发明授权
US3871014A Flip chip module with non-uniform solder wettable areas on the substrate
失效
具有非均质焊接的片状芯片模块在基板上的湿润区域
- 专利标题： Flip chip module with non-uniform solder wettable areas on the substrate
- 专利标题（中）： 具有非均质焊接的片状芯片模块在基板上的湿润区域
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申请号： US85009369申请日： 1969-08-14
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公开(公告)号： US3871014A公开(公告)日： 1975-03-11
- 发明人: KING WILLIAM J , WILCOX DAVID L
- 申请人： IBM
- 专利权人： Ibm
- 当前专利权人： Ibm
- 优先权： US85009369 1969-08-14
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L3/00 ; H01L5/00
摘要：
The interconnecting joints between a semiconductor chip and a substrate are non-uniform in shape. The joints are solder and have varying shapes due to varying sizes of the solder wettable regions on the substrate. Smaller solder wettable regions cause the solder connectors to increase chip substrate standoff thereby relieving the stress on the remaining joints.
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