公开(公告)号：US09617148B2

公开(公告)日：2017-04-11

申请号：US15176467

申请日：2016-06-08

Applicant: Intel Corporation

Inventor： Qing Ma ,  Johanna M. Swan ,  Min Tao ,  Charles A. Gealer ,  Edward T. Zarbock

IPC: H01L21/00 ,  B81C1/00 ,  H01L23/48 ,  H01L23/00 ,  G01P15/08 ,  B81B7/00 ,  H01L25/065 ,  H01L23/498 ,  H01L23/538

CPC classification number: B81C1/00301 ,  B81B7/007 ,  B81C1/00238 ,  B81C2203/0145 ,  G01P15/0802 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/5384 ,  H01L24/03 ,  H01L25/0652 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/01327 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/014

Abstract: Integration of sensor chips with integrated circuit (IC) chips. At least a first sensor chip including a first sensor is affixed to a first side of an interposer to hermetically seal the first sensor within a first cavity. An IC chip is affixed to a second side of the interposer opposite the first sensor, the IC chip is electrically coupled to the first sensor by a through via in the interposer. In embodiments, the first sensor includes a MEMS device and the IC chip comprises a circuit to amplify a signal from the MEMS device. The interposer may be made of glass, with the first sensor chip and the IC chip flip-chip bonded to the interposer by compression or solder. Lateral interconnect traces provide I/O between the devices on the interposer and/or a PCB upon which the interpose is affixed.

公开(公告)号：US20160133596A1

公开(公告)日：2016-05-12

申请号：US14997919

申请日：2016-01-18

Applicant: Intel Corporation

Inventor： Qing Ma ,  Jun He ,  Patrick Morrow ,  Paul B. Fischer ,  Sridhar Balakrishnan ,  Satish Radhakrishnan ,  Tatyana Andryushchenko ,  Guanghai Xu

IPC: H01L23/00 ,  H01L21/033

CPC classification number: H01L24/19 ,  B23K1/0016 ,  H01L21/0334 ,  H01L24/11 ,  H01L2224/245 ,  H01L2924/01322 ,  H01L2924/14 ,  H05K3/4015 ,  H05K2201/1028 ,  H01L2924/00

Abstract: The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.

Abstract translation: 本主题涉及制造微电子器件的领域。 在至少一个实施例中，本主题涉及形成具有其部分的互连，其在附接到外部设备之后在冷却期间从微电子器件脱粘。 脱粘部分允许互连件弯曲并吸收应力。

公开(公告)号：US09267944B2

公开(公告)日：2016-02-23

申请号：US14594691

申请日：2015-01-12

Applicant: Intel Corporation

Inventor： Yuegang Zhang ,  Andrew Berlin ,  Qing Ma ,  Li-Peng Wang ,  Valluri Rao ,  Mineo Yamakawa

IPC: G01N15/06 ,  G01N33/543 ,  G01N29/24 ,  B82Y15/00 ,  B82Y30/00 ,  G01N29/02 ,  G01N29/036 ,  G01N29/34 ,  G01N33/00 ,  G01N27/12

CPC classification number: G01N33/54373 ,  B82Y15/00 ,  B82Y30/00 ,  G01N27/126 ,  G01N29/022 ,  G01N29/036 ,  G01N29/2437 ,  G01N29/348 ,  G01N33/0031 ,  G01N2291/02466 ,  G01N2291/0255 ,  G01N2291/0256 ,  G01N2291/0426 ,  Y10T436/11 ,  Y10T436/143333 ,  Y10T436/144444 ,  Y10T436/25375

Abstract: Systems and methods for detecting the presence of biomolecules in a sample using biosensors that incorporate resonators which have functionalized surfaces for reacting with target biomolecules. In one embodiment, a device includes a piezoelectric resonator having a functionalized surface configured to react with target molecules, thereby changing the mass and/or charge of the resonator which consequently changes the frequency response of the resonator. The resonator's frequency response after exposure to a sample is compared to a reference, such as the frequency response before exposure to the sample, a stored baseline frequency response or a control resonator's frequency response.

公开(公告)号：US20160043056A1

公开(公告)日：2016-02-11

申请号：US14886452

申请日：2015-10-19

Applicant: INTEL CORPORATION

Inventor： Chia-Pin Chiu ,  Qing Ma ,  Robert L. Sankman ,  Paul B. Fischer ,  Patrick Morrow ,  William J. Lambert ,  Charles A. Gealer ,  Tyler Osborn

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/15 ,  H01L23/538

CPC classification number: H01L25/0655 ,  H01L21/4803 ,  H01L21/561 ,  H01L21/568 ,  H01L23/15 ,  H01L23/3121 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/2499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00

Abstract: A die assembly formed on a thin dielectric sheet is described. In one example, a first and a second die have interconnect areas. A dielectric sheet is over the interconnect areas of the first and the second die. Conductive vias in the dielectric sheet connect with pads of the interconnect areas. A build-up layer over the dielectric sheet includes routing to connect pads of the first die interconnect area to pads of the second die interconnect area through the conductive vias. The dies are mounted to a package substrate through the build-up layers, and a package cover is over the dies, the dielectric sheet, and the build-up layer.

Abstract translation: 描述了形成在薄介电片上的模具组件。 在一个示例中，第一和第二管芯具有互连区域。 电介质片在第一和第二管芯的互连区域之上。 电介质片中的导电孔与连接区的焊盘相连。 电介质片上的堆积层包括通过导电通孔将第一管芯互连区的焊盘连接到第二管芯互连区的焊盘的布线。 模具通过堆积层安装到封装衬底上，并且封装盖在模具，电介质层和堆积层之上。

公开(公告)号：US20150125965A1

公开(公告)日：2015-05-07

申请号：US14594691

申请日：2015-01-12

Applicant: Intel Corporation

Inventor： Yuegang Zhang ,  Andrew Berlin ,  Qing Ma ,  Li-Peng Wang ,  Valluri Rao ,  Mineo Yamakawa

IPC: G01N33/543 ,  G01N29/02 ,  G01N29/24

CPC classification number: G01N33/54373 ,  B82Y15/00 ,  B82Y30/00 ,  G01N27/126 ,  G01N29/022 ,  G01N29/036 ,  G01N29/2437 ,  G01N29/348 ,  G01N33/0031 ,  G01N2291/02466 ,  G01N2291/0255 ,  G01N2291/0256 ,  G01N2291/0426 ,  Y10T436/11 ,  Y10T436/143333 ,  Y10T436/144444 ,  Y10T436/25375

Abstract: Systems and methods for detecting the presence of biomolecules in a sample using biosensors that incorporate resonators which have functionalized surfaces for reacting with target biomolecules. In one embodiment, a device includes a piezoelectric resonator having a functionalized surface configured to react with target molecules, thereby changing the mass and/or charge of the resonator which consequently changes the frequency response of the resonator. The resonator's frequency response after exposure to a sample is compared to a reference, such as the frequency response before exposure to the sample, a stored baseline frequency response or a control resonator's frequency response.

Abstract translation: 使用包含具有功能化表面以与靶生物分子反应的共振器的生物传感器来检测样品中存在生物分子的系统和方法。 在一个实施例中，器件包括压电谐振器，其具有被配置为与靶分子反应的官能化表面，从而改变谐振器的质量和/或电荷，从而改变谐振器的频率响应。 将曝光后的谐振器频率响应与参考值进行比较，例如在暴露于采样之前的频率响应，存储的基准频率响应或控制谐振器的频率响应。

公开(公告)号：US10453635B2

公开(公告)日：2019-10-22

申请号：US15633237

申请日：2017-06-26

Applicant: Intel Corporation

Inventor： Qing Ma ,  Johanna Swan ,  Valluri Rao ,  Feras Eid

IPC: H01Q1/38 ,  H01H59/00 ,  H01Q5/314 ,  H01H50/00

Abstract: An electronic device and methods including a switch formed in a chip package are shown. An electronic device and methods including a switch formed in a polymer based dielectric are shown. Examples of switches shown include microelectromechanical system (MEMS) structures, such as cantilever switches and/or shunt switches.

公开(公告)号：US09793201B2

公开(公告)日：2017-10-17

申请号：US15228329

申请日：2016-08-04

Applicant: Intel Corporation

Inventor： Qing Ma ,  Johanna M. Swan

IPC: H05K5/00 ,  H05K1/00 ,  H05K1/11 ,  H01L23/498 ,  H05K1/03 ,  H05K3/40 ,  H01L21/48 ,  H05K1/18 ,  H01L23/00

CPC classification number: H01L23/49827 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/16 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16238 ,  H01L2224/81192 ,  H01L2924/00013 ,  H01L2924/12042 ,  H05K1/0306 ,  H05K1/181 ,  H05K3/40 ,  H05K2201/10378 ,  Y10T29/49147 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/05099 ,  H01L2224/05599 ,  H01L2924/014 ,  H01L2924/00

Abstract: Embodiments of the present description relate to the field of fabricating microelectronic substrates. The microelectronic substrate may include a trace routing structure disposed between opposing glass layers. The trace routing structure may comprise one or more dielectric layers having conductive traces formed thereon and therethrough. Also disclosed are embodiments of a microelectronic package including a microelectronic device disposed proximate one glass layer of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects.

公开(公告)号：US09461010B2

公开(公告)日：2016-10-04

申请号：US14997919

申请日：2016-01-18

Applicant: Intel Corporation

Inventor： Qing Ma ,  Jun He ,  Patrick Morrow ,  Paul B. Fischer ,  Sridhar Balakrishnan ,  Satish Radhakrishnan ,  Tatyana Andryushchenko ,  Guanghai Xu

IPC: H05K1/03 ,  H01L23/00 ,  B23K1/00 ,  H05K3/40 ,  H01L21/033

CPC classification number: H01L24/19 ,  B23K1/0016 ,  H01L21/0334 ,  H01L24/11 ,  H01L2224/245 ,  H01L2924/01322 ,  H01L2924/14 ,  H05K3/4015 ,  H05K2201/1028 ,  H01L2924/00

Abstract: The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.

公开(公告)号：US09269686B2

公开(公告)日：2016-02-23

申请号：US14132157

申请日：2013-12-18

Applicant: Intel Corporation

Inventor： Qing Ma ,  Jun He ,  Patrick Morrow ,  Paul B. Fischer ,  Sridhar Balakrishnan ,  Satish Radhakrishnan ,  Tatyana T. Adryushchenko ,  Guanghai Xu

IPC: H05K1/03 ,  H01L23/00 ,  B23K1/00 ,  H05K3/40

CPC classification number: H01L24/19 ,  B23K1/0016 ,  H01L21/0334 ,  H01L24/11 ,  H01L2224/245 ,  H01L2924/01322 ,  H01L2924/14 ,  H05K3/4015 ,  H05K2201/1028 ,  H01L2924/00

Abstract: The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.

Abstract translation: 本主题涉及制造微电子器件的领域。 在至少一个实施例中，本主题涉及形成具有其部分的互连，其在附接到外部设备之后在冷却期间从微电子器件脱粘。 脱粘部分允许互连件弯曲并吸收应力。

公开(公告)号：US09001520B2

公开(公告)日：2015-04-07

申请号：US13625406

申请日：2012-09-24

Applicant: Intel Corporation

Inventor： Qing Ma ,  Johanna M. Swan ,  Robert Starkston ,  John S. Guzek ,  Robert L. Sankman ,  Aleksandar Aleksov

IPC: H05K1/18 ,  H01L21/56 ,  H01L23/15 ,  H01L23/538 ,  H01L23/00 ,  H05K3/46 ,  H01L23/498

CPC classification number: H01L23/5386 ,  B32B2457/08 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/09 ,  H01L24/13 ,  H01L24/17 ,  H01L24/19 ,  H01L24/24 ,  H01L24/81 ,  H01L24/82 ,  H01L25/0655 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/08238 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/81192 ,  H01L2224/814 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/8203 ,  H01L2224/821 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/18162 ,  H01L2924/2064 ,  H01L2924/20641 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/185 ,  H05K3/4688 ,  H05K2201/017 ,  H05K2203/1469 ,  Y10T156/1057 ,  H01L2924/014 ,  H01L2924/00

Abstract: Embodiments of the present description relate to the field of fabricating microelectronic structures. The microelectronic structures may include a glass routing structure formed separately from a trace routing structure, wherein the glass routing structure is incorporated with the trace routing substrate, either in a laminated or embedded configuration. Also disclosed are embodiments of a microelectronic package including at least one microelectronic device disposed proximate to the glass routing structure of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects. Further, disclosed are embodiments of a microelectronic structure including at least one microelectronic device embedded within a microelectronic encapsulant having a glass routing structure attached to the microelectronic encapsulant and a trace routing structure formed on the glass routing structure.

Abstract translation: 本说明书的实施例涉及制造微电子结构的领域。 微电子结构可以包括与轨迹路由结构分开形成的玻璃布线结构，其中玻璃布线结构以层叠或嵌入的形式结合到迹线布线基板中。 还公开了微电子封装的实施例，其包括设置在微电子衬底的玻璃布线结构附近并通过多个互连与微电子衬底耦合的至少一个微电子器件。 此外，公开了微电子结构的实施例，其包括嵌入微电子密封剂内的至少一个微电子器件，该微电子器件具有连接到微电子密封剂的玻璃布线结构和形成在玻璃布线结构上的迹线布线结构。