公开(公告)号：US12082332B2

公开(公告)日：2024-09-03

申请号：US17131166

申请日：2020-12-22

Applicant: Intel Corporation

Inventor： Juha Paavola ,  Sami Heinisuo ,  Kari Mansukoski

IPC: H05K7/20 ,  G06F1/20 ,  H05K1/02

CPC classification number: H05K1/0201 ,  H05K7/20163 ,  H05K7/2039 ,  G06F1/203

Abstract: thermal management systems having signal transfer routing for use with electronic devices are disclosed. An electronic device includes a housing to house a first electronic component and a second electronic component. A circuit board is positioned inside the housing. The circuit board including a first signal path to communicatively couple a processor carried by the circuit board and the first electronic component. A thermally conductive structure is positioned adjacent the circuit board. The thermally conductive structure is to dissipate heat generated by the processor. The thermally conductive structure is to carry at least a portion of a second signal path to communicatively couple the processor and the second electronic component.

公开(公告)号：US12062906B2

公开(公告)日：2024-08-13

申请号：US17285337

申请日：2019-10-12

Applicant: HITACHI ENERGY LTD

Inventor： Fredrik Alfredsson ,  Jimmy Kjellsson ,  Ryan Mackenzie ,  Mårten Olsson ,  Anders Döragrip

IPC: H05K7/20 ,  H02H7/26 ,  H05K7/14

CPC classification number: H02H7/26 ,  H05K7/1424 ,  H05K7/20163 ,  H05K7/20563

Abstract: The present disclosure relates to an IED configured for use as a protection relay in an electric power system. The IED comprises a plurality of cassettes connected to a backplane, with at least two cassettes mounted adjacent each other. Each of the cassettes comprises a housing profile in the form of a rectangular tube having an envelope wall of a heat conducting material, and at least one electronic card arranged in a card slot within the tube formed by the housing profile, which at least one card is electrically connected to the backplane. Adjacent cassettes are separated a distance such that air canals are formed between their respective housing profiles.

公开(公告)号：US12028962B2

公开(公告)日：2024-07-02

申请号：US17819716

申请日：2022-08-15

Applicant: Micron Technology, Inc.

Inventor： Xiaopeng Qu ,  Hyunsuk Chun

IPC: H05K1/02 ,  H01L23/467 ,  H01L23/473 ,  H01R12/71 ,  H01R12/72 ,  H01R12/73 ,  H05K7/20 ,  H05K3/36

CPC classification number: H05K1/0203 ,  H01L23/473 ,  H01R12/724 ,  H05K7/20145 ,  H01L23/467 ,  H01R12/716 ,  H01R12/737 ,  H05K7/20163 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20327 ,  H05K7/205

Abstract: A semiconductor component system includes a motherboard and a cooling system mounted to the motherboard. The cooling system includes sidewalls projecting from the motherboard. A sub-motherboard extends between the sidewalls and is spaced apart from the motherboard. The sidewalls and the sub-motherboard define a cooling channel over the motherboard. A connector is attached to the sub-motherboard and is configured to receive a semiconductor device daughterboard. The connector has contacts to electrically couple the semiconductor device daughterboard to the sub-motherboard.

公开(公告)号：US12022633B2

公开(公告)日：2024-06-25

申请号：US17011437

申请日：2020-09-03

Applicant: NVIDIA CORPORATION

Inventor： David Haley ,  Xiang Sun ,  Gabriele Gorla ,  Andrew Bell ,  Boris Landwehr

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20145 ,  G06F1/20 ,  H05K7/20163 ,  H05K7/20172

Abstract: A graphics subsystem includes a printed circuit board (PCB), a blower, and a heat sink. A graphics processing unit (GPU) is integrated into the PCB. The PCB is shortened to occupy a portion of the width of the graphics subsystem. The heat sink is coupled to the PCB and/or GPU similarly occupies just a portion of the width of the graphics subsystem. The blower is disposed adjacent to the PCB and heat sink and configured to occupy the full height of the graphics subsystem. The blower is further configured to intake air from both the top side of the graphics subsystem and the bottom side of the graphics subsystem. In this configuration, the blower provides an elevated air flow rate in order to facilitate cooling of the PCB and/or GPU.

公开(公告)号：US12016123B2

公开(公告)日：2024-06-18

申请号：US16889041

申请日：2020-06-01

Applicant: Apple Inc.

Inventor： Brett W. Degner ,  Michael E. Leclerc ,  Eric R. Prather ,  Scott J. Campbell ,  James M. Cuseo ,  Rodrigo Dutervil Mubarak ,  Ian A. Guy ,  Daniel D. Hershey ,  Mariel L. Lanas ,  Michael D. McBroom ,  David C. Parell ,  Bartley K. Andre ,  Danny L. McBroom ,  Houtan R. Farahani

IPC: H05K1/14 ,  H05K5/02 ,  H05K7/14 ,  H05K7/20

CPC classification number: H05K1/141 ,  H05K5/0273 ,  H05K5/0295 ,  H05K7/1405 ,  H05K7/1409 ,  H05K7/20163 ,  H05K7/20172 ,  H05K7/20209

Abstract: Computer modules that can have a high-capacity, can simplify the design of a computer system housing the modules, can utilize system resources in a highly configurable manner, can provide a variety of functionality, and can be readily inserted into, and removed from, a computer system.

公开(公告)号：US11956916B2

公开(公告)日：2024-04-09

申请号：US17720668

申请日：2022-04-14

Applicant: BULL SAS

Inventor： Sakthivel Mohanasundaram ,  Mohanakumara Prakasha

IPC: H05K7/14 ,  G06F1/20 ,  H05K5/02 ,  H05K7/20

CPC classification number: H05K7/1487 ,  G06F1/20 ,  H05K5/0221 ,  H05K7/1407 ,  H05K7/1489 ,  H05K7/1492 ,  H05K7/20136 ,  H05K7/20145 ,  H05K7/20163

Abstract: A computing unit configured to be mounted in a HPC cabinet, the computing unit comprising an external body, and an internal body comprising secondary electronic components. The internal body is releasably coupled with the external body in order to allow extraction of the internal body when the external body is secured fixedly to the HPC cabinet. The internal body includes a bottom tray, comprising bottom secondary electronic components, a top tray comprising at least one duct for conducting an air flow from the front to the rear, and a plurality of manual coupling members, accessible from the top of the top tray, releasably coupling the top tray with the bottom tray.

公开(公告)号：US11917791B2

公开(公告)日：2024-02-27

申请号：US17287299

申请日：2019-10-16

Applicant: Valeo Systemes Thermiques

Inventor： Ismaël Franco ,  Mickaia Rabenja ,  Johan Kaes

IPC: H05K7/20 ,  H02K9/06 ,  H02K9/22 ,  H02K5/20 ,  H02K11/33

CPC classification number: H05K7/20163 ,  H02K5/207 ,  H02K9/06 ,  H02K9/227 ,  H05K7/20863 ,  H02K11/33

Abstract: The invention relates to a heat dissipation device comprising a support (10) and a heat sink (12) designed to be cooled by an air flow passing through the sink (12), the support (10) having a first housing inside which the sink (10) is held, the support (10) being further configured to accommodate an electronic control module (2) designed to be cooled by the sink (12).

公开(公告)号：US11903157B2

公开(公告)日：2024-02-13

申请号：US16282997

申请日：2019-02-22

Applicant: Illinois Tool Works Inc.

Inventor： Ming-Cheng Lin

IPC: H05K7/12 ,  H05K5/02 ,  H05K7/20

CPC classification number: H05K7/12 ,  H05K5/0286 ,  H05K7/20163

Abstract: A reusable holding component is provided. The reusable holding component may comprise a frame with a fastener receiving opening extending from a first surface of the frame to a second surface of the frame, and at least one pin disposed on and extending away from the second surface of the frame, wherein the at least one pin includes at least two elongated segments with hooks disposed on a head portion of each of the at least two elongated segments. A heat transfer device and an electronic device with a heatsink are also provided.

公开(公告)号：US20230422431A1

公开(公告)日：2023-12-28

申请号：US18243407

申请日：2023-09-07

Applicant: Manufacturing Resources International, Inc.

Inventor： William Dunn ,  Tim Hubbard

IPC: H05K7/20 ,  G02F1/1333

CPC classification number: H05K7/202 ,  G02F1/133385 ,  H05K7/20972 ,  H05K7/20136 ,  H05K7/20163 ,  F28D9/00

Abstract: An electronic display assembly includes an electronic display located within a housing. A first airflow pathway fluidly connected to an ambient environment extends through at least a portion of the housing. A second airflow pathway, separated from the first airflow pathway, forms a closed loop within the housing. Some or all electronic components for operating the electronic display assembly are located within the second airflow pathway, such as to at least partially isolate such electronics from dust or other containments in ambient air.

公开(公告)号：US11856734B2

公开(公告)日：2023-12-26

申请号：US18012350

申请日：2021-07-07

Applicant: Continental Automotive Technologies GmbH

Inventor： Jean-Philippe Bekaert ,  Gilles Le Roy

IPC: H05K7/20

CPC classification number: H05K7/20509 ,  H05K7/20163 ,  H05K7/20172 ,  H05K7/20454 ,  H05K7/20863 ,  H05K7/20854

Abstract: A set of electronic package elements intended to be mounted on an electronic board having a component to be cooled including: a chassis, a heatsink fixed by a retaining piece inside the chassis, a cover configured to be fixed on the chassis so as to retain the electronic board in the package. The heatsink is configured to be fixed on the electronic board while maintaining a predetermined distance between a lower face of the heatsink and the component. The cover is configured to be able to be fixed by a fixing point to the heatsink. The retaining piece is connected to the heatsink so as to allow the heatsink a translational movement relative to the chassis in three orthogonal directions.