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    Coaxial connector
    4.
    发明授权
    Coaxial connector 有权

    公开(公告)号：US12100920B2

    公开(公告)日：2024-09-24

    申请号：US17787176

    申请日：2020-12-18

    Applicant: Zomedica Biotechnologies LLC

    Inventor： Kevin Thomas McCarron ,  Rick Morton ,  Christopher Jennings Madsen

    IPC: H01R24/50 ,  G01N29/02 ,  G01N29/32 ,  H01R103/00

    CPC classification number: H01R24/50 ,  G01N29/022 ,  G01N29/32 ,  G01N2291/022 ,  G01N2291/0426 ,  H01R2103/00 ,  H01R2201/20

    Abstract: A connector assembly and method of attaching the same to one or more biosensor module boards. The connector assembly includes a body portion defining a first surface and a second surface opposite the first surface. The connector assembly also includes a coaxial RF connector positioned in the body portion and extending between the first surface and the second surface. The coaxial RF connector includes a ground ring, an RF pin positioned within the ground ring, and dielectric therebetween. The connector assembly is configured to be coupled to an RF detection board such that the coaxial RF connector is operably coupled thereto. The connector assembly is also configured to be connected to a biosensor module board such that the coaxial RF connector is operably connected thereto.

    ACOUSTIC RESONATOR DEVICE
    6.
    发明公开
    ACOUSTIC RESONATOR DEVICE 审中-公开

    公开(公告)号：US20240226889A1

    公开(公告)日：2024-07-11

    申请号：US18612611

    申请日：2024-03-21

    Applicant: Qorvo US, Inc.

    Inventor： Rio Rivas ,  Kevin McCarron ,  Matthew Wasilik ,  David Doerr

    IPC: B01L3/00 ,  G01N29/02 ,  G01N29/24

    CPC classification number: B01L3/50273 ,  G01N29/022 ,  G01N29/2462 ,  B01L2400/0436 ,  G01N2291/0426

    Abstract: Methods of fabricating a bulk acoustic wave resonator structure for a fluidic device. The methods can include a first step of disposing a first conductive material over a portion of a first surface of a substrate to form at least a portion of a first electrode, the substrate having a second surface opposite the first surface. Then, a piezoelectric material may be disposed over the first electrode. Next, a second conductive material can be disposed over the piezoelectric material to form at least a portion of a second electrode. The second conductive material extends substantially parallel to the first surface of the substrate and the second conductive material at least partially extends over the first conductive material. The overlapping region of the first conductive material, the piezoelectric material, and the second conductive material form a bulk acoustic wave resonator, the bulk acoustic wave resonator having a first side and an opposing second side. An acoustic energy management structure is then disposed over a first side of the bulk acoustic wave resonator. Next a third conductive material is disposed over a portion of the second conductive material that extends beyond the bulk acoustic wave resonator, wherein the third conductive material forms an interconnect extending above the acoustic energy management structure in a direction substantially perpendicular to the first surface of the substrate. Finally a portion of the second surface of the substrate is removed to expose a chemical mechanical connection at the first electrode at a second side of the bulk wave acoustic resonator. Devices formed thereby are also included.

    Acoustic resonator device
    7.
    发明授权
    Acoustic resonator device 有权

    公开(公告)号：US11964276B2

    公开(公告)日：2024-04-23

    申请号：US17749002

    申请日：2022-05-19

    Applicant: Qorvo US, Inc.

    Inventor： Rio Rivas ,  Kevin McCarron ,  Matthew Wasilik ,  David Doerr

    IPC: B01L3/00 ,  G01N29/02 ,  G01N29/24

    CPC classification number: B01L3/50273 ,  G01N29/022 ,  G01N29/2462 ,  B01L2400/0436 ,  G01N2291/0426

    Abstract: Methods of fabricating a bulk acoustic wave resonator structure for a fluidic device. The methods can include a first step of disposing a first conductive material over a portion of a first surface of a substrate to form at least a portion of a first electrode, the substrate having a second surface opposite the first surface. Then, a piezoelectric material may be disposed over the first electrode. Next, a second conductive material can be disposed over the piezoelectric material to form at least a portion of a second electrode. The second conductive material extends substantially parallel to the first surface of the substrate and the second conductive material at least partially extends over the first conductive material. The overlapping region of the first conductive material, the piezoelectric material, and the second conductive material form a bulk acoustic wave resonator, the bulk acoustic wave resonator having a first side and an opposing second side. An acoustic energy management structure is then disposed over a first side of the bulk acoustic wave resonator. Next a third conductive material is disposed over a portion of the second conductive material that extends beyond the bulk acoustic wave resonator, wherein the third conductive material forms an interconnect extending above the acoustic energy management structure in a direction substantially perpendicular to the first surface of the substrate. Finally a portion of the second surface of the substrate is removed to expose a chemical mechanical connection at the first electrode at a second side of the bulk wave acoustic resonator. Devices formed thereby are also included.

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