专利检索 cpc:"H01L2224/3315" 第 1 页

1.

发明授权
Lead between a plurality of encapsulated MOSFETs 有权

公开(公告)号：US11830792B2

公开(公告)日：2023-11-28

申请号：US17290087

申请日：2019-11-14

申请人： ROHM CO., LTD.

发明人： Kentaro Nasu

IPC分类号： H01L23/495 , H01L23/31 , H01L23/00 , H01L25/07

CPC分类号： H01L23/49527 , H01L23/3121 , H01L23/49513 , H01L23/49562 , H01L23/49575 , H01L24/24 , H01L24/25 , H01L24/33 , H01L24/73 , H01L24/82 , H01L24/92 , H01L25/074 , H01L23/3135 , H01L24/29 , H01L24/30 , H01L24/32 , H01L2224/244 , H01L2224/24175 , H01L2224/25171 , H01L2224/29139 , H01L2224/30505 , H01L2224/32245 , H01L2224/3315 , H01L2224/73267 , H01L2224/82101 , H01L2224/82106 , H01L2224/92244 , H01L2924/13091 , H01L2924/15153 , H01L2924/15162

摘要： The semiconductor device includes first and second semiconductor elements. Each element has an obverse surface and a reverse surface, with a first electrode arranged on the reverse surface, and with a second electrode arranged on the obverse surface. The semiconductor device further includes: a first lead having an obverse surface and a reverse surface; an insulating layer covering the first lead, the first semiconductor element and the second semiconductor element; a first electrode connected to the second electrode of the first semiconductor element; and a second electrode connected to the first lead. The first semiconductor element and the first lead are bonded to each other with the reverse surface of the first semiconductor element facing the lead obverse surface. The second semiconductor element and the first lead are bonded to each other with the reverse surface of the second semiconductor element facing the lead reverse surface.

2.

发明申请
EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED BY THE SAME 有权
标题翻译：用于封装半导体器件的环氧树脂组合物及其封装的半导体器件

公开(公告)号：US20160351461A1

公开(公告)日：2016-12-01

申请号：US15162647

申请日：2016-05-24

申请人： SAMSUNG SDI CO., LTD.

发明人： Yoon Man LEE , So Yoon KIM

IPC分类号： H01L23/29 , C08K3/34 , C08K3/30 , C08K3/22 , C08K3/18 , H01L23/31 , C08K13/02 , H01L23/34 , H01L21/56 , H01L23/544 , H01L23/00 , C08K3/36 , C08K5/3417

CPC分类号： H01L23/295 , H01L21/56 , H01L23/13 , H01L23/3128 , H01L23/34 , H01L23/544 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L2223/54406 , H01L2223/54486 , H01L2224/32225 , H01L2224/3315 , H01L2224/48091 , H01L2224/48106 , H01L2224/48225 , H01L2224/4824 , H01L2224/73215 , H01L2224/83101 , H01L2224/92147 , H01L2924/00014 , H01L2924/01003 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01026 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01037 , H01L2924/01038 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01043 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01048 , H01L2924/01049 , H01L2924/0105 , H01L2924/01055 , H01L2924/01056 , H01L2924/01071 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/0108 , H01L2924/01081 , H01L2924/01082 , H01L2924/01087 , H01L2924/01088 , H01L2924/06 , H01L2924/0665 , H01L2924/15311 , H01L2924/181 , H01L2924/186 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599

摘要： An epoxy resin composition for encapsulating a semiconductor device and a semiconductor device encapsulated by the epoxy resin composition, the composition including a base resin; a filler; a colorant; and a thermochromic pigment, wherein a color of the thermochromic pigment is irreversibly changed when a temperature thereof exceeds a predetermined temperature.

摘要翻译： 一种用于封装半导体器件的环氧树脂组合物和由环氧树脂组合物包封的半导体器件，该组合物包括基础树脂; 填料; 着色剂和热变色颜料，其中当其变温超过预定温度时，热变色颜料的颜色不可逆地改变。

3.

发明公开
PACKAGE STRUCTURE WITH PROTECTIVE LID 审中-公开

公开(公告)号：US20240250055A1

公开(公告)日：2024-07-25

申请号：US18624727

申请日：2024-04-02

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Meng-Tsung KUO , Hui-Chang YU , Chih-Kung HUANG , Wei-Teng CHANG

IPC分类号： H01L23/00 , H01L21/48 , H01L23/10 , H01L23/367 , H01L25/065

CPC分类号： H01L24/33 , H01L21/4817 , H01L23/10 , H01L23/3675 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/83 , H01L25/0655 , H01L24/73 , H01L2224/2979 , H01L2224/29791 , H01L2224/29824 , H01L2224/29839 , H01L2224/29844 , H01L2224/29847 , H01L2224/29886 , H01L2224/29893 , H01L2224/3015 , H01L2224/3016 , H01L2224/30179 , H01L2224/30505 , H01L2224/32145 , H01L2224/32155 , H01L2224/32245 , H01L2224/3315 , H01L2224/3316 , H01L2224/33179 , H01L2224/33181 , H01L2224/73204 , H01L2224/73253 , H01L2224/83201

摘要： A package structure is provided. The package structure includes a chip-containing structure over a substrate and a first adhesive element directly above the chip-containing structure. The first adhesive element has a first thermal conductivity. The package structure also includes multiple second adhesive elements directly above the chip-containing structure. The second adhesive elements are spaced apart from each other, each of the second adhesive elements has a second thermal conductivity, and the second thermal conductivity is greater than the first thermal conductivity. The package structure further includes a protective lid attached to the chip-containing structure through the first adhesive element and the second adhesive elements. The protective lid extends across opposite sidewalls of the chip-containing structure.

4.

发明公开
SEMICONDUCTOR DEVICE 审中-公开

公开(公告)号：US20240055329A1

公开(公告)日：2024-02-15

申请号：US18492586

申请日：2023-10-23

申请人： ROHM CO., LTD.

发明人： Kentaro NASU

IPC分类号： H01L23/495 , H01L23/31 , H01L23/00 , H01L25/07

CPC分类号： H01L23/49527 , H01L23/3121 , H01L23/49513 , H01L23/49562 , H01L23/49575 , H01L24/24 , H01L24/25 , H01L24/33 , H01L24/73 , H01L24/82 , H01L24/92 , H01L25/074 , H01L23/3135 , H01L24/29 , H01L24/30 , H01L24/32 , H01L2224/24175 , H01L2224/244 , H01L2224/25171 , H01L2224/29139 , H01L2224/30505 , H01L2224/32245 , H01L2224/3315 , H01L2224/73267 , H01L2224/82101 , H01L2224/82106 , H01L2224/92244 , H01L2924/13091 , H01L2924/15153 , H01L2924/15162

摘要： The semiconductor device includes first and second semiconductor elements. Each element has an obverse surface and a reverse surface, with a first electrode arranged on the reverse surface, and with a second electrode arranged on the obverse surface. The semiconductor device further includes: a first lead having an obverse surface and a reverse surface; an insulating layer covering the first lead, the first semiconductor element and the second semiconductor element; a first electrode connected to the second electrode of the first semiconductor element; and a second electrode connected to the first lead. The first semiconductor element and the first lead are bonded to each other with the reverse surface of the first semiconductor element facing the lead obverse surface. The second semiconductor element and the first lead are bonded to each other with the reverse surface of the second semiconductor element facing the lead reverse surface.

5.

发明授权
Wafer level packaged integrated circuit 有权
标题翻译：晶圆级封装集成电路

公开(公告)号：US08421175B2

公开(公告)日：2013-04-16

申请号：US12556827

申请日：2009-09-10

申请人： Robert Nicol

发明人： Robert Nicol

IPC分类号： H01L31/0232

CPC分类号： H01L23/3114 , H01L23/481 , H01L23/562 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/83 , H01L2224/1413 , H01L2224/14181 , H01L2224/29011 , H01L2224/29013 , H01L2224/32054 , H01L2224/32227 , H01L2224/3315 , H01L2224/73203 , H01L2224/73253 , H01L2224/83194 , H01L2224/8385 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/15788 , H01L2924/00

摘要： A wafer level packaged integrated circuit includes an array of contacts, a silicon layer and a glass layer. The silicon and glass layers are bonded together to form a bonding material layer therebetween. The bonding material layer includes gaps between the silicon layer and the glass layer at areas where no bonding material is present. An array of contacts is adjacent the semiconductor layer on a side thereof opposite the bonding layer. The wafer level packaged integrated circuit is provided with additional bonding material layer portions within the gaps and aligned with at least some of the contacts. When the wafer level packaged integrated circuit is configured as an image sensor or display having a pixel array, the additional bonding material layer portions are not used in an area of the pixel array.

摘要翻译： 晶圆级封装集成电路包括触点阵列，硅层和玻璃层。硅和玻璃层结合在一起，以在它们之间形成接合材料层。接合材料层在不存在接合材料的区域包括硅层和玻璃层之间的间隙。触点阵列在与结合层相对的一侧与半导体层相邻。晶片级封装集成电路在间隙内提供附加的结合材料层部分并与至少一些触点对准。当晶片级封装集成电路被配置为具有像素阵列的图像传感器或显示器时，在像素阵列的区域中不使用附加的接合材料层部分。

6.

发明申请
LIGHT-EMITTING DEVICE PACKAGE 审中-公开

公开(公告)号：US20190157531A1

公开(公告)日：2019-05-23

申请号：US15527589

申请日：2015-11-04

申请人： LG INNOTEK CO., LTD.

发明人： Keal Doo MOON , Sung Joo OH

IPC分类号： H01L33/62 , H01L27/15 , H01L23/00 , H01L33/54

CPC分类号： H01L33/62 , H01L23/49861 , H01L24/05 , H01L24/14 , H01L24/29 , H01L24/32 , H01L24/33 , H01L27/15 , H01L33/483 , H01L33/54 , H01L2224/04026 , H01L2224/16245 , H01L2224/32227 , H01L2224/3315 , H01L2225/06513 , H01L2924/181 , H01L2933/0033 , H01L2924/00012

摘要： An embodiment provides a light emitting device package comprising: a package body; a first lead frame and a second lead frame, of which at least a part of each is inserted into the package body; and a light emitting device electrically flip bonded to the first lead frame and to the second lead frame, wherein the package body forms an electrode separation line between the first lead frame and the second lead frame, and the electrode separation line has at least two curved portions.

7.

发明授权
Electronic structure and electronic package component for increasing the bonding strength between inside and outside electrodes 有权
标题翻译：电子结构和电子封装组件，用于增加内外电极之间的接合强度

公开(公告)号：US08933343B2

公开(公告)日：2015-01-13

申请号：US13783643

申请日：2013-03-04

申请人： Inpaq Technology Co., Ltd.

发明人： Ming-Fung Hsieh , Yu-Chia Chang , Chun-Pin Huang , Yung-Chang Peng

IPC分类号： H05K1/16 , H05K1/03 , H05K1/09 , H05K1/11 , H05K7/00 , H01L29/40 , H05K1/18

CPC分类号： H01L23/3171 , H01G4/224 , H01G4/236 , H01L24/05 , H01L24/29 , H01L24/32 , H01L2224/02371 , H01L2224/04026 , H01L2224/04105 , H01L2224/0502 , H01L2224/05548 , H01L2224/0556 , H01L2224/05562 , H01L2224/05568 , H01L2224/291 , H01L2224/32013 , H01L2224/32058 , H01L2224/32227 , H01L2224/3315 , H01L2224/48091 , H01L2224/83815 , H01L2924/10156 , H01L2924/35121 , H05K3/3442 , H01L2924/00014 , H01L2924/00012 , H01L2924/014

摘要： An electronic structure includes a substrate body, an electronic package structure and a conductive unit. The electronic package structure is disposed on the substrate body. The electronic package structure includes a first inner electrode portion, a second inner electrode portion, a first outer electrode portion electrically connected to the first inner electrode portion, and a second outer electrode portion electrically connected to the second inner electrode portion. The conductive unit includes a first conductive body and a second conductive body respectively electrically contacting the first and the second outer electrode portions. The electronic package structure has a first notch and a second notch, the first outer electrode portion is extended into the first notch to contact the top surface of the first inner electrode portion, and the second outer electrode portion is extended into the second notch to contact the top surface of the second inner electrode portion.

摘要翻译： 电子结构包括基板主体，电子封装结构和导电单元。电子封装结构设置在基板主体上。电子封装结构包括第一内部电极部分，第二内部电极部分，与第一内部电极部分电连接的第一外部电极部分和与第二内部电极部分电连接的第二外部电极部分。导电单元包括分别与第一和第二外部电极部分电接触的第一导电体和第二导电体。电子封装结构具有第一切口和第二切口，第一外部电极部延伸到第一切口以与第一内部电极部的顶面接触，第二外部电极部延伸到第二切口以接触第二内电极部分的顶表面。

8.

发明申请
WAFER LEVEL PACKAGED INTEGRATED CIRCUIT 有权
标题翻译： WAFER LEVEL包装集成电路

公开(公告)号：US20110057281A1

公开(公告)日：2011-03-10

申请号：US12556827

申请日：2009-09-10

申请人： ROBERT NICOL

发明人： ROBERT NICOL

IPC分类号： H01L23/498 , H01L31/0224 , H01L21/50

CPC分类号： H01L23/3114 , H01L23/481 , H01L23/562 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/83 , H01L2224/1413 , H01L2224/14181 , H01L2224/29011 , H01L2224/29013 , H01L2224/32054 , H01L2224/32227 , H01L2224/3315 , H01L2224/73203 , H01L2224/73253 , H01L2224/83194 , H01L2224/8385 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/15788 , H01L2924/00

摘要： A wafer level packaged integrated circuit includes an array of contacts, a silicon layer and a glass layer. The silicon and glass layers are bonded together to form a bonding material layer therebetween. The bonding material layer includes gaps between the silicon layer and the glass layer at areas where no bonding material is present. An array of contacts is adjacent the semiconductor layer on a side thereof opposite the bonding layer. The wafer level packaged integrated circuit is provided with additional bonding material layer portions within the gaps and aligned with at least some of the contacts. When the wafer level packaged integrated circuit is configured as an image sensor or display having a pixel array, the additional bonding material layer portions are not used in an area of the pixel array.

摘要翻译： 晶圆级封装集成电路包括触点阵列，硅层和玻璃层。硅和玻璃层结合在一起，以在它们之间形成接合材料层。接合材料层在不存在接合材料的区域包括硅层和玻璃层之间的间隙。触点阵列在与结合层相对的一侧与半导体层相邻。晶片级封装集成电路在间隙内提供附加的结合材料层部分并与至少一些触点对准。当晶片级封装集成电路被配置为具有像素阵列的图像传感器或显示器时，在像素阵列的区域中不使用附加的接合材料层部分。

9.

发明授权
Structure and formation method of chip package with protective lid 有权

公开(公告)号：US11978715B2

公开(公告)日：2024-05-07

申请号：US17324372

申请日：2021-05-19

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Meng-Tsung Kuo , Hui-Chang Yu , Chih-Kung Huang , Wei-Teng Chang

IPC分类号： H01L23/00 , H01L21/48 , H01L23/10 , H01L23/367 , H01L25/065

CPC分类号： H01L24/33 , H01L21/4817 , H01L23/10 , H01L23/3675 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/83 , H01L25/0655 , H01L24/73 , H01L2224/2979 , H01L2224/29791 , H01L2224/29824 , H01L2224/29839 , H01L2224/29844 , H01L2224/29847 , H01L2224/29886 , H01L2224/29893 , H01L2224/3015 , H01L2224/3016 , H01L2224/30179 , H01L2224/30505 , H01L2224/32145 , H01L2224/32155 , H01L2224/32245 , H01L2224/3315 , H01L2224/3316 , H01L2224/33179 , H01L2224/33181 , H01L2224/73204 , H01L2224/73253 , H01L2224/83201

摘要： A package structure and a formation method of a package structure are provided. The method includes disposing a chip structure over a substrate and forming a first adhesive element directly on the chip structure. The first adhesive element has a first thermal conductivity. The method also includes forming a second adhesive element directly on the chip structure. The second adhesive element has a second thermal conductivity, and the second thermal conductivity is greater than the first thermal conductivity. The method further includes attaching a protective lid to the chip structure through the first adhesive element and the second adhesive element.