公开(公告)号：US09735076B2

公开(公告)日：2017-08-15

申请号：US15162647

申请日：2016-05-24

申请人： SAMSUNG SDI CO., LTD.

发明人： Yoon Man Lee ,  So Yoon Kim

IPC分类号： H01L21/00 ,  H01L23/29 ,  H01L23/34 ,  H01L21/56 ,  H01L23/544 ,  H01L23/00 ,  H01L23/31 ,  H01L23/13

CPC分类号： H01L23/295 ,  H01L21/56 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/34 ,  H01L23/544 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2223/54406 ,  H01L2223/54486 ,  H01L2224/32225 ,  H01L2224/3315 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48225 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/83101 ,  H01L2224/92147 ,  H01L2924/00014 ,  H01L2924/01003 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01037 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01043 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01048 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01055 ,  H01L2924/01056 ,  H01L2924/01071 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0108 ,  H01L2924/01081 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/06 ,  H01L2924/0665 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/186 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： An epoxy resin composition for encapsulating a semiconductor device and a semiconductor device encapsulated by the epoxy resin composition, the composition including a base resin; a filler; a colorant; and a thermochromic pigment, wherein a color of the thermochromic pigment is irreversibly changed when a temperature thereof exceeds a predetermined temperature.

公开(公告)号：US09896465B2

公开(公告)日：2018-02-20

申请号：US15189057

申请日：2016-06-22

申请人： SAMSUNG SDI CO., LTD.

发明人： Dong Hwan Lee ,  Min Gyum Kim ,  So Yoon Kim ,  Woo Chul Na ,  Yoon Man Lee ,  Ji Yoon Cho ,  Ki Hyeok Kwon ,  KyoungChul Bae ,  Eun Jung Lee ,  Joo Young Chung ,  Jin Min Cheon ,  Jin Woo Choi ,  Seung Han

IPC分类号： C08L63/00 ,  C07C233/00 ,  C07C235/00 ,  C07C237/00 ,  C07F9/02 ,  C07F9/54 ,  C09D163/00 ,  H01L23/29 ,  C07C235/64 ,  C08G59/62 ,  C08G59/68 ,  H01L23/00

CPC分类号： C07F9/5442 ,  C07C235/64 ,  C08G59/621 ,  C08G59/688 ,  C09D163/00 ,  H01L23/295 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/18161 ,  H01L2924/3512 ,  H01L2924/00

摘要： A phosphonium compound, a method of preparing the same, an epoxy resin composition including the same, and a semiconductor device encapsulated with the same, the compound being represented by Formula 1: