公开(公告)号：US20250003695A1

公开(公告)日：2025-01-02

申请号：US18345597

申请日：2023-06-30

Applicant: Intel Corporation

Inventor： Juha Paavola ,  Kari Mansukoski ,  Sami Heinisuo

IPC: F28D15/04 ,  F28D15/02

Abstract: Techniques are disclosed for manufacturing a heat pipe that includes a variable wall thickness and/or a variable diameter. The heat pipe may be formed by subjecting a pipe to a thickness processing and an expansion processing. The heat pipe may include a first portion and a second portion. The first portion may have a first diameter and a first wall thickness. The second portion may have a second diameter larger than the first diameter, and a second wall thickness larger than the first wall thickness.

公开(公告)号：US20210051796A1

公开(公告)日：2021-02-18

申请号：US17088135

申请日：2020-11-03

Applicant: Intel Corporation

Inventor： Sami Heinisuo ,  Paul Gohlke ,  Kari Mansukoski

IPC: H05K1/02 ,  H05K3/46

Abstract: Embodiments of the present disclosure are directed to a substrate with a plurality of layers including a top layer, one or more intermediate layers and a bottom layer. Ferromagnetic material applied to a first of the one or more intermediate layers in an area underneath a magnetic source disposed on an outer surface of the top layer, where the ferromagnetic material is to provide a shield for signal routing traces in one or more other intermediate layers or the bottom layer underneath the first intermediate layer, from a magnetic field produced by the magnetic source. Other embodiments may be described and/or claimed.

公开(公告)号：US12082332B2

公开(公告)日：2024-09-03

申请号：US17131166

申请日：2020-12-22

Applicant: Intel Corporation

Inventor： Juha Paavola ,  Sami Heinisuo ,  Kari Mansukoski

IPC: H05K7/20 ,  G06F1/20 ,  H05K1/02

CPC classification number: H05K1/0201 ,  H05K7/20163 ,  H05K7/2039 ,  G06F1/203

Abstract: thermal management systems having signal transfer routing for use with electronic devices are disclosed. An electronic device includes a housing to house a first electronic component and a second electronic component. A circuit board is positioned inside the housing. The circuit board including a first signal path to communicatively couple a processor carried by the circuit board and the first electronic component. A thermally conductive structure is positioned adjacent the circuit board. The thermally conductive structure is to dissipate heat generated by the processor. The thermally conductive structure is to carry at least a portion of a second signal path to communicatively couple the processor and the second electronic component.

公开(公告)号：US20240292539A1

公开(公告)日：2024-08-29

申请号：US18113414

申请日：2023-02-23

Applicant: Intel Corporation

Inventor： Juha Paavola ,  Justin M Huttula ,  Sami Heinisuo ,  Kari Mansukoski

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K1/141 ,  H05K3/368 ,  H05K2201/10378

Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device includes a standoff interposer between an overlapping portion of a first circuit board and a second circuit board. In selected examples, electronic devices and methods described show one or more conductive pathways within a standoff interposer that provide electrical communication between circuit boards, such as data signals, power delivery, etc.

公开(公告)号：US20210112654A1

公开(公告)日：2021-04-15

申请号：US17131166

申请日：2020-12-22

Applicant: Intel Corporation

Inventor： Juha Paavola ,  Sami Heinisuo ,  Kari Mansukoski

IPC: H05K1/02 ,  H05K7/20

Abstract: thermal management systems having signal transfer routing for use with electronic devices are disclosed. An electronic device includes a housing to house a first electronic component and a second electronic component. A circuit board is positioned inside the housing. The circuit board including a first signal path to communicatively couple a processor carried by the circuit board and the first electronic component. A thermally conductive structure is positioned adjacent the circuit board. The thermally conductive structure is to dissipate heat generated by the processor. The thermally conductive structure is to carry at least a portion of a second signal path to communicatively couple the processor and the second electronic component.