知搜-全球专利检索

  1. 登录
  2. 注册

搜索结果

11 条记录 (耗时 0.017 秒)

    HEAT PUMP DEVICE AND ASSEMBLY
    3.
    发明申请
    HEAT PUMP DEVICE AND ASSEMBLY 审中-公开

    公开(公告)号：US20200224936A1

    公开(公告)日：2020-07-16

    申请号：US16733155

    申请日：2020-01-02

    申请人： Bio-Rad Laboratories, Inc.

    发明人： Amir Sadri ,  Nenad Kircanski ,  Thanh-Vi Tran ,  Carl Marlowe ,  Brian David Wilson

    IPC分类号： F25B21/04 ,  H01L35/02 ,  H01L35/28

    摘要： A heat pump that includes a thermoelectric device(s) and a heat sink having a raised portion with a top surface for thermally coupling with a planar face of the thermoelectric device(s). The raised portion of the heat sink includes an outer periphery and a raised central region surrounded by a void region to provide more uniform thermal conductivity when clamped within an assembly. The raised central region is shaped in an any shape corresponding to a shape of uneven thermal conductivity due to clamping pressure applied to the heat sink. The void region can be substantially contiguous and entirely circumscribe the central raised region. The device can optionally include discrete supports formed of a less thermally-conductive material within the void region. The supports can be elastomeric, such as O-rings, and disposed within pockets defined within the void region.

    Heat pump device and assembly
    7.
    发明授权
    Heat pump device and assembly 有权

    公开(公告)号：US11892205B2

    公开(公告)日：2024-02-06

    申请号：US17989938

    申请日：2022-11-18

    申请人： Bio-Rad Laboratories, Inc.

    发明人： Amir Sadri ,  Nenad Kircanski ,  Thanh-Vi Tran ,  Carl Marlowe ,  Brian David Wilson

    IPC分类号： F25B21/04 ,  B01L7/00 ,  H10N10/10 ,  H10N10/80

    CPC分类号： F25B21/04 ,  B01L7/00 ,  B01L7/52 ,  H10N10/10 ,  H10N10/80 ,  B01L2300/08 ,  B01L2300/123 ,  B01L2300/1805

    摘要： A heat pump that includes a thermoelectric device(s) and a heat sink having a raised portion with a top surface for thermally coupling with a planar face of the thermoelectric device(s). The raised portion of the heat sink includes an outer periphery and a raised central region surrounded by a void region to provide more uniform thermal conductivity when clamped within an assembly. The raised central region is shaped in an any shape corresponding to a shape of uneven thermal conductivity due to clamping pressure applied to the heat sink. The void region can be substantially contiguous and entirely circumscribe the central raised region. The device can optionally include discrete supports formed of a less thermally-conductive material within the void region. The supports can be elastomeric, such as O-rings, and disposed within pockets defined within the void region.

    Heat pump device and assembly
    8.
    发明授权
    Heat pump device and assembly 有权

    公开(公告)号：US11549731B2

    公开(公告)日：2023-01-10

    申请号：US16733155

    申请日：2020-01-02

    申请人： Bio-Rad Laboratories, Inc.

    发明人： Amir Sadri ,  Nenad Kircanski ,  Thanh-Vi Tran ,  Carl Marlowe ,  Brian David Wilson

    IPC分类号： F25B21/04 ,  H01L35/28 ,  H01L35/02 ,  B01L7/00

    摘要： A heat pump that includes a thermoelectric device(s) and a heat sink having a raised portion with a top surface for thermally coupling with a planar face of the thermoelectric device(s). The raised portion of the heat sink includes an outer periphery and a raised central region surrounded by a void region to provide more uniform thermal conductivity when clamped within an assembly. The raised central region is shaped in an any shape corresponding to a shape of uneven thermal conductivity due to clamping pressure applied to the heat sink. The void region can be substantially contiguous and entirely circumscribe the central raised region. The device can optionally include discrete supports formed of a less thermally-conductive material within the void region. The supports can be elastomeric, such as O-rings, and disposed within pockets defined within the void region.

    Thermal management for thermal cyclers using air tubes
    9.
    发明授权
    Thermal management for thermal cyclers using air tubes 有权

    公开(公告)号：US11375612B2

    公开(公告)日：2022-06-28

    申请号：US17102027

    申请日：2020-11-23

    申请人： BIO-RAD LABORATORIES, INC.

    发明人： Amir Sadri ,  Neven Nikolic ,  Gabriel Culinco ,  Thanh-Vi Tran ,  Nenad Kircanski

    IPC分类号： H05K1/02 ,  H05K7/20

    摘要： A thermal management system that include an electronic circuit boards having at least two circuit boards with a space in between and further includes one or more air tubes or conduits. The electronic circuit board and air tubes are configured for drawing air into the space to facilitate cooling of the electronic circuit board concurrent with cooling of a heat sink of a heat pump connected with the electronic circuit board. The system can further include a partition to isolate airflow from the heat sink from airflow through the electronics circuit board, and can further include one or more interface components for maintaining isolation and control of air flow, improving air intake and/or supporting auxiliary components.