公开(公告)号：US09833855B2

公开(公告)日：2017-12-05

申请号：US14772913

申请日：2014-03-17

申请人： MITSUBISHI MATERIALS CORPORATION

发明人： Nobuyuki Terasaki ,  Yoshiyuki Nagatomo

IPC分类号： B23K31/02 ,  B23K1/00 ,  H01L23/373 ,  C04B37/02 ,  B23K1/19 ,  B23K35/28 ,  B23K35/30 ,  B23K35/36 ,  C22C21/08 ,  H01L21/48 ,  H01L23/473 ,  B23K103/00 ,  B23K103/10 ,  B23K103/12 ,  B23K103/18

CPC分类号： B23K1/0006 ,  B23K1/0016 ,  B23K1/19 ,  B23K35/286 ,  B23K35/302 ,  B23K35/3611 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/18 ,  B23K2103/52 ,  C04B37/026 ,  C04B2237/122 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/128 ,  C04B2237/366 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/72 ,  C04B2237/74 ,  C22C21/08 ,  H01L21/4857 ,  H01L21/4871 ,  H01L23/3735 ,  H01L23/473 ,  H01L2224/32225

摘要： A method for manufacturing a power module substrate includes a first lamination step of laminating a ceramic substrate and a copper sheet through an active metal material and a filler metal having a melting point of 660° C. or lower on one surface side of the ceramic substrate; a second lamination step of laminating the ceramic substrate and an aluminum sheet through a bonding material on the other surface side of the ceramic substrate; and a heating treatment step of heating the ceramic substrate, the copper sheet, and the aluminum sheet laminated together, and the ceramic substrate and the copper sheet, and the ceramic sheet and the aluminum sheet are bonded at the same time.

公开(公告)号：US09807865B2

公开(公告)日：2017-10-31

申请号：US14772155

申请日：2014-03-24

申请人： MITSUBISHI MATERIALS CORPORATION

发明人： Yoshiyuki Nagatomo ,  Nobuyuki Terasaki ,  Yoshirou Kuromitsu

IPC分类号： H01L23/52 ,  H01L21/44 ,  H05K1/02 ,  H01L25/07 ,  H01L25/18 ,  H01L23/373 ,  H05K1/09 ,  H05K1/18 ,  H01L23/36 ,  H01L23/40 ,  H01L23/473

CPC分类号： H05K1/0203 ,  B23K1/0016 ,  B23K1/19 ,  B23K20/023 ,  B23K2101/40 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/18 ,  C04B35/645 ,  C04B37/021 ,  C04B37/026 ,  C04B2235/6562 ,  C04B2235/6581 ,  C04B2237/121 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/127 ,  C04B2237/128 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/708 ,  C04B2237/86 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/4006 ,  H01L23/473 ,  H01L25/07 ,  H01L25/18 ,  H01L2224/32225 ,  H01L2924/13055 ,  H05K1/09 ,  H05K1/181 ,  H05K2201/066 ,  H01L2924/00

摘要： The present invention provides a power module substrate including an insulating substrate, a circuit layer which is formed on one surface of the insulating substrate, and a metal layer which is formed on the other surface of the insulating substrate, in which the circuit layer has a first aluminum layer made of aluminum or an aluminum alloy which is bonded to the insulating substrate and a first copper layer made of copper or a copper alloy which is bonded to the first aluminum layer by solid-phase diffusion, the metal layer has a second aluminum layer made of aluminum or an aluminum alloy, and a relationship between a thickness t1 of the circuit layer and a thickness t2 of the second aluminum layer of the metal layer satisfy t1

公开(公告)号：US20170276280A1

公开(公告)日：2017-09-28

申请号：US15465659

申请日：2017-03-22

申请人： NGK INSULATORS, LTD.

发明人： Yoshimasa KOBAYASHI ,  Kisuke YAMAMOTO ,  Yunie IZUMI ,  Takashi NORO

IPC分类号： F16L41/02 ,  C04B37/02

CPC分类号： F16L41/02 ,  C04B37/025 ,  C04B37/026 ,  C04B2237/062 ,  C04B2237/064 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/365 ,  C04B2237/402 ,  C04B2237/406 ,  C04B2237/58 ,  C04B2237/708 ,  C04B2237/72

摘要： A joined body 10 includes a ceramic body 12, a metal member 14, and a joint portion 15 that joins the ceramic body 12 and the metal member 14 together. The joint portion 15 includes a first joint layer 16 joined to the ceramic body 12 and a second joint layer 18 joined to the metal member 14. The first joint layer 16 is disposed on the ceramic body 12 side and contains an alloy that contains Fe and Cr as main components, and a compound having a thermal expansion coefficient of 4.0×10−6 (/° C.) or lower is dispersed in the first joint layer 16. The second joint layer 18 is disposed on the metal member 14 side, contains an alloy that contains Fe and Cr as main components, and has a larger thermal expansion coefficient than the first joint layer 16.

公开(公告)号：US20170053852A1

公开(公告)日：2017-02-23

申请号：US15306559

申请日：2015-04-24

申请人： MITSUBISHI MATERIALS CORPORATION

发明人： Sotaro Oi ,  Tomoya Oohiraki

IPC分类号： H01L23/373 ,  H01L23/00 ,  H01L23/367 ,  H01L23/498

CPC分类号： H01L23/3736 ,  C04B35/645 ,  C04B37/021 ,  C04B37/026 ,  C04B2237/121 ,  C04B2237/128 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/66 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/708 ,  C04B2237/86 ,  H01L23/3675 ,  H01L23/3731 ,  H01L23/3735 ,  H01L23/4334 ,  H01L23/473 ,  H01L23/562 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/29117 ,  H01L2224/32225 ,  H01L2224/32501 ,  H01L2224/83424 ,  H01L2224/83801 ,  H01L2924/0002 ,  H05K1/02 ,  H05K1/0203 ,  H05K1/0306 ,  H05K3/0061 ,  H01L2924/00 ,  H01L2924/01082 ,  H01L2924/01051 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01049

摘要： A power-module substrate unit having at least one power-module substrate including one ceramic substrate, a circuit layer formed on one surface of the ceramic substrate, and a metal layer formed on another surface of the ceramic substrate, and a heat sink on which the metal layer of the power-module substrate is bonded, in which the metal layer is made of an aluminum plate having purity of 99.99 mass % or higher; the heat sink is made of an aluminum plate having purity of 99.90 mass % or lower; and the circuit layer has a stacking structure of a first layer made of an aluminum plate having the purity of 99.99 mass % or higher and being bonded to the ceramic substrate and a second layer made of the aluminum plate having the purity lower than 99.90 mass % and being bonded on a surface of the first layer.

摘要翻译： 一种功率模块基板单元，具有至少一个功率模块基板，其包括一个陶瓷基板，形成在所述陶瓷基板的一个表面上的电路层，以及形成在所述陶瓷基板的另一个表面上的金属层，以及散热器， 键合功率模块基板的金属层，其中金属层由纯度为99.99质量％以上的铝板制成; 散热器由纯度为99.90质量％以下的铝板制成， 电路层具有由纯度为99.99质量％以上的铝板制成的第一层与陶瓷基板接合的第一层和由纯度低于99.90质量％的铝板制成的第二层的堆叠结构， 并且被结合在第一层的表面上。

公开(公告)号：US20160375593A1

公开(公告)日：2016-12-29

申请号：US14545834

申请日：2015-06-26

申请人： Richard Adams ,  James Sorensen

发明人： Richard Adams ,  James Sorensen

IPC分类号： B26B9/00 ,  B32B15/20 ,  B32B15/14 ,  B32B3/26 ,  B32B5/26 ,  B32B18/00

CPC分类号： B26B9/00 ,  B22F2998/10 ,  B22F2999/00 ,  B32B3/10 ,  B32B3/266 ,  B32B5/02 ,  B32B5/142 ,  B32B5/26 ,  B32B7/02 ,  B32B15/14 ,  B32B15/20 ,  B32B18/00 ,  B32B2260/021 ,  B32B2260/023 ,  B32B2260/04 ,  B32B2262/105 ,  B32B2307/50 ,  B32B2307/546 ,  B32B2307/72 ,  B32B2307/732 ,  C04B37/02 ,  C04B2237/36 ,  C04B2237/363 ,  C04B2237/38 ,  C04B2237/40 ,  C04B2237/402 ,  C04B2237/62 ,  C22C47/20 ,  B22F7/08 ,  B22F2003/247 ,  B22F2005/002 ,  B22F2207/01 ,  B22F2207/17

摘要： A composite knife made from layers of Metal Matrix Composite (MMC) is disclosed. It includes a middle layer of fibrous preform including a hard insert placed longitudinally at its periphery. The hard insert, after sharpening, represents the cutting blade portion of the composite knife. The composite knife further includes a carrier which forms the load bearing member of the cutting blade, as well as forming the integral handle of the composite knife. The carrier portion of the composite knife includes at least one top and at least one bottom layers of fibrous preform, sandwiching the middle layer that contains the cutting edge portion of the knife. A metallic material is infiltrated within the fibrous preforms and extends throughout the composite blade structure forming the MMC knife, the metallic material bonding the middle layer within the carrier, and bonding the top and bottom surface of the hard insert within the carrier.

摘要翻译： 公开了由金属基复合材料（MMC）层制成的复合刀。 它包括纤维预型体的中间层，其包括在其周边纵向放置的硬嵌件。 磨刀后的硬质刀片代表复合刀的刀片部分。 复合刀还包括形成切割刀片的承载构件的载体，以及形成复合刀的整体手柄。 复合刀的承载部分包括纤维预制件的至少一个顶部和至少一个底层，夹着包含刀的切割边缘部分的中间层。 金属材料渗透在纤维预成型件内并延伸穿过形成MMC刀的复合刀片结构，金属材料将中间层粘合在载体内，并将硬质插入物的顶表面和底表面粘结在载体内。

公开(公告)号：US20160303762A1

公开(公告)日：2016-10-20

申请号：US15100775

申请日：2014-12-05

申请人： Voxeljet AG

发明人： Daniel Günther

IPC分类号： B28B7/46 ,  B29C67/00 ,  B33Y70/00 ,  B33Y80/00 ,  B28B1/00 ,  C04B41/45 ,  B28B7/44 ,  B28B11/04 ,  B33Y40/00 ,  B22F3/10 ,  B23K31/02 ,  B33Y10/00 ,  B28B11/24

CPC分类号： B28B7/465 ,  B22F3/10 ,  B23K31/02 ,  B28B1/001 ,  B28B7/44 ,  B28B11/04 ,  B28B11/045 ,  B28B11/048 ,  B28B11/24 ,  B29C64/165 ,  B29K2105/251 ,  B33Y10/00 ,  B33Y40/00 ,  B33Y70/00 ,  B33Y80/00 ,  C04B37/026 ,  C04B41/4545 ,  C04B2237/12 ,  C04B2237/121 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/366 ,  C04B2237/402 ,  C04B2237/407

摘要： The invention relates to a method for producing three-dimensional molded parts in two method steps and infiltrating the molded part, as well as a material system.

摘要翻译： 本发明涉及一种用于在两个方法步骤中制造三维模制部件并渗透模制件以及材料系统的方法。

公开(公告)号：US09453289B2

公开(公告)日：2016-09-27

申请号：US13085405

申请日：2011-04-12

申请人： Klint Aaron Rose ,  Joshua D. Kuntz ,  Marcus Worsley

发明人： Klint Aaron Rose ,  Joshua D. Kuntz ,  Marcus Worsley

IPC分类号： C25D13/02 ,  C25D13/20 ,  C25D13/22

CPC分类号： C25D13/02 ,  B33Y10/00 ,  C04B37/001 ,  C04B37/025 ,  C04B2235/5296 ,  C04B2235/775 ,  C04B2235/787 ,  C04B2235/9653 ,  C04B2237/083 ,  C04B2237/32 ,  C04B2237/402 ,  C25D13/12 ,  C25D13/20 ,  C25D13/22 ,  Y10T428/12458 ,  Y10T428/24802 ,  Y10T428/24992 ,  Y10T428/252

摘要： A ceramic, metal, or cermet according to one embodiment includes a first layer having a gradient in composition, microstructure and/or density in an x-y plane oriented parallel to a plane of deposition of the first layer. A ceramic according to another embodiment includes a plurality of layers comprising particles of a non-cubic material, wherein each layer is characterized by the particles of the non-cubic material being aligned in a common direction. Additional products and methods are also disclosed.

摘要翻译： 根据一个实施方案的陶瓷，金属或金属陶瓷包括在平行于第一层的沉积平面取向的x-y平面中具有组成，微结构和/或密度梯度的第一层。 根据另一实施例的陶瓷包括包含非立方体材料颗粒的多个层，其中每个层的特征在于非共轭体材料的颗粒在共同方向上对齐。 还公开了其它产品和方法。

公开(公告)号：US09434028B2

公开(公告)日：2016-09-06

申请号：US14301425

申请日：2014-06-11

申请人： FUJI ELECTRIC CO., LTD.

发明人： Akira Iso

IPC分类号： B23K1/20 ,  B23K35/12 ,  B23K35/38 ,  C04B37/00 ,  C04B37/02 ,  H01L23/373 ,  H01L21/48 ,  H01L23/057 ,  H01L23/00 ,  H01L25/07

CPC分类号： B23K35/383 ,  C04B37/006 ,  C04B37/026 ,  C04B2235/652 ,  C04B2237/12 ,  C04B2237/121 ,  C04B2237/123 ,  C04B2237/124 ,  C04B2237/36 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/55 ,  C04B2237/72 ,  H01L21/4882 ,  H01L23/057 ,  H01L23/3735 ,  H01L23/3736 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Provided is a soldering method through nickel plating layer to reduce void occurrence rate and a method of manufacturing semiconductor device by using the soldering method. By heating a copper base plate having a nickel plating layer at a temperature range of 300° C. to 400° C. in an inert gas atmosphere beforehand, void occurrence rate can be reduced in soldering the copper base plate to an insulating circuit board.

摘要翻译： 提供了通过镍镀层的焊接方法来降低空穴发生率，以及通过使用焊接方法制造半导体器件的方法。 通过在惰性气体气氛中预先在300℃〜400℃的温度范围内加热具有镀镍层的铜基板，在将铜基板焊接到绝缘电路基板上时，可以减少空穴发生率。

公开(公告)号：US20160219693A1

公开(公告)日：2016-07-28

申请号：US14655488

申请日：2013-12-20

申请人： MITSUBISHI MATERIALS CORPORATION

发明人： Shuji Nishimoto ,  Yoshiyuki Nagatomo

IPC分类号： H05K1/02 ,  H05K3/46 ,  H05K1/09 ,  H05K7/14 ,  H05K1/03

CPC分类号： H05K1/0271 ,  C04B37/021 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/86 ,  H01L23/3735 ,  H01L23/42 ,  H01L23/473 ,  H01L2224/32225 ,  H05K1/0203 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/0061 ,  H05K3/248 ,  H05K3/32 ,  H05K3/465 ,  H05K7/14 ,  H05K2201/066 ,  H05K2201/09136

摘要： A power module substrate includes an insulating layer, a circuit layer that is formed on a first surface of the insulating layer, and a metal layer that is formed on a second surface of the insulating layer, in which a first base layer is laminated on a surface of the metal layer on the opposite side of the surface to which the insulating layer is provided, and the first base layer has: a first glass layer that is formed at the interface with the metal layer; and a first Ag layer that is laminated on the first glass layer.

摘要翻译： 功率模块基板包括绝缘层，形成在绝缘层的第一表面上的电路层和形成在绝缘层的第二表面上的金属层，其中第一基层层压在绝缘层上 在设置有绝缘层的表面的相反侧的金属层的表面，第一基底层具有：与金属层的界面形成的第一玻璃层; 以及层叠在第一玻璃层上的第一Ag层。

公开(公告)号：US20160099163A1

公开(公告)日：2016-04-07

申请号：US14870115

申请日：2015-09-30

申请人： NGK SPARK PLUG CO., LTD.

发明人： Takakuni NASU ,  Tomonori NIWA ,  Taichi KIBE

IPC分类号： H01L21/683 ,  B32B37/00 ,  G03F7/40 ,  H01L21/687

CPC分类号： G03F7/40 ,  B32B18/00 ,  B32B2457/14 ,  C04B37/021 ,  C04B37/028 ,  C04B2237/127 ,  C04B2237/343 ,  C04B2237/402 ,  C04B2237/62 ,  C04B2237/64 ,  C04B2237/66 ,  C04B2237/706 ,  H01L21/67103 ,  H01L21/6831 ,  H01L21/68757

摘要： A method of making a semiconductor manufacturing equipment component, such as an electrostatic chuck, includes an application step of applying a photosensitive metal paste onto a ceramic green sheet, which is to become the body substrate, the photosensitive metal paste being a heating element material; an exposure-and-development step of exposing the photosensitive metal paste, which has been applied onto the ceramic green sheet, to light and developing the photosensitive metal paste to form an intermediate heating element, which is to become the heating element, on the ceramic green sheet; and a firing step of co-firing the ceramic green sheet and the intermediate heating element to form the body substrate and the heating element.

摘要翻译： 一种制造半导体制造设备部件如静电卡盘的方法包括将感光金属浆料施加到作为主体基板的陶瓷生片上的施加步骤，感光金属膏是加热元件材料; 曝光和显影步骤，其将施加到陶瓷生片上的感光金属膏曝光，以使感光性金属膏发光并显影，以形成在陶瓷上成为加热元件的中间加热元件 绿色板材 以及烧结陶瓷生片和中间加热元件以形成主体基板和加热元件的烧制步骤。