Reduction of hot carrier effects in semiconductor devices by controlled
scattering via the intentional introduction of impurities
    71.
    发明授权
    Reduction of hot carrier effects in semiconductor devices by controlled scattering via the intentional introduction of impurities 失效
    通过有意引入杂质控制散射来减少半导体器件中的热载流子效应

    公开(公告)号:US5108935A

    公开(公告)日:1992-04-28

    申请号:US614775

    申请日:1990-11-16

    Applicant: Mark S. Rodder

    Inventor: Mark S. Rodder

    CPC classification number: H01L29/66659 H01L29/167 Y10S438/918

    Abstract: This invention discloses a method for reducing hot carriers in a transistor structure by means of increasing the scattering rate of the carriers. The increased scattering rate is accomplished by introducing scattering sites comprising of non-conventional dopants, an element which is not boron, phosphorous, or arsenic, into the base or channel region of a transistor.

    Abstract translation: 本发明公开了一种通过增加载流子的散射速度来减少晶体管结构中的热载流子的方法。 增加的散射率通过将包含非常规掺杂剂的散射位置(不是硼,磷或砷的元素)引入晶体管的基极或沟道区来实现。

    Method for producing homogeneously doped zones in semiconductor devices
    79.
    发明授权
    Method for producing homogeneously doped zones in semiconductor devices 失效
    用于在半导体器件中生产均质掺杂区的方法

    公开(公告)号:US3856586A

    公开(公告)日:1974-12-24

    申请号:US39545573

    申请日:1973-09-10

    Applicant: LICENTIA GMBH

    Inventor: BORCHERT E SOMMER K

    Abstract: A method for producing a semiconductor device in a semiconductor wafer, which is initially substantially undoped, the method including initially forming in outer areas of the semiconductor wafer the semiconductor zones necessary for creating the device, in such a manner that an interior zone of the wafer is left substantially undoped, and subsequently doping the wafer with a doping material which is only slightly soluble in the material of the semiconductor wafer and has a high diffusion speed. In this manner the interior zone is given a substantially homogeneous doping concentration.

    Abstract translation: 一种在半导体晶片中制造半导体器件的方法,该半导体器件最初基本上未被掺杂,该方法包括首先在半导体晶片的外部区域中形成半导体区域以形成该器件所需的半导体区域,使得晶片的内部区域 基本上未掺杂,然后用仅仅微溶于半导体晶片的材料的掺杂材料掺杂晶片并且具有高扩散速度。 以这种方式,内部区域具有基本均匀的掺杂浓度。

Patent Agency Ranking