmission channel is coupled between the transmitter and the transmission channel, and a decoupler on a receiver-side of the transmission channel is coupled between the receiver and the transmission channel. A channel loss compensation circuit is communicatively coupled between the transmitter and the receiver.
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