公开(公告)号：US11917791B2

公开(公告)日：2024-02-27

申请号：US17287299

申请日：2019-10-16

Applicant: Valeo Systemes Thermiques

Inventor： Ismaël Franco ,  Mickaia Rabenja ,  Johan Kaes

IPC: H05K7/20 ,  H02K9/06 ,  H02K9/22 ,  H02K5/20 ,  H02K11/33

CPC classification number: H05K7/20163 ,  H02K5/207 ,  H02K9/06 ,  H02K9/227 ,  H05K7/20863 ,  H02K11/33

Abstract: The invention relates to a heat dissipation device comprising a support (10) and a heat sink (12) designed to be cooled by an air flow passing through the sink (12), the support (10) having a first housing inside which the sink (10) is held, the support (10) being further configured to accommodate an electronic control module (2) designed to be cooled by the sink (12).

公开(公告)号：US20210360819A1

公开(公告)日：2021-11-18

申请号：US17287299

申请日：2019-10-16

Applicant: Valeo Systemes Thermiques

Inventor： Ismaël Franco ,  Mickaia Rabenja ,  Johan Kaes

IPC: H05K7/20

Abstract: The invention relates to a heat dissipation device comprising a support (10) and a heat sink (12) designed to be cooled by an air flow passing through the sink (12), the support (10) having a first housing inside which the sink (10) is held, the support (10) being further configured to accommodate an electronic control module (2) designed to be cooled by the sink (12).