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公开(公告)号:US20180308554A1
公开(公告)日:2018-10-25
申请号:US16023393
申请日:2018-06-29
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Yu-Der CHIH , Hung-Chang YU , Ku-Feng LIN
Abstract: The present disclosure describes an adjustment circuit that can be used, for example, in a memory system with partitioned memory blocks. The adjustment circuit can include a controller circuit, a timer circuit, and a temperature adaptive reference (TAR) generator. The controller circuit can be configured to output a control signal that indicates a memory type (e.g., code memory or data memory) associated with a partitioned memory block. The timer circuit can be configured to output a timing signal for a read memory operation based on the control signal. And, the TAR generator can be configured to adjust a verify reference current for a verify memory operation based on temperature, where the verify reference current is set based on the control signal.
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公开(公告)号:US20180151224A1
公开(公告)日:2018-05-31
申请号:US15435082
申请日:2017-02-16
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Yu-Der CHIH , Shih-Lien Linus Lu , Yu-Der Chih
IPC: G11C13/00
CPC classification number: G11C13/0059 , G11C13/004 , G11C13/0069
Abstract: A memory device includes a memory array comprising a plurality of bits, wherein each bit comprises two memory cells each having a variable resistance; a formation circuit, coupled to the plurality of bits, and configured to cause a first memory cell of a first bit to be at a low resistance state; and an authentication circuit, coupled to the plurality of bits, configured to designate a logical state to the first memory cell of the first bit and use the logical state of the first memory cell of the first bit to generate a physically unclonable function (PUF) signature.
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公开(公告)号:US20170330608A1
公开(公告)日:2017-11-16
申请号:US15667600
申请日:2017-08-02
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Chia-Fu LEE , Yu-Der CHIH , Hon-Jarn LIN , Yi-Chun SHIH
IPC: G11C11/16
CPC classification number: G11C11/1673 , G11C7/062 , G11C7/22 , G11C11/161 , G11C13/004 , G11C2013/0045 , G11C2013/0054 , G11C2013/0057 , G11C2207/063
Abstract: A device includes memory cells, a reference circuit, and a sensing unit. The reference circuit includes a first reference switch, a second reference switch, and reference storage units. The first reference switch is turned on when a reference word line is activated. The second reference switch is turned on when the reference word line is activated. The reference storage units include a first reference storage unit and a second reference storage unit. The first reference storage unit generates a first signal having a first logic state when the first reference switch is turned on. The second reference storage unit generates a second signal having a second logic state when the second reference switch is turned on. The sensing unit determines a logic state of the bit data of one of the memory cells according to the first signal and the second signal.
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公开(公告)号:US20170139770A1
公开(公告)日:2017-05-18
申请号:US14941126
申请日:2015-11-13
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Chia-Fu LEE , Yu-Der CHIH
CPC classification number: G06F11/1068 , G06F11/1048 , G06F11/1076 , G11C7/06 , G11C7/08 , G11C7/14 , G11C11/1673 , G11C13/004 , G11C29/021 , G11C29/022 , G11C29/026 , G11C29/44 , G11C29/52 , G11C2013/0054 , G11C2029/0409
Abstract: A device is disclosed that includes a reference circuit, a readout circuit, and an error correction coding circuit. The reference circuit is configured to generate a reference signal. The readout circuit is configured to generate data values of second data according to the reference signal and first data. The error correction coding circuit is configured to reset the reference circuit when errors are occurred in all of the data values of the second data.
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公开(公告)号:US20160268344A1
公开(公告)日:2016-09-15
申请号:US15165925
申请日:2016-05-26
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Ku-Feng LIN , Hung-Chang YU , Kai-Chun LIN , Yu-Der CHIH
IPC: H01L27/24 , H01L23/528 , H01L27/088 , H01L23/48 , H01L25/18 , H01L45/00 , H01L23/522
CPC classification number: H01L27/2463 , H01L23/481 , H01L23/5226 , H01L23/528 , H01L23/53214 , H01L23/53228 , H01L23/53257 , H01L25/18 , H01L27/088 , H01L27/2409 , H01L27/2436 , H01L45/04 , H01L45/1233 , H01L45/146 , H01L45/16 , H01L45/1641 , H01L45/1683
Abstract: The present disclosure provides a method of fabricating a resistive memory array. In one embodiment, a method of fabricating a resistive memory array includes forming a plurality of insulators and a conductive structure on a first substrate, performing a resistor-forming process to transform the insulators into a plurality of resistors, polishing the conductive structure to expose a plurality of contact points respectively electrically connected to the resistors, providing a second substrate having a plurality of transistors and a plurality of interconnect pads, bonding respectively the interconnect pads and the contact points, and removing the first substrate from the resistors and the conductive structure.
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公开(公告)号:US20240153559A1
公开(公告)日:2024-05-09
申请号:US18417729
申请日:2024-01-19
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Yu-Der CHIH , Chung-Cheng CHOU , Wen-Ting CHU
CPC classification number: G11C13/0069 , G11C13/0026 , G11C13/0028 , G11C13/003 , G11C13/004 , H10B63/30 , H10B63/80 , H10B63/84 , H10N70/253 , H10N70/841 , G11C13/0007 , G11C2013/0045 , G11C2013/0054 , G11C2013/0078 , G11C2213/79 , H10N70/20 , H10N70/826 , H10N70/8833
Abstract: A memory architecture includes: a plurality of cell arrays each of which comprises a plurality of bit cells, wherein each of bit cells of the plurality of cell arrays uses a respective variable resistance dielectric layer to transition between first and second logic states; and a control logic circuit, coupled to the plurality of cell arrays, and configured to cause a first information bit to be written into respective bit cells of a pair of cell arrays as an original logic state of the first information bit and a logically complementary logic state of the first information bit, wherein the respective variable resistance dielectric layers are formed by using a same recipe of deposition equipment and have different diameters.
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公开(公告)号:US20230386528A1
公开(公告)日:2023-11-30
申请号:US18232768
申请日:2023-08-10
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Ku-Feng LIN , Yu-Der CHIH , Yi-Chun SHIH , Chia-Fu LEE
CPC classification number: G11C7/065 , G11C7/08 , G11C13/004 , G11C11/14 , H01L27/10
Abstract: Circuits and methods for compensating mismatches in sense amplifiers are disclosed. In one example, a circuit is disclosed. The circuit includes: a first branch, a second branch, a first plurality of trimming transistors and a second plurality of trimming transistors. The first branch comprises a first transistor, a second transistor, and a first node coupled between the first transistor and the second transistor. The second branch comprises a third transistor, a fourth transistor, and a second node coupled between the third transistor and the fourth transistor. The first node is coupled to respective gates of the third transistor and the fourth transistor. The second node is coupled to respective gates of the first transistor and the second transistor. The first plurality of trimming transistors is coupled to the second transistor in parallel. The second plurality of trimming transistors is coupled to the fourth transistor in parallel.
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公开(公告)号:US20230385623A1
公开(公告)日:2023-11-30
申请号:US18231769
申请日:2023-08-08
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Win-San KHWA , Yu-Der CHIH , Yi-Chun SHIH , Chien-Yin LIU
CPC classification number: G06N3/063 , G11C11/54 , G11C29/04 , G06N3/08 , G11C7/1006
Abstract: Disclosed is a methods and apparatus which can improve defect tolerability of a hardware-based neural network. In one embodiment, a method for performing a calculation of values on first neurons of a first layer in a neural network, includes: receiving a first pattern of a memory cell array; determining a second pattern of the memory cell array according to a third pattern; determining at least one pair of columns of the memory cell array according to the first pattern and the second pattern; switching input data of two columns of each of the at least one pair of columns of the memory cell array; and switching output data of the two columns in each of the at least one pair of columns of the memory cell array so as to determine the values on the first neurons of the first layer.
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公开(公告)号:US20230113903A1
公开(公告)日:2023-04-13
申请号:US18080696
申请日:2022-12-13
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Yu-Der CHIH , Chung-Cheng Chou , Wen-Ting Chu
IPC: G11C13/00
Abstract: A memory architecture includes: a plurality of cell arrays each of which comprises a plurality of bit cells, wherein each of bit cells of the plurality of cell arrays uses a respective variable resistance dielectric layer to transition between first and second logic states; and a control logic circuit, coupled to the plurality of cell arrays, and configured to cause a first information bit to be written into respective bit cells of a pair of cell arrays as an original logic state of the first information bit and a logically complementary logic state of the first information bit, wherein the respective variable resistance dielectric layers are formed by using a same recipe of deposition equipment and have different diameters.
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公开(公告)号:US20210090672A1
公开(公告)日:2021-03-25
申请号:US17111323
申请日:2020-12-03
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Yu-Der CHIH , Chien-Yin LIU , Yi-Chun SHIH
Abstract: A circuit includes: writing a plurality of data words, each of which has a plurality of data bits, into respective bit cells of a memory device; in response to determining that not all the data bits of the plurality of data words are correctly written into the respective bit cells of the memory device, grouping the plurality of data words as a plurality of data word sets; and simultaneously rewriting a subset of data bits that were not correctly written into the respective bit cells of the memory device, wherein the subset of the data bits are contained in a respective one of the plurality of data word sets.
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