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1.发明申请公开(公告)号：US20150380765A1
公开(公告)日：2015-12-31
申请号：US14764776
申请日：2013-03-15
Applicant: HITACHI, LTD.
Inventor： Tadashi FUJIEDA , Jun KAWAJI , Takuya AOYAGI , Yusuke ASARI , Takashi NAITO , Hirotsugu TAKIZAWA , Yamato HAYAHI , Yuya NAKATANI
IPC: H01M10/0562 , H01M10/0525
CPC classification number: H01M10/0562 , H01M10/052 , H01M10/0525 , H01M10/054 , H01M2300/0068 , H01M2300/0071
Abstract: To provide both resistance to reduction and high ion conductivity, a solid electrolyte includes a crystal having a structure expressed as A4-2x-y-zBxSn3-yMyO8-zNz (1≦4−2x−y−z
Abstract translation: 为了提供抗还原性和高离子传导性，固体电解质包括具有表示为A4-2x-y-zBxSn3-yMyO8-zNz（1＆nlE; 4-2x-y-z <4，A：Li， Na，B：Mg，Ca，Sr，Ba，M：V，Nb，Ta，N：F，Cl）或具有表示为A2-1.5x-0.5y-0.5zBxSn3-yMyO8-zNz 0.5＆nlE; 2-1.5x-0.5y-0.5z <2，A：Mg，Ca，B：Sc，Y，Sb，Si，M：V，Nb，Ta，N：F，Cl）。
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2.发明申请Structure, Electronic Element Module, Heat Exchanger, Fuel Rod, and Fuel Assembly 有权结构，电子元件模块，换热器，燃料棒和燃料组件公开(公告)号：US20150318062A1
公开(公告)日：2015-11-05
申请号：US14646223
申请日：2012-11-21
Applicant: HITACHI, LTD.
Inventor： Ryou ISHIBASHI , Takashi NAITOU , Motomune KODAMA , Takuya AOYAGI , Tetsushi HINO , Motoo AOYAMA , Tsuneyuki HASHIMOTO , Katsuhito TAKAHASHI , Junichi SAKANO , Hiroshi NAKANO
CPC classification number: G21C3/34 , C03C8/14 , C03C8/18 , C03C8/24 , C04B37/025 , C04B2237/10 , C04B2237/365 , C04B2237/38 , C04B2237/403 , C04B2237/405 , C04B2237/407 , C04B2237/765 , C04B2237/84 , F28D7/16 , F28F19/02 , F28F21/006 , F28F21/04 , F28F2255/06 , G21C3/07 , G21C3/20 , H01L23/15 , H01L23/3735 , H01L23/473 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49109 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H05K1/0306 , H05K1/18 , H05K7/20509 , Y02E30/40 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: Provided is a structure including a first member (2); a second member (3) disposed opposite to the first member (2); and a glass layer (4) disposed between the first member (2) and the second member (3) so as to bond the first member (2) and the second member (3). A glass transition point of the glass layer (4) is lower than a temperature of the glass layer (4) under operation. In the glass layer (4), at least either of ceramic and metallic particles 4b, 4c is dispersed. In a temperature region lower than the glass transition point of the glass layer (4), a thermal expansion coefficient thereof falls in between thermal expansion coefficients of the first member (2) and the second member (3). This allows thermal strain caused within the structure (1) to be reduced when the structure (1) is operated at a higher temperature than a room temperature.
Abstract translation: 提供包括第一构件（2）的结构; 与所述第一构件（2）相对设置的第二构件（3）; 以及设置在所述第一构件（2）和所述第二构件（3）之间以便结合所述第一构件（2）和所述第二构件（3）的玻璃层（4）。 玻璃层（4）的玻璃化转变点低于在使用中的玻璃层（4）的温度。 在玻璃层（4）中，陶瓷和金属颗粒4b，4c中的至少任一个被分散。 在比玻璃层（4）的玻璃化转变点低的温度区域中，其热膨胀系数落在第一部件（2）和第二部件（3）的热膨胀系数之间。 这使得当结构（1）在比室温更高的温度下操作时，允许在结构（1）内引起的热应变减小。
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公开(公告)号：US20230143193A1
公开(公告)日：2023-05-11
申请号：US17915409
申请日：2020-10-07
Applicant: HITACHI, LTD.
Inventor： Takuya AOYAGI , Hiroshi KANEMOTO , Tomio IWASAKI , Toshinori KAWAMURA , Hitoshi SUZUKI
Abstract: The preset invention has as its object the provision of a laminate free of hexavalent chromium and excellent in corrosion resistance and wear resistance, and a manufacturing process of the laminate. To solve the above-described problems, a laminate according to the present invention includes a substrate, and a laminated film portion with metal films laminated in two or more layers. The laminate has an interface layer between each two adjacent ones of the metal films. The laminated film portion contains a first metal element as a principal component, the first metal element being at least one element of Ni, Cr, Co, and W, and a second metal element that is a metal element of smaller cohesive energy than that of the first metal element. The second metal element contained in the interface layer is at a content ratio higher than that of the second metal element contained in each of the adjacent metal films.
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公开(公告)号：US20160257610A1
公开(公告)日：2016-09-08
申请号：US15033167
申请日：2013-12-04
Applicant: HITACHI, LTD.
Inventor： Motomune KODAMA , Masanori MIYAGI , Takuya AOYAGI , Takashi NAITO
IPC: C03C17/04 , C03C3/12 , C03C8/24 , B32B38/00 , B32B7/14 , B32B17/06 , C03C17/00 , B32B37/14 , C03C3/21 , B32B1/02
CPC classification number: C03C17/04 , B32B1/02 , B32B7/14 , B32B17/06 , B32B37/14 , B32B38/0008 , B32B2250/02 , B32B2255/20 , B32B2307/304 , B32B2307/412 , B32B2419/00 , B32B2439/40 , B32B2457/00 , B32B2605/00 , C03C3/122 , C03C3/21 , C03C8/02 , C03C8/08 , C03C8/18 , C03C8/24 , C03C17/003 , C03C17/007 , C03C17/008 , C03C27/06 , C03C2217/218 , C03C2217/23 , C03C2218/32 , E06B3/66 , E06B3/6612 , E06B3/66357 , Y02B80/22 , Y02B80/24
Abstract: A sealed structural body has an internal space and is made of glass, wherein at least a part of a boundary between the internal space of the sealed structural body and the outside is separated by a sealing material containing a metal material and a lead-free oxide glass. The lead-free oxide glass contains at least one of element Ag or P, Te, and V.
Abstract translation: 密封结构体具有内部空间并由玻璃制成，其中密封结构体的内部空间与外部之间的边界的至少一部分由包含金属材料和无铅氧化物的密封材料分开 玻璃。 无铅氧化物玻璃含有元素Ag或P，Te和V中的至少一种。
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公开(公告)号：US20140287227A1
公开(公告)日：2014-09-25
申请号：US14178847
申请日：2014-02-12
Applicant: HITACHI, LTD.
Inventor： Motomune KODAMA , Takashi NAITO , Tadashi FUJIEDA , Yuichi SAWAI , Takuya AOYAGI , Masanori MIYAGI
CPC classification number: H01L24/29 , C04B35/645 , C04B37/026 , C04B2237/10 , C04B2237/12 , C04B2237/125 , C04B2237/343 , C04B2237/365 , C04B2237/366 , C04B2237/368 , C04B2237/407 , C04B2237/55 , C04B2237/708 , C04B2237/72 , C04B2237/86 , H01L24/27 , H01L24/32 , H01L24/83 , H01L2224/2731 , H01L2224/29082 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/29118 , H01L2224/29124 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29169 , H01L2224/29209 , H01L2224/29211 , H01L2224/29213 , H01L2224/29218 , H01L2224/29224 , H01L2224/29239 , H01L2224/29244 , H01L2224/29247 , H01L2224/29269 , H01L2224/29288 , H01L2224/29294 , H01L2224/29309 , H01L2224/29311 , H01L2224/29313 , H01L2224/29318 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29369 , H01L2224/32013 , H01L2224/32225 , H01L2224/32245 , H01L2224/32505 , H01L2224/83055 , H01L2224/83075 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83203 , H01L2224/83487 , H01L2224/83801 , H01L2224/8384 , H01L2924/15788 , H01L2924/351 , Y10T428/265 , H01L2924/00014 , H01L2924/05432 , H01L2924/01047 , H01L2924/00012 , H01L2924/00
Abstract: Disclosed is a jointed body wherein multiple base members are jointed to each other through a jointing layer, and at least one of the base members is a base member of a ceramic material, semiconductor or glass. The joint material layer contains a metal and an oxide. The oxide contains V and Te, and is present between the metal and the base members. Disclosed is also a joint material in the form of a paste containing an oxide glass containing V and Te, metal particles, and a solvent; in the form of a foil piece or plate in which particles of an oxide glass containing V and Te are embedded; or in the form of a foil piece or plate containing a layer of an oxide glass containing V and Te, and a layer of a metal.
Abstract translation: 公开了一种接合体，其中多个基底构件通过接合层彼此接合，并且至少一个基底构件是陶瓷材料，半导体或玻璃的基底构件。 接合材料层含有金属和氧化物。 氧化物含有V和Te，并且存在于金属和基体之间。 还公开了含有含有V和Te，金属颗粒和溶剂的氧化物玻璃的糊状物的接合材料; 以包含V和Te的氧化物玻璃的颗粒嵌入的箔片或板的形式; 或以包含含有V和Te的氧化物玻璃层和金属层的箔片或板的形式。
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Patent Agency Ranking
公开(公告)号：US20200239355A1
公开(公告)日：2020-07-30
申请号：US15754972
申请日：2016-08-05
Applicant: HITACHI, LTD.
Inventor： Takashi NAITO , Takuya AOYAGI , Tatsuya MIYAKE , Shin IMAMURA , Hiroki KANEKO
Abstract: The purpose of the present invention is to provide a neutron-absorbing material which has high neutron absorption performance, is less apt to suffer structural degradation caused by irradiation with neutrons or γ rays, and has satisfactory water resistance. The glass composition according to the present invention is characterized by containing Gd2O3, B2O3, CeO2, and Bi2O3 when the components are expressed in terms of oxide, the total amount of Gd2O3 and B2O3 being 65 mol % or greater in terms of oxide amount.
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公开(公告)号：US20170236768A1
公开(公告)日：2017-08-17
申请号：US15501374
申请日：2015-09-09
Applicant: HITACHI, LTD.
Inventor： Takashi NAITO , Motomune KODAMA , Takuya AOYAGI , Shigeru KIKUCHI , Takashi NOGAWA , Mutsuhiro MORI , Eiichi IDE , Toshiaki MORITA , Akitoyo KONNO , Taigo ONODERA , Tatsuya MIYAKE , Akihiko MIYAUCHI
IPC: H01L23/373 , H01L23/00 , C03C8/02 , C03C8/24 , C03C8/08
CPC classification number: H01L23/3733 , C03C3/122 , C03C3/125 , C03C3/21 , C03C8/02 , C03C8/08 , C03C8/18 , C03C8/24 , C09J1/00 , C09J11/04 , H01L21/52 , H01L23/3731 , H01L23/3735 , H01L24/29 , H01L25/07 , H01L25/18 , H01L2224/29211 , H01L2224/29224 , H01L2224/29239 , H01L2224/29247 , H01L2224/29287 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014
Abstract: A heat-dissipating structure is formed by bonding a first member and a second member, each being any of a metal, ceramic, and semiconductor, via a die bonding member; or a semiconductor module formed by bonding a semiconductor chip, a metal wire, a ceramic insulating substrate, and a heat-dissipating base substrate including metal, with a die bonding member interposed between each. At least one of the die bonding members includes a lead-free low-melting-point glass composition and metal particles. The lead-free low-melting-point glass composition accounts for 78 mol % or more in terms of the total of the oxides V2O5, TeO2, and Ag2O serving as main ingredients. The content of each of TeO2 and Ag2O is 1 to 2 times the content of V2O5, and at least one of BaO, WO3, and P2O5 is included as accessory ingredients, and at least one of Y2O3, La2O3, and Al2O3 is included as additional ingredients.
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公开(公告)号：US20180354843A1
公开(公告)日：2018-12-13
申请号：US16068759
申请日：2017-01-11
Applicant: HITACHI, LTD.
Inventor： Takashi NAITO , Takuya AOYAGI , Tatsuya MIYAKE , Takeshi KONDO , Hiroki KANEKO , Kazutaka OKAMOTO
IPC: C03C8/24 , C03C3/12 , C03C3/21 , C03C14/00 , C03C8/16 , C03C8/18 , C03C27/06 , C03C17/04 , C03C17/00
CPC classification number: C03C8/24 , C03C3/12 , C03C3/122 , C03C3/125 , C03C3/21 , C03C8/02 , C03C8/16 , C03C8/18 , C03C8/20 , C03C14/004 , C03C17/007 , C03C17/04 , C03C27/06 , C03C2205/00 , C03C2218/11 , H01J9/02 , H01J9/24 , H01J11/22 , H01J11/48 , H01L23/02 , H01L23/10 , H01L31/0224 , H01L31/022425 , H01L51/50 , H01L51/5246 , H01L2224/16225 , H01L2924/16152 , H03H9/10 , H05B33/04 , H05B33/26
Abstract: The purpose of the present invention is to provide a lead-free glass composition in which crystallization is suppressed and which has a low softening point. This lead-free glass composition is characterized by containing silver oxide, tellurium oxide and vanadium oxide, and further containing at least one compound selected from among yttrium oxide, lanthanum oxide, cerium oxide, erbium oxide, ytterbium oxide, aluminum oxide, gallium oxide, indium oxide, iron oxide, tungsten oxide and molybdenum oxide as an additional component, and in that the content values (mol %) of silver oxide, tellurium oxide and vanadium oxide satisfy the relationships Ag2O>TeO2≥V2O5 and Ag5O≤2V2O5 when calculated in terms of the oxides, and in that the content of TeO2 is 25-37 mol. %.
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公开(公告)号：US20180244561A1
公开(公告)日：2018-08-30
申请号：US15755947
申请日：2016-07-11
Applicant: HITACHI, LTD.
Inventor： Takuya AOYAGI , Takashi NAITO , Tatsuya MIYAKE
CPC classification number: C03C8/24 , B23K35/3601 , B23K35/3613 , B32B7/02 , B32B7/12 , B32B2250/03 , B32B2264/0214 , B32B2264/105 , B32B2264/107 , B32B2307/30 , B32B2405/00 , C03C3/122 , C03C3/14 , C03C3/21 , C03C8/02 , C03C8/04 , C03C8/08
Abstract: The purpose of the present invention is to provide a joining material that can easily join materials to be joined even when characteristics and physical properties thereof differ greatly. To solve the above problem, the joining material according to the present invention is characterized by including a base material, a first layer that is disposed on one surface of the base material, and a second layer that is disposed on the other surface of the base material and includes a phase having a different coefficient of thermal expansion to that of the phase configuring the first layer, at least one of the first and second layers including glass having a softening point of 600° C. or lower.
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公开(公告)号：US20160005671A1
公开(公告)日：2016-01-07
申请号：US14769231
申请日：2013-02-22
Applicant: HITACHI, LTD.
Inventor： Nobutake TSUYUNO , Hiroshi HOZOJI , Takashi NAITO , Motomune KODAMA , Masanori MIYAGI , Takuya AOYAGI
CPC classification number: H01L23/291 , H01L23/053 , H01L23/24 , H01L23/3107 , H01L23/564 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/072 , H01L25/16 , H01L2224/37124 , H01L2224/40095 , H01L2224/40225 , H01L2224/45014 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/4903 , H01L2224/73265 , H01L2224/83801 , H01L2224/8384 , H01L2224/8389 , H01L2224/84801 , H01L2224/8484 , H01L2224/8485 , H01L2224/8489 , H01L2224/8592 , H01L2924/15747 , H01L2924/181 , H01L2924/19105 , H01L2924/19106 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: The present invention is intended to increase the moisture resistance of a resin-sealed electronic control device. The resin-sealed electronic control device includes: a semiconductor chip; a chip capacitor; a chip resistor; a bonding member; a substrate; a case; a heat radiating plate; a glass coating; and a first sealing material. The glass coating directly covers the electronic circuit formed by the element group including: the semiconductor chip; the chip capacitor; and the chip resistor, the bonding member and the substrate, and is sealed by the first sealing material. By being water impermeable, the glass coating prevents water absorption in the vicinity of the element group, and can prevent an increase in the leak current of the semiconductor chip due to water absorption, and an insulation performance drop such as lowered insulation resistance caused by migration within the element group.
Abstract translation: 本发明旨在提高树脂密封电子控制装置的耐湿性。 树脂密封电子控制装置包括：半导体芯片; 片式电容器; 芯片电阻; 接合部件; 底物; 一个案例; 散热板; 玻璃涂层; 和第一密封材料。 玻璃涂层直接覆盖由元件组成的电子电路，包括：半导体芯片; 片式电容器; 芯片电阻，接合部件和基板，并由第一密封材料密封。 通过不透水，玻璃涂层防止元件组附近的吸水，并且可以防止由于吸水引起的半导体芯片的泄漏电流的增加，以及由迁移引起的绝缘电阻降低等绝缘性能下降 在元素组内。
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