公开(公告)号：US20160099163A1

公开(公告)日：2016-04-07

申请号：US14870115

申请日：2015-09-30

申请人： NGK SPARK PLUG CO., LTD.

发明人： Takakuni NASU ,  Tomonori NIWA ,  Taichi KIBE

IPC分类号： H01L21/683 ,  B32B37/00 ,  G03F7/40 ,  H01L21/687

CPC分类号： G03F7/40 ,  B32B18/00 ,  B32B2457/14 ,  C04B37/021 ,  C04B37/028 ,  C04B2237/127 ,  C04B2237/343 ,  C04B2237/402 ,  C04B2237/62 ,  C04B2237/64 ,  C04B2237/66 ,  C04B2237/706 ,  H01L21/67103 ,  H01L21/6831 ,  H01L21/68757

摘要： A method of making a semiconductor manufacturing equipment component, such as an electrostatic chuck, includes an application step of applying a photosensitive metal paste onto a ceramic green sheet, which is to become the body substrate, the photosensitive metal paste being a heating element material; an exposure-and-development step of exposing the photosensitive metal paste, which has been applied onto the ceramic green sheet, to light and developing the photosensitive metal paste to form an intermediate heating element, which is to become the heating element, on the ceramic green sheet; and a firing step of co-firing the ceramic green sheet and the intermediate heating element to form the body substrate and the heating element.

摘要翻译： 一种制造半导体制造设备部件如静电卡盘的方法包括将感光金属浆料施加到作为主体基板的陶瓷生片上的施加步骤，感光金属膏是加热元件材料; 曝光和显影步骤，其将施加到陶瓷生片上的感光金属膏曝光，以使感光性金属膏发光并显影，以形成在陶瓷上成为加热元件的中间加热元件 绿色板材 以及烧结陶瓷生片和中间加热元件以形成主体基板和加热元件的烧制步骤。