-
公开(公告)号：CN1848417A
公开(公告)日：2006-10-18
申请号：CN200610057499.5
申请日：2006-03-17
Applicant: 台湾积体电路制造股份有限公司
IPC: H01L23/485 , H01L23/52 , H01L21/28 , H01L21/768 , H01L21/60
CPC classification number: H01L24/05 , H01L24/03 , H01L2224/02166 , H01L2224/05093 , H01L2224/05556 , H01L2224/05567 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/05042 , H01L2924/10329 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2224/05552
Abstract: 本发明提供一种接合垫结构及其形成方法。所述接合垫结构，其包括一顶部介层窗图案。顶部介层窗图案具有至少一第一介层窗组以及与其相邻的至少一第二介层窗组。第一介层窗组具有朝一第一方向延伸的至少两个线型介层窗，而第二介层窗组具有朝不同于第一方向的一第二方向延伸的至少两个线型介层窗。第一介层窗组的线型介层窗不与第二介层窗组的线型介层窗相交。本发明所述接合垫结构及其形成方法，可避免在线型介层窗相交之处具有不良的覆盖率，进而改善可靠度、接合度以及品质控制。
-
公开(公告)号：CN104752236B
公开(公告)日：2017-10-13
申请号：CN201410385450.7
申请日：2014-08-07
Applicant: 台湾积体电路制造股份有限公司
IPC: H01L21/50
CPC classification number: H01L21/565 , H01L21/486 , H01L21/56 , H01L21/561 , H01L21/563 , H01L21/6835 , H01L21/6836 , H01L23/145 , H01L23/147 , H01L23/28 , H01L23/29 , H01L23/31 , H01L23/3107 , H01L23/3114 , H01L23/3128 , H01L23/3135 , H01L23/36 , H01L23/49816 , H01L23/49827 , H01L23/5329 , H01L23/5384 , H01L23/60 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0652 , H01L25/0655 , H01L25/50 , H01L2221/68327 , H01L2221/6834 , H01L2224/0345 , H01L2224/03452 , H01L2224/0401 , H01L2224/0557 , H01L2224/05573 , H01L2224/05583 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05671 , H01L2224/05684 , H01L2224/06181 , H01L2224/11002 , H01L2224/1132 , H01L2224/11334 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/11464 , H01L2224/13082 , H01L2224/13109 , H01L2224/13111 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/1403 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/81192 , H01L2224/81815 , H01L2224/81895 , H01L2224/83191 , H01L2224/83192 , H01L2224/92125 , H01L2224/94 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06589 , H01L2924/10252 , H01L2924/10253 , H01L2924/10254 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/10333 , H01L2924/10335 , H01L2924/10342 , H01L2924/12042 , H01L2924/1431 , H01L2924/1432 , H01L2924/1434 , H01L2924/15311 , H01L2924/157 , H01L2924/1579 , H01L2924/181 , H01L2924/18161 , H01L2924/00 , H01L2224/11 , H01L2224/03 , H01L2924/00012
Abstract: 本公开的实施例包括半导体封装件及其形成方法。一个实施例是一种方法，包括：将管芯安装到衬底的顶面以形成器件；将管芯和衬底的顶面封装在模塑料中，模塑料在管芯之上具有第一厚度；以及去除管芯之上的模塑料的部分但非所有厚度。该方法还包括对器件执行进一步处理并且去除管芯之上的模塑料的剩余厚度。
-
公开(公告)号：CN104752236A
公开(公告)日：2015-07-01
申请号：CN201410385450.7
申请日：2014-08-07
Applicant: 台湾积体电路制造股份有限公司
IPC: H01L21/50
CPC classification number: H01L21/565 , H01L21/486 , H01L21/56 , H01L21/561 , H01L21/563 , H01L21/6835 , H01L21/6836 , H01L23/145 , H01L23/147 , H01L23/28 , H01L23/29 , H01L23/31 , H01L23/3107 , H01L23/3114 , H01L23/3128 , H01L23/3135 , H01L23/36 , H01L23/49816 , H01L23/49827 , H01L23/5329 , H01L23/5384 , H01L23/60 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0652 , H01L25/0655 , H01L25/50 , H01L2221/68327 , H01L2221/6834 , H01L2224/0345 , H01L2224/03452 , H01L2224/0401 , H01L2224/0557 , H01L2224/05573 , H01L2224/05583 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05671 , H01L2224/05684 , H01L2224/06181 , H01L2224/11002 , H01L2224/1132 , H01L2224/11334 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/11464 , H01L2224/13082 , H01L2224/13109 , H01L2224/13111 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/1403 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/81192 , H01L2224/81815 , H01L2224/81895 , H01L2224/83191 , H01L2224/83192 , H01L2224/92125 , H01L2224/94 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06589 , H01L2924/10252 , H01L2924/10253 , H01L2924/10254 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/10333 , H01L2924/10335 , H01L2924/10342 , H01L2924/12042 , H01L2924/1431 , H01L2924/1432 , H01L2924/1434 , H01L2924/15311 , H01L2924/157 , H01L2924/1579 , H01L2924/181 , H01L2924/18161 , H01L2924/00 , H01L2224/11 , H01L2224/03 , H01L2924/00012
Abstract: 本公开的实施例包括半导体封装件及其形成方法。一个实施例是一种方法，包括：将管芯安装到衬底的顶面以形成器件；将管芯和衬底的顶面封装在模塑料中，模塑料在管芯之上具有第一厚度；以及去除管芯之上的模塑料的部分但非所有厚度。该方法还包括对器件执行进一步处理并且去除管芯之上的模塑料的剩余厚度。
-
公开(公告)号：CN100463154C
公开(公告)日：2009-02-18
申请号：CN200610057499.5
申请日：2006-03-17
Applicant: 台湾积体电路制造股份有限公司
IPC: H01L23/485 , H01L23/52 , H01L21/28 , H01L21/768 , H01L21/60
CPC classification number: H01L24/05 , H01L24/03 , H01L2224/02166 , H01L2224/05093 , H01L2224/05556 , H01L2224/05567 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/05042 , H01L2924/10329 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2224/05552
Abstract: 本发明提供一种接合垫结构及其形成方法。所述接合垫结构，其包括一顶部介层窗图案。顶部介层窗图案具有至少一第一介层窗组以及与其相邻的至少一第二介层窗组。第一介层窗组具有朝一第一方向延伸的至少两个线型介层窗，而第二介层窗组具有朝不同于第一方向的一第二方向延伸的至少两个线型介层窗。第一介层窗组的线型介层窗不与第二介层窗组的线型介层窗相交。本发明所述接合垫结构及其形成方法，可避免在线型介层窗相交之处具有不良的覆盖率，进而改善可靠度、接合度以及品质控制。
-
-
-
Search Results
4
records
(took 0.018 seconds)
