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公开(公告)号：US11953730B2
公开(公告)日：2024-04-09
申请号：US17862382
申请日：2022-07-11
Inventor： Feng-Wei Kuo , Wen-Shiang Liao
Abstract: A semiconductor structure including a semiconductor substrate, a first patterned dielectric layer, a grating coupler and a waveguide is provided. The semiconductor substrate includes an optical reflective layer. The first patterned dielectric layer is disposed on the semiconductor substrate and covers a portion of the optical reflective layer. The grating coupler and the waveguide are disposed on the first patterned dielectric layer, wherein the grating coupler and the waveguide are located over the optical reflective layer.
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公开(公告)号：US11953723B2
公开(公告)日：2024-04-09
申请号：US17573623
申请日：2022-01-11
Inventor： Feng-Wei Kuo , Wen-Shiang Liao
CPC classification number: G02B6/12007 , G02B2006/12142 , G02B6/29338 , G02B6/29352 , G02B6/29395
Abstract: A thermally tunable waveguide including an optical waveguide and a heater is provided. The optical waveguide includes a phase shifter. The heater is disposed over the optical waveguide. The heater includes a heating portion, pad portions and tapered portions. The heating portion overlaps with the phase shifter of the optical waveguide. The pad portions are disposed aside of the heating portion. Each of the pad portions is connected to the heating portion through one of the tapered portions respectively.
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公开(公告)号：US11927806B2
公开(公告)日：2024-03-12
申请号：US17308795
申请日：2021-05-05
Inventor： Feng-Wei Kuo , Lan-Chou Cho , Huan-Neng Chen , Chewn-Pu Jou
Abstract: Disclosed is a system and method for communication using an efficient fiber-to-chip grating coupler with a high coupling efficiency. In one embodiment, a method for communication, includes: transmitting optical signals between a semiconductor photonic die on a substrate and an optical fiber array attached to the substrate using at least one corresponding grating coupler on the semiconductor photonic die, wherein the at least one grating coupler each comprises a plurality of coupling gratings, a waveguide, a cladding layer, a first reflection layer and a second reflection layer, wherein the plurality of coupling gratings each comprises at least one step in a first lateral direction and extends in a second lateral direction, wherein the first and second lateral directions are parallel to a surface of the substrate and perpendicular to each other in a grating plane, wherein the first reflection layers are configured such that the plurality of coupling gratings is disposed between the first reflection layer and the cladding layer, wherein the second reflection layer are configured such that the cladding layer is disposed between the second reflection layer and the waveguide.
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公开(公告)号：US11768338B2
公开(公告)日：2023-09-26
申请号：US17332988
申请日：2021-05-27
Inventor： Chung-Ming Weng , Chen-Hua Yu , Chung-Shi Liu , Hao-Yi Tsai , Cheng-Chieh Hsieh , Hung-Yi Kuo , Tsung-Yuan Yu , Hua-Kuei Lin , Yu-Hsiang Hu , Chewn-Pu Jou , Feng-Wei Kuo
CPC classification number: G02B6/4214 , G02B6/12002 , G02B6/12004 , G02B6/136 , G02B6/4203 , G02B6/4204 , G02B6/43 , G02B6/428 , G02B2006/12102 , G02B2006/12104
Abstract: An optical interconnect structure including a base substrate, an optical waveguide, a first reflector, a second reflector, a dielectric layer, a first lens, and a second lens is provided. The optical waveguide is embedded in the base substrate. The optical waveguide includes a first end portion and a second end portion opposite to the first end portion. The first reflector is disposed between the base substrate and the first end portion of the optical waveguide. The second reflector is disposed between the base substrate and the second end portion of the optical waveguide. The dielectric layer covers the base substrate and the optical waveguide. The first lens is disposed on the dielectric layer and located above the first end portion of the optical waveguide. The second lens is disposed on the dielectric layer and located above the second end portion of the optical waveguide.
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公开(公告)号：US20220120968A1
公开(公告)日：2022-04-21
申请号：US17075698
申请日：2020-10-21
Inventor： Feng-Wei Kuo , Chewn-Pu Jou
Abstract: Disclosed are apparatuses for optical coupling and a system for communication. In one embodiment, an apparatus for optical coupling having an optical coupling region is disclosed. The apparatus for optical coupling includes a substrate and a core layer disposed on the substrate. The core layer includes a plurality of holes located in the optical coupling region. An effective refractive index of the core layer gradually decrease from a first end of the optical coupling region to a second end of the optical coupling region.
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Patent Agency Ranking
公开(公告)号：US20240411086A1
公开(公告)日：2024-12-12
申请号：US18329690
申请日：2023-06-06
Inventor： Feng-Wei Kuo
Abstract: A semiconductor structure includes a substrate and a metal layer disposed in the substrate. The semiconductor structure includes a dielectric layer disposed over the metal layer. The semiconductor structure further includes a semiconductor layer disposed over the dielectric layer, where the metal layer extends across the semiconductor layer. The semiconductor layer includes a two-dimensional grating coupler including a plurality of scattering elements disposed in the semiconductor layer and a pair of tapered structures extending laterally from the two-dimensional grating coupler.
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公开(公告)号：US20240369770A1
公开(公告)日：2024-11-07
申请号：US18772421
申请日：2024-07-15
Inventor： Feng-Wei Kuo , Wen-Shiang Liao , Robert Bogdan Staszewski , Jianglin Du
Abstract: Disclosed are apparatuses for optical coupling and a system for communication. In one embodiment, an apparatus for optical coupling including a substrate and a grating coupler is disclosed. The grating coupler is disposed on the substrate and includes a plurality of coupling gratings arranged along a first direction, wherein effective refractive indices of the plurality of coupling gratings gradually decrease along the first direction.
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公开(公告)号：US20240363609A1
公开(公告)日：2024-10-31
申请号：US18767970
申请日：2024-07-09
Inventor： Feng-Wei Kuo , Chewn-Pu Jou
IPC: H01L25/16 , H01L23/00 , H01L31/02 , H01L31/0232 , H01L31/18
CPC classification number: H01L25/167 , H01L24/08 , H01L24/80 , H01L31/02005 , H01L31/02327 , H01L31/1804 , H01L31/1892 , H01L2224/08146 , H01L2224/80001 , H01L2924/12043
Abstract: A method of fabricating a package structure includes forming a photonic die, an electronic die and a gap filling layer. The photonic die includes a dielectric layer, a silicon layer, a reflector structure and connection pads. The silicon layer is disposed on the dielectric layer, wherein the silicon layer includes a grating coupler having a plurality of first trench patterns with a first depth and a plurality of second trench patterns with a second depth, wherein the first depth is different than the second depth. The reflector structure is embedded in the dielectric layer below the grating coupler. The connection pads are disposed over the dielectric layer. The electronic die is disposed on the photonic die, wherein the electronic die includes bonding pads bonded to the connection pads of the photonic die. The gap filling layer is disposed on the photonic die and surrounding the electronic die.
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公开(公告)号：US12027478B2
公开(公告)日：2024-07-02
申请号：US17846596
申请日：2022-06-22
Inventor： Feng-Wei Kuo , Wen-Shiang Liao
IPC: H01L23/66 , H01L21/48 , H01L21/56 , H01L21/683 , H01L23/00 , H01L23/31 , H01L23/538 , H01Q1/52 , H01Q9/04
CPC classification number: H01L23/66 , H01L21/4853 , H01L21/4857 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L23/3128 , H01L23/5383 , H01L23/5386 , H01L23/5389 , H01L24/19 , H01L24/20 , H01Q1/52 , H01Q9/0407 , H01L2221/68372 , H01L2223/6677 , H01L2224/214
Abstract: A method of forming a semiconductor structure includes forming a first redistribution structure including a first conductive pattern. The method further includes placing a die over the first redistribution structure. The method further includes disposing a molding material over the first redistribution structure to surround the die. The method further includes removing a portion of the molding material to form an opening. The method further includes disposing a dielectric material into the opening to form a dielectric member. The method further includes forming a second redistribution structure over the molding material and the dielectric member, wherein the second redistribution structure includes an antenna structure over the dielectric member and electrically connected to the die.
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公开(公告)号：US12007611B2
公开(公告)日：2024-06-11
申请号：US17896089
申请日：2022-08-26
Inventor： Feng-Wei Kuo , Chewn-Pu Jou , Hsing-Kuo Hsia , Chih-Wei Tseng
CPC classification number: G02B6/4215 , G02B6/29328 , G02B6/4206 , G02B6/4274
Abstract: A package structure comprises photonic dies and an interposer structure. Each photonic die includes a dielectric layer and a first grating coupler embedded in the dielectric layer. The interposer structure is disposed below the photonic dies. The interposer structure includes an oxide layer and a second grating coupler embedded in the oxide layer. The photonic dies are optically coupled through the first grating couplers of the photonic dies and the second grating coupler of the interposer structure.
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