摘要:
A method for the production of single crystal silicon characterized by the steps of feeding into an arc heater a quantity of uncontaminated silicon halide to react with hydrogen or a metal reductant, such as sodium, to produce reaction products including liquid silicon and a gaseous salt of the reductant, depositing the liquid silicon on a downwardly inclined surface, and attaching a single seed crystal of silicon to the liquid silicon and withdrawing the single seed crystal from the liquid silicon so as to propagate a large single crystal.
摘要:
A bistable semiconductor component for high frequencies with a semiconductor chip includes a sequence of at least four zones of alternating opposed types of conductivity. The outer zones form the emitter zones and are more heavily doped than the two inner zones. The base zones are so doped that with a voltage V.sub.R smaller than or at most equal to the maximum inverse voltage V.sub.RS applied in the reverse direction across the two emitter zones, the shortest distance W between the two blocking layers formed at the two outer junctions is less than the diffusion length L.sub.B of the charge carriers in the base zones.
摘要:
Novel semiconductive tertiary and higher order type copper-Group V transition metal chalcogenides having useful broad-band photoconductive properties are characterized by containing fewer than 100 ppm of impurities as determined by electron microprobe analysis, excluding doping agents which may be present. These materials are made e.g. by chemical vapor transport methods using the powdered chalcogenide or mixtures of stoichiometric amounts of the elements of which it is composed, with a small amount of halogen or hydrogen halide and heating the mixture in vacuum in a temperature gradient in which the highest temperature is below about 1200.degree. C. Photoconducting devices can be made e.g. by supplying electrodes to a thin film of the material upon a dielectric substrate.
摘要:
Monocrystalline films or layers of hexagonal mercury sulfide or cinnabar are epitaxially grown on monocrystalline optical or semiconductive substrates using liquid phase epitaxy. The films are grown by forming a charge consisting of HgS, Na2S, and S; heating the charge to above the 344*C transition temperature of HgS to form a homogeneous melt consisting of HgS solute in Na2S4 solvent; lowering the temperature of the melt to saturate the solvent with HgS; inserting a monocrystalline substrate seed crystal into the melt; and, slowly cooling the melt to supersaturate the melt with respect to HgS, then precipitate HgS out of solution and form a monocrystalline layer of cinnabar on the substrate seed crystal.
摘要:
A resistive connecting contact for a silicon semiconductor component comprises, on the semiconductor body, a layer sequence platinum silicide-titanium-molybdenum-gold. The invention also includes a method of making such a connecting contact.
摘要:
The device comprises a plurality of side by side transistor cells individually connected by a plurality of lead wires in a side-by-side lead wire array having a central axis. For reducing the effects of variations of mutual inductance among the various lead wires, and for providing a more uniform temperature from cell to cell, the individual lead wires are designed to have a self-inductance the magnitude of which is directly related to the distance of the particular lead wire from the central axis.
摘要:
A protective layer for use in the manufacture of semiconductor devices and circuits and for thereafter protecting and passivating the devices comprising a combination of silicon, oxygen and nitrogen in selected atomic proportions.
摘要:
The interconnecting joints between a semiconductor chip and a substrate are non-uniform in shape. The joints are solder and have varying shapes due to varying sizes of the solder wettable regions on the substrate. Smaller solder wettable regions cause the solder connectors to increase chip substrate standoff thereby relieving the stress on the remaining joints.
摘要:
A plurality of individual raised metal contact areas are distributed over and attached to a surface of a semiconductor light conversion element such as a gallium phosphide lightemitting diode. The outer tips of at least some of the raised contact areas are bonded to an electrical contact member, thereby providing an air boundary over a substantial portion of said semiconductor surface and thus causing considerable internal light reflection.
摘要:
A semiconductor arrangement comprises two feed lines leading into a housing, a semiconductor diode connecting to one feed line and resistance means connected to the other feed line, the diode and the resistance means being also connected together in series.