公开(公告)号：US09617148B2

公开(公告)日：2017-04-11

申请号：US15176467

申请日：2016-06-08

Applicant: Intel Corporation

Inventor： Qing Ma ,  Johanna M. Swan ,  Min Tao ,  Charles A. Gealer ,  Edward T. Zarbock

IPC: H01L21/00 ,  B81C1/00 ,  H01L23/48 ,  H01L23/00 ,  G01P15/08 ,  B81B7/00 ,  H01L25/065 ,  H01L23/498 ,  H01L23/538

CPC classification number: B81C1/00301 ,  B81B7/007 ,  B81C1/00238 ,  B81C2203/0145 ,  G01P15/0802 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/5384 ,  H01L24/03 ,  H01L25/0652 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/01327 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/014

Abstract: Integration of sensor chips with integrated circuit (IC) chips. At least a first sensor chip including a first sensor is affixed to a first side of an interposer to hermetically seal the first sensor within a first cavity. An IC chip is affixed to a second side of the interposer opposite the first sensor, the IC chip is electrically coupled to the first sensor by a through via in the interposer. In embodiments, the first sensor includes a MEMS device and the IC chip comprises a circuit to amplify a signal from the MEMS device. The interposer may be made of glass, with the first sensor chip and the IC chip flip-chip bonded to the interposer by compression or solder. Lateral interconnect traces provide I/O between the devices on the interposer and/or a PCB upon which the interpose is affixed.