Abstract:
A memory architecture includes: a plurality of cell arrays each of which comprises a plurality of bit cells, wherein each of bit cells of the plurality of cell arrays uses a respective variable resistance dielectric layer to transition between first and second logic states; and a control logic circuit, coupled to the plurality of cell arrays, and configured to cause a first information bit to be written into respective bit cells of a pair of cell arrays as an original logic state of the first information bit and a logically complementary logic state of the first information bit, wherein the respective variable resistance dielectric layers are formed by using a same recipe of deposition equipment and have different diameters.
Abstract:
A memory architecture includes: a plurality of cell arrays each of which comprises a plurality of bit cells, wherein each of bit cells of the plurality of cell arrays uses a respective variable resistance dielectric layer to transition between first and second logic states; and a control logic circuit, coupled to the plurality of cell arrays, and configured to cause a first information bit to be written into respective bit cells of a pair of cell arrays as an original logic state of the first information bit and a logically complementary logic state of the first information bit, wherein the respective variable resistance dielectric layers are formed by using a same recipe of deposition equipment and have different diameters.
Abstract:
A circuit includes a memory array having a plurality of memory cells; a control logic circuit, coupled to the memory array, and configured to use a first voltage signal to cause a first memory cell of the plurality of memory cells to transition from a first resistance state to a second resistance state; a counter circuit, coupled to the control logic circuit, and configured to increment a count by one in response to the first memory cell's transition from the first to the second resistance state; and an encryption circuit, coupled to the counter circuit, configured to generate an encrypted value using an updated count provided by the counter circuit.
Abstract:
A device is disclosed that includes a driver and a plurality of resistive memory cells each being electrically connected to the driver through a first line. The driver has a variable resistance corresponding to various locations of a conducted resistive memory cell, relative to the driver, in the plurality of resistive memory cells.
Abstract:
A thermometer circuit configured to estimate a monitored temperature is disclosed. The circuit includes an adjustable resistor presenting a first resistance value that is temperature-independent and a second resistance value that is temperature-dependent, wherein a first current signal is conducted across the resistor when it presents the first resistance value and a second current signal is conducted across the resistor when it presents the second resistance value; a plurality of gated conductors coupled to the resistor; and a control circuit, coupled to the resistor and the plurality of gated conductors, and configured to selectively deactivate at least one of the plurality of gated conductors to compare the first and second current signals to estimate the monitored temperature.
Abstract:
A device is disclosed that includes a driver, a sinker and a memory column. The memory column includes a plurality of resistive memory cells each being electrically connected between the driver and the sinker through a first line and a second line. When one of the resistive memory cells is conducted, at least one of the driver and the sinker is configured to be controlled to have a resistance depending on a row location of the conducted resistive memory cell in the memory column.
Abstract:
Circuits and methods for limiting cell current or throttling write operation, or both, in resistive random access memory (RRAM or ReRAM) cells are provided. An RRAM cell can include a select transistor and a programmable resistor that can change between a relatively high resistance and a relatively low resistance. The present circuits and methods can reduce or inhibit excess current from being applied to the programmable resistor, which potentially can regulate the resistance of the programmable resistor so as to reduce or inhibit decreases in the resistance of that resistor below the relatively low resistance. Such regulation potentially can improve reliability of the RRAM cell. Additionally, or alternatively, the present circuits and methods can throttle a write operation in an RRAM cell, e.g., can disable current flow through the RRAM cell based on the programmable resistor reaching a pre-defined target resistance, such as the relatively low resistance.
Abstract:
A bit line, which is coupled to a resistive element of a memory cell is set to a first voltage level. The memory cell may be an MRAM cell or an RRAM cell. The resistive element is configured to have a first resistance in a first state of the memory cell and a second resistance in a second state of the memory cell. A source line, which is selectively coupled to the memory cell by an access transistor, is set to a second voltage level. A word line signal is asserted to apply a first bias voltage across the resistive element. The applied first bias voltage initiates a write operation at the memory cell. The word line signal is deasserted after a variable time duration based on a detection, during the write operation, of a current through the resistive element.
Abstract:
A memory architecture includes: a plurality of cell arrays each of which comprises a plurality of bit cells, wherein each of bit cells of the plurality of cell arrays uses a respective variable resistance dielectric layer to transition between first and second logic states; and a control logic circuit, coupled to the plurality of cell arrays, and configured to cause a first information bit to be written into respective bit cells of a pair of cell arrays as an original logic state of the first information bit and a logically complementary logic state of the first information bit, wherein the respective variable resistance dielectric layers are formed by using a same recipe of deposition equipment and have different diameters.
Abstract:
A circuit includes a memory array having a plurality of memory cells; a control logic circuit, coupled to the memory array, and configured to use a first voltage signal to cause a first memory cell of the plurality of memory cells to transition from a first resistance state to a second resistance state; a counter circuit, coupled to the control logic circuit, and configured to increment a count by one in response to the first memory cell's transition from the first to the second resistance state; and an encryption circuit, coupled to the counter circuit, configured to generate an encrypted value using an updated count provided by the counter circuit.