HEATED WELL PLATE
    3.
    发明公开
    HEATED WELL PLATE 审中-公开

    公开(公告)号:US20240181461A1

    公开(公告)日:2024-06-06

    申请号:US18550717

    申请日:2022-03-17

    IPC分类号: B01L7/00

    摘要: A well plate includes a body including a plurality of well walls and an outer wall. A glass plate is disposed below the plurality of well walls so as to form a bottom of each of a plurality of wells defined by the plurality of well walls. A plurality of electrical heat trace wires are disposed on the glass plate. A plurality of contacts are disposed proximate an exterior surface of the body. A plurality of conductors connect the plurality of contacts to the plurality of heat trace wires.

    Heat pump device and assembly
    9.
    发明授权

    公开(公告)号:US11892205B2

    公开(公告)日:2024-02-06

    申请号:US17989938

    申请日:2022-11-18

    摘要: A heat pump that includes a thermoelectric device(s) and a heat sink having a raised portion with a top surface for thermally coupling with a planar face of the thermoelectric device(s). The raised portion of the heat sink includes an outer periphery and a raised central region surrounded by a void region to provide more uniform thermal conductivity when clamped within an assembly. The raised central region is shaped in an any shape corresponding to a shape of uneven thermal conductivity due to clamping pressure applied to the heat sink. The void region can be substantially contiguous and entirely circumscribe the central raised region. The device can optionally include discrete supports formed of a less thermally-conductive material within the void region. The supports can be elastomeric, such as O-rings, and disposed within pockets defined within the void region.