REDUCING READ ERROR HANDLING OPERATIONS DURING POWER UP OF A MEMORY DEVICE

    公开(公告)号:US20240290413A1

    公开(公告)日:2024-08-29

    申请号:US18431279

    申请日:2024-02-02

    IPC分类号: G11C29/44 G11C16/28

    CPC分类号: G11C29/44 G11C16/28

    摘要: A boot-up read pattern data structure is maintained. Each entry of the boot-up read pattern data structure comprises a boot-up read pattern associated with a respective power cycle event and a dummy boot-up read pattern flag. The dummy boot-up read pattern flag indicates that the boot-up read pattern has been consecutively used during boot-up. Storing, in a new entry of the boot-up read pattern data structure, a current boot-up read pattern associated with a respective power cycle event for each power cycle event. The current boot-up read pattern with a previous boot-up read pattern associated with a latest entry of the boot-up pattern data structure is compared. A dummy boot-up read pattern flag of the new entry is updated responsive to the comparing the current boot-up read pattern and the previous boot-up read pattern.

    OPEN BLOCK READ ICC REDUCTION
    3.
    发明公开

    公开(公告)号:US20240290395A1

    公开(公告)日:2024-08-29

    申请号:US18360634

    申请日:2023-07-27

    摘要: Technology is disclosed herein for a storage system that reduces the Icc during open block reads. A lower than nominal voltage may be applied to the bit lines during open block reads, which reduces Icc. A nominal bit line voltage may be used during closed block reads. The lower than nominal bit line voltage may be combined with using a lower than nominal read pass voltage (Vread) to unprogrammed word lines during the open block read. The lower than nominal Vread has a lower magnitude than a nominal Vread used during a closed block read. Combining the lower than nominal bit line voltage with the lower than nominal Vread to unprogrammed word lines further reduces Icc during open block reads. The ramp rate of Vread may be relaxed (made slower) during at least some open block reads in combination with the lower than nominal bit line voltage.

    NONVOLATILE MEMORY DEVICE AND METHOD OF CONTROLLING THE SAME

    公开(公告)号:US20240274206A1

    公开(公告)日:2024-08-15

    申请号:US18385073

    申请日:2023-10-30

    IPC分类号: G11C16/12 G11C16/28 G11C16/30

    CPC分类号: G11C16/12 G11C16/28 G11C16/30

    摘要: The present disclosure provides nonvolatile memory devices including high-voltage switch circuits and methods of controlling the same. In some embodiments, a nonvolatile memory device includes a voltage generator configured to generate a switching source voltage, a plurality of high-voltage switch circuits grouped into a plurality of switching groups and configured to generate a plurality of switch control signals based on the switching source voltage, a conductive path configured to transfer the switching source voltage from the voltage generator to the plurality of high-voltage switch circuits, a plurality of high-voltage switches configured to transfer high voltages based on the plurality of switch control signals, and a control circuit configured to control transition timing of the plurality of switch control signals independently with respect to each of the plurality of switching groups.

    FLASH MEMORY DEVICE AND PROGRAM METHOD THEREOF

    公开(公告)号:US20240153569A1

    公开(公告)日:2024-05-09

    申请号:US17981462

    申请日:2022-11-06

    发明人: Wen-Chiao Ho

    摘要: A flash memory device and a program method thereof are provided. The flash memory device includes a memory array, a first global bit line, and a sense amplifying device. The memory array includes a first memory block having a plurality of first memory cells. In a leakage current detection operation, the sense amplifying device detects a leakage current generated by the first memory cells on the first global bit line to obtain leakage current simulation information. In a program operation, the sense amplifying device provides a reference current according to the leakage current simulation information, and compares a sensing current generated by a selected memory cell in the first memory cells on the first global bit line with the reference current to perform a program verification.

    Semiconductor memory device
    9.
    发明授权

    公开(公告)号:US11875851B2

    公开(公告)日:2024-01-16

    申请号:US18080524

    申请日:2022-12-13

    发明人: Hiroshi Maejima

    摘要: A semiconductor memory device includes a memory cell array having memory strings that include memory cells and first and second selection transistors. During a read operation, a controller applies a first voltage higher than ground to a source line, and a second voltage to a first and second selection gate lines that are connected to a selected memory string. The second voltage is also applied to the first selection gate lines connected to non-selected memory strings during a first period of the read operation. A third voltage higher than ground and lower than the second voltage is applied to the first selection gate lines connected to non-selected memory strings during a second period of the read operation subsequent to the first period.