公开(公告)号：US20150102506A1

公开(公告)日：2015-04-16

申请号：US14511149

申请日：2014-10-09

申请人： Samsung Electronics Co., Ltd.

发明人： In-sang SONG ,  In-Ku KANG ,  Joon-hee LEE ,  Kyung-man KIM

IPC分类号： H01L25/10

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/60 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0235 ,  H01L2224/02379 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/05008 ,  H01L2224/05012 ,  H01L2224/05548 ,  H01L2224/05558 ,  H01L2224/05564 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/06135 ,  H01L2224/29034 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/454 ,  H01L2224/45565 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48148 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/4866 ,  H01L2224/48666 ,  H01L2224/48681 ,  H01L2224/48684 ,  H01L2224/48724 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/4876 ,  H01L2224/48766 ,  H01L2224/48781 ,  H01L2224/48784 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/4886 ,  H01L2224/48866 ,  H01L2224/48881 ,  H01L2224/48884 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83365 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/8546 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/10333 ,  H01L2924/10335 ,  H01L2924/13091 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/14511 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： The semiconductor package includes: a package substrate comprising a bonding pad; a plurality of semiconductor chips stacked on the package substrate; and a bonding wire configured to electrically connect the semiconductor chips and the bonding pad. For at least one of the plurality of semiconductor chips: the semiconductor chip comprises: a semiconductor device; a first pad electrically connected to the semiconductor device; a conductive pattern; and a second pad electrically connected to the first pad, spaced apart from the conductive pattern, and extending over the conductive pattern; and the bonding wire is connected to the second pad.

摘要翻译： 半导体封装包括：封装衬底，其包括焊盘; 堆叠在所述封装基板上的多个半导体芯片; 以及被配置为电连接半导体芯片和接合焊盘的接合线。 对于所述多个半导体芯片中的至少一个半导体芯片，所述半导体芯片包括：半导体器件; 电连接到所述半导体器件的第一焊盘; 导电图案; 以及第二焊盘，其电连接到所述第一焊盘，与所述导电图案间隔开并且延伸穿过所述导电图案; 并且接合线连接到第二焊盘。

公开(公告)号：US20020109215A1

公开(公告)日：2002-08-15

申请号：US10115986

申请日：2002-04-05

申请人： Hitachi, Ltd.

发明人： Akihiko Iwaya ,  Tamaki Wada ,  Masachika Masuda

IPC分类号： H01L023/495

CPC分类号： H01L24/06 ,  H01L21/565 ,  H01L23/4951 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48599 ,  H01L2224/48647 ,  H01L2224/4866 ,  H01L2224/48699 ,  H01L2224/48747 ,  H01L2224/4876 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/85447 ,  H01L2224/8546 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A LOC type semiconductor device comprises a semiconductor chip having a main surface in which semiconductor elements and a plurality of bonding pads are formed, and a back surface opposite the main surface; a plurality of leads each having an inner part and an outer part, and including a plurality of first leads having inner end portions extended on the main surface of the semiconductor chip and a plurality of second leads having inner end portions terminating near the semiconductor chip; bonding wires electrically connecting the bonding pads to bonding portions of the inner parts of the first and the second leads; and a sealing member sealing the semiconductor chip therein. A first bending portion is formed in the inner part of each second lead to prevent the sealing member from transformation by forming the sealing member in satisfactory resin balance between an upper portion and a lower portion of the sealing member.

摘要翻译： LOC型半导体器件包括半导体芯片，其具有形成半导体元件和多个焊盘的主表面和与主表面相对的后表面; 多个引线，各自具有内部部分和外部部分，并且包括多个第一引线，其具有在所述半导体芯片的主表面上延伸的内部端部，以及多个第二引线，其内端部终止于所述半导体芯片附近; 将所述接合焊盘电连接到所述第一引线和所述第二引线的内部部分的接合部分的接合线; 以及密封其中的半导体芯片的密封构件。 第一弯曲部分形成在每个第二引线的内部，以通过在密封构件的上部和下部之间以令人满意的树脂平衡形成密封构件来防止密封构件的变形。

公开(公告)号：US20070007607A1

公开(公告)日：2007-01-11

申请号：US11455919

申请日：2006-06-20

申请人： Minekazu Sakai ,  Ryuichiro Abe ,  Akitoshi Yamanaka

发明人： Minekazu Sakai ,  Ryuichiro Abe ,  Akitoshi Yamanaka

IPC分类号： H01L29/41 ,  H01L21/56 ,  G01D5/12 ,  G01P15/125

CPC分类号： G01P15/0802 ,  B81B7/007 ,  G01P15/125 ,  G01P2015/0814 ,  H01L24/03 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/0566 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48463 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/85201 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/3025 ,  Y10T29/49002 ,  H01L2924/00 ,  H01L2224/4876 ,  H01L2224/4866

摘要： A semiconductor sensor is disclosed that includes a semiconductor substrate, a sensing portion provided on the semiconductor substrate, and a pad in electrical communication with the sensing portion and provided on the semiconductor substrate. The semiconductor sensor also includes a bonding wire in electrical communication with the pad. Furthermore, the semiconductor sensor includes a cover member with a covering portion disposed over the semiconductor substrate for covering the sensing portion such that the covering portion is separated at a distance from the sensing portion. The cover member further includes a coupling portion provided on the semiconductor substrate at an area including the pad and for enabling electrical connection of the pad with the bonding wire therethrough.

摘要翻译： 公开了一种半导体传感器，其包括半导体衬底，设置在半导体衬底上的感测部分，以及与感测部分电连接并设置在半导体衬底上的焊盘。 半导体传感器还包括与焊盘电连通的接合线。 此外，半导体传感器包括覆盖部件，覆盖部分设置在半导体衬底上，用于覆盖感测部分，使得覆盖部分与感测部分隔开一段距离。 盖构件还包括在包括衬垫的区域处设置在半导体衬底上的耦合部分，并且用于使焊盘与通过其的接合线电连接。

公开(公告)号：US06392295B1

公开(公告)日：2002-05-21

申请号：US09421274

申请日：1999-10-20

申请人： Akihiko Iwaya ,  Tamaki Wada ,  Masachika Masuda

发明人： Akihiko Iwaya ,  Tamaki Wada ,  Masachika Masuda

IPC分类号： H01L2348

CPC分类号： H01L24/06 ,  H01L21/565 ,  H01L23/4951 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48599 ,  H01L2224/48647 ,  H01L2224/4866 ,  H01L2224/48699 ,  H01L2224/48747 ,  H01L2224/4876 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/85447 ,  H01L2224/8546 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A LOC type semiconductor device comprises a semiconductor chip having a main surface in which semiconductor elements and a plurality of bonding pads are formed, and a back surface opposite the main surface; a plurality of leads each having an inner part and an outer part, and including a plurality of first leads having inner end portions extended on the main surface of the semiconductor chip and a plurality of second leads having inner end portions terminating near the semiconductor chip; bonding wires electrically connecting the bonding pads to bonding portions of the inner parts of the first and the second leads; and a sealing member sealing the semiconductor chip therein. A first bending portion is formed in the inner part of each second lead to prevent the sealing member from transformation by forming the sealing member in satisfactory resin balance between an upper portion and a lower portion of the sealing member.

公开(公告)号：US20010040284A1

公开(公告)日：2001-11-15

申请号：US09779609

申请日：2001-02-09

申请人： Hitachi, Ltd.

发明人： Akihiko Iwaya ,  Tamaki Wada ,  Masachika Masuda

IPC分类号： H01L023/48 ,  H01L023/52 ,  H01L029/40

CPC分类号： H01L24/06 ,  H01L21/565 ,  H01L23/4951 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48599 ,  H01L2224/48647 ,  H01L2224/4866 ,  H01L2224/48699 ,  H01L2224/48747 ,  H01L2224/4876 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/85447 ,  H01L2224/8546 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A LOC type semiconductor device comprises a semiconductor chip having a main surface in which semiconductor elements and a plurality of bonding pads are formed, and a back surface opposite the main surface; a plurality of leads each having an inner part and an outer part, and including a plurality of first leads having inner end portions extended on the main surface of the semiconductor chip and a plurality of second leads having inner end portions terminating near the semiconductor chip; bonding wires electrically connecting the bonding pads to bonding portions of the inner parts of the first and the second leads; and a sealing member sealing the semiconductor chip therein. A first bending portion is formed in the inner part of each second lead to prevent the sealing member from transformation by forming the sealing member in satisfactory resin balance between an upper portion and a lower portion of the sealing member.

摘要翻译： LOC型半导体器件包括半导体芯片，其具有形成半导体元件和多个焊盘的主表面和与主表面相对的后表面; 多个引线，各自具有内部部分和外部部分，并且包括多个第一引线，其具有在所述半导体芯片的主表面上延伸的内部端部，以及多个第二引线，其内端部终止于所述半导体芯片附近; 将所述接合焊盘电连接到所述第一引线和所述第二引线的内部部分的接合部分的接合线; 以及密封其中的半导体芯片的密封构件。 第一弯曲部分形成在每个第二引线的内部，以通过在密封构件的上部和下部之间以令人满意的树脂平衡形成密封构件来防止密封构件的变形。

公开(公告)号：US08815647B2

公开(公告)日：2014-08-26

申请号：US13602349

申请日：2012-09-04

申请人： Ralf Otremba ,  Bernd Roemer ,  Erich Griebl ,  Fabio Brucchi

发明人： Ralf Otremba ,  Bernd Roemer ,  Erich Griebl ,  Fabio Brucchi

IPC分类号： H01L21/00 ,  H01L23/34

CPC分类号： H01L23/13 ,  H01L23/142 ,  H01L23/36 ,  H01L23/492 ,  H01L23/49513 ,  H01L23/49562 ,  H01L24/05 ,  H01L24/13 ,  H01L24/19 ,  H01L24/20 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/80 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05556 ,  H01L2224/0556 ,  H01L2224/05568 ,  H01L2224/05611 ,  H01L2224/05618 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/0566 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/2101 ,  H01L2224/2105 ,  H01L2224/211 ,  H01L2224/2745 ,  H01L2224/27462 ,  H01L2224/29006 ,  H01L2224/29016 ,  H01L2224/29023 ,  H01L2224/29026 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29118 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/2916 ,  H01L2224/29164 ,  H01L2224/29166 ,  H01L2224/3201 ,  H01L2224/32057 ,  H01L2224/32106 ,  H01L2224/32225 ,  H01L2224/32237 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45111 ,  H01L2224/45118 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/4516 ,  H01L2224/45164 ,  H01L2224/45166 ,  H01L2224/48091 ,  H01L2224/48611 ,  H01L2224/48618 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/4866 ,  H01L2224/48664 ,  H01L2224/48666 ,  H01L2224/48711 ,  H01L2224/48718 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/4876 ,  H01L2224/48764 ,  H01L2224/48766 ,  H01L2224/48811 ,  H01L2224/48818 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/4886 ,  H01L2224/48864 ,  H01L2224/48866 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/80903 ,  H01L2224/821 ,  H01L2224/82101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83438 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/8346 ,  H01L2224/83464 ,  H01L2224/8382 ,  H01L2224/83902 ,  H01L2224/9202 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/01015 ,  H01L2924/01079 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01082 ,  H01L2924/01051 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/05552

摘要： A chip package is provided, the chip package including: a carrier including at least one cavity; a chip disposed at least partially within the at least one cavity; at least one intermediate layer disposed over at least one side wall of the chip; wherein the at least one intermediate layer is configured to thermally conduct heat from the chip to the carrier.

摘要翻译： 提供了芯片封装，芯片封装包括：包括至少一个腔的载体; 至少部分地设置在所述至少一个空腔内的芯片; 设置在所述芯片的至少一个侧壁上的至少一个中间层; 其中所述至少一个中间层构造成将热量从所述芯片热传导到所述载体。

公开(公告)号：US20140061669A1

公开(公告)日：2014-03-06

申请号：US13602349

申请日：2012-09-04

申请人： Ralf Otremba ,  Bernd Roemer ,  Erich Griebl ,  Fabio Brucchi

发明人： Ralf Otremba ,  Bernd Roemer ,  Erich Griebl ,  Fabio Brucchi

IPC分类号： H01L23/495 ,  H01L21/50 ,  H01L29/20

CPC分类号： H01L23/13 ,  H01L23/142 ,  H01L23/36 ,  H01L23/492 ,  H01L23/49513 ,  H01L23/49562 ,  H01L24/05 ,  H01L24/13 ,  H01L24/19 ,  H01L24/20 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/80 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05556 ,  H01L2224/0556 ,  H01L2224/05568 ,  H01L2224/05611 ,  H01L2224/05618 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/0566 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/2101 ,  H01L2224/2105 ,  H01L2224/211 ,  H01L2224/2745 ,  H01L2224/27462 ,  H01L2224/29006 ,  H01L2224/29016 ,  H01L2224/29023 ,  H01L2224/29026 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29118 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/2916 ,  H01L2224/29164 ,  H01L2224/29166 ,  H01L2224/3201 ,  H01L2224/32057 ,  H01L2224/32106 ,  H01L2224/32225 ,  H01L2224/32237 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45111 ,  H01L2224/45118 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/4516 ,  H01L2224/45164 ,  H01L2224/45166 ,  H01L2224/48091 ,  H01L2224/48611 ,  H01L2224/48618 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/4866 ,  H01L2224/48664 ,  H01L2224/48666 ,  H01L2224/48711 ,  H01L2224/48718 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/4876 ,  H01L2224/48764 ,  H01L2224/48766 ,  H01L2224/48811 ,  H01L2224/48818 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/4886 ,  H01L2224/48864 ,  H01L2224/48866 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/80903 ,  H01L2224/821 ,  H01L2224/82101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83438 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/8346 ,  H01L2224/83464 ,  H01L2224/8382 ,  H01L2224/83902 ,  H01L2224/9202 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/01015 ,  H01L2924/01079 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01082 ,  H01L2924/01051 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/05552

摘要： A chip package is provided, the chip package including: a carrier including at least one cavity; a chip disposed at least partially within the at least one cavity; at least one intermediate layer disposed over at least one side wall of the chip; wherein the at least one intermediate layer is configured to thermally conduct heat from the chip to the carrier.

摘要翻译： 提供了芯片封装，芯片封装包括：包括至少一个腔的载体; 至少部分地设置在所述至少一个空腔内的芯片; 设置在所述芯片的至少一个侧壁上的至少一个中间层; 其中所述至少一个中间层构造成将热量从所述芯片热传导到所述载体。

公开(公告)号：US20130001761A1

公开(公告)日：2013-01-03

申请号：US13540903

申请日：2012-07-03

申请人： Philip E. Rogren

发明人： Philip E. Rogren

IPC分类号： H01L21/60 ,  H01L23/495

CPC分类号： H01L21/4828 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/04042 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/4866 ,  H01L2224/48664 ,  H01L2224/48669 ,  H01L2224/48684 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/4886 ,  H01L2224/48864 ,  H01L2224/48869 ,  H01L2224/48884 ,  H01L2224/73265 ,  H01L2224/85207 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/8546 ,  H01L2224/85464 ,  H01L2224/85469 ,  H01L2224/85484 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A lead carrier provides support for a semiconductor device during manufacture. The lead carrier includes a temporary support member with multiple package sites. Each package site includes a die attach pad surrounded by a plurality of terminal pads. The pads are formed of a fusible fixing material on a lower portion. A chip is mounted upon the die attach pad and wire bonds extend from the chip to the terminal pads. The pads, chip and wire bonds are all encapsulated within a mold compound. The temporary support member can be heated above a melting temperature of the fusible fixing material and peeled away and then the individual package sites can be isolated from each other to provide completed packages including multiple surface mount joints for mounting within an electronics system board.

公开(公告)号：US20070128772A1

公开(公告)日：2007-06-07

申请号：US10553076

申请日：2004-04-15

申请人： Naomi Yonemura ,  Katunori Yashima ,  Yoshihiko Tsujimura ,  Hidenori Ishikura ,  Takashi Saiki

发明人： Naomi Yonemura ,  Katunori Yashima ,  Yoshihiko Tsujimura ,  Hidenori Ishikura ,  Takashi Saiki

IPC分类号： H01L21/82 ,  H01L23/02

CPC分类号： H01L23/66 ,  H01L21/4857 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/49822 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/0566 ,  H01L2224/05666 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/4516 ,  H01L2224/45166 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48472 ,  H01L2224/48611 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48666 ,  H01L2224/48711 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/48766 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/4886 ,  H01L2224/48866 ,  H01L2224/4911 ,  H01L2224/85411 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85455 ,  H01L2224/8546 ,  H01L2224/85466 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01061 ,  H01L2924/01063 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/19051 ,  H01L2924/30105 ,  H05K1/0224 ,  H05K1/024 ,  H05K1/025 ,  H05K3/0061 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/09745 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48811 ,  H01L2224/48824 ,  H01L2224/48744 ,  H01L2224/4876 ,  H01L2224/4866

摘要： A metal base circuit board to be used for a hybrid integrated circuit, including circuits provided on a metal plate via an insulating layer, a power semiconductor mounted on the circuit, and a control semiconductor to control the power semiconductor, provided on the circuit. A low capacitance portion is embedded under a circuit portion on which the control semiconductor is mounted, preferably. The low capacitance portion is made of a resin containing an inorganic filler and has a dielectric constant of from 2 to 9.

摘要翻译： 用于混合集成电路的金属基底电路板，包括经由绝缘层设置在金属板上的电路，安装在电路上的功率半导体以及控制半导体以控制电路上的功率半导体。 优选地，将低电容部分嵌入在其上安装有控制半导体的电路部分的下方。 低电容部由含有无机填料的树脂构成，介电常数为2〜9。

公开(公告)号：US20130027113A1

公开(公告)日：2013-01-31

申请号：US13191891

申请日：2011-07-27

申请人： Ralf Otremba ,  Josef Hoeglauer ,  Juergen Schredl ,  Xaver Schloegel

发明人： Ralf Otremba ,  Josef Hoeglauer ,  Juergen Schredl ,  Xaver Schloegel

IPC分类号： H03K17/56 ,  H01L25/07 ,  H01L21/98 ,  H01L23/538

CPC分类号： H01L24/73 ,  H01L23/3107 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/06 ,  H01L24/27 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/02166 ,  H01L2224/04026 ,  H01L2224/04034 ,  H01L2224/04042 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05553 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/0603 ,  H01L2224/2732 ,  H01L2224/2745 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/37147 ,  H01L2224/3716 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/4866 ,  H01L2224/48664 ,  H01L2224/48666 ,  H01L2224/48669 ,  H01L2224/48671 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/4876 ,  H01L2224/48764 ,  H01L2224/48766 ,  H01L2224/48769 ,  H01L2224/48771 ,  H01L2224/48799 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/4886 ,  H01L2224/48864 ,  H01L2224/48866 ,  H01L2224/48869 ,  H01L2224/48871 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83801 ,  H01L2224/8381 ,  H01L2224/8382 ,  H01L2224/85439 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/8546 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/01028 ,  H01L2224/27 ,  H01L2924/0105 ,  H01L2924/01049 ,  H01L2924/01014 ,  H01L2924/00012 ,  H01L2924/01023 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/01005

摘要： A semiconductor chip includes a power transistor circuit with a plurality of active transistor cells. A first load electrode and a control electrode are arranged on a first face of the semiconductor chip, wherein the first load electrode includes a first metal layer. A second load electrode is arranged on a second face of the semiconductor chip. A second metal layer is arranged over the first metal layer, wherein the second metal layer is electrically insulated from the power transistor circuit and the second metal layer is arranged over an area of the power transistor circuit that comprises at least one of the plurality of active transistor cells.

摘要翻译： 半导体芯片包括具有多个有源晶体管单元的功率晶体管电路。 第一负载电极和控制电极设置在半导体芯片的第一面上，其中第一负载电极包括第一金属层。 第二负载电极设置在半导体芯片的第二面上。 第二金属层布置在第一金属层上，其中第二金属层与功率晶体管电路电绝缘，并且第二金属层布置在功率晶体管电路的包括多个活性物质中的至少一个的区域 晶体管单元。