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    PAIRED END BEAD AMPLIFICATION AND HIGH THROUGHPUT SEQUENCING
    1.
    发明申请
    PAIRED END BEAD AMPLIFICATION AND HIGH THROUGHPUT SEQUENCING 有权
    配对端珠放大和高通量测序

    公开(公告)号：US20140031241A1

    公开(公告)日：2014-01-30

    申请号：US13981412

    申请日：2012-01-27

    申请人： Robert Nicol ,  Niall J. Lennon

    发明人： Robert Nicol ,  Niall J. Lennon

    IPC分类号： C12Q1/68

    CPC分类号： C12Q1/6874 ,  C12Q1/6806 ,  C12Q1/6869 ,  C40B50/14 ,  C12Q2563/149 ,  C12Q2563/159

    摘要： The present invention is related to genomic nucleotide sequencing. In particular, the invention describes a paired end sequencing method that enables the sequencing of unique read pairs by co-localizing both 5′ ends on a single emulsion polymerase chain reaction bead. The method may use a customized forked adaptor primer pair that is compatible with massively parallel sequencing techniques. The compositions and methods disclosed herein contemplate sequencing complex genomes, amplified genomic regions, as well as detecting chromosomal structural rearrangements.

    摘要翻译： 本发明涉及基因组核苷酸测序。 特别地，本发明描述了配对末端测序方法，其通过在单个乳液聚合酶链反应珠上共同定位两个5'末端来实现唯一读取对的测序。 该方法可以使用与大规模并行测序技术相兼容的定制分支适配器引物对。 本文公开的组合物和方法考虑了测序复合基因组，扩增的基因组区域以及检测染色体结构重排。

    Wafer level packaged integrated circuit
    2.
    发明授权
    Wafer level packaged integrated circuit 有权
    晶圆级封装集成电路

    公开(公告)号：US08421175B2

    公开(公告)日：2013-04-16

    申请号：US12556827

    申请日：2009-09-10

    申请人： Robert Nicol

    发明人： Robert Nicol

    IPC分类号： H01L31/0232

    CPC分类号： H01L23/3114 ,  H01L23/481 ,  H01L23/562 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/1413 ,  H01L2224/14181 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/32054 ,  H01L2224/32227 ,  H01L2224/3315 ,  H01L2224/73203 ,  H01L2224/73253 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/00

    摘要： A wafer level packaged integrated circuit includes an array of contacts, a silicon layer and a glass layer. The silicon and glass layers are bonded together to form a bonding material layer therebetween. The bonding material layer includes gaps between the silicon layer and the glass layer at areas where no bonding material is present. An array of contacts is adjacent the semiconductor layer on a side thereof opposite the bonding layer. The wafer level packaged integrated circuit is provided with additional bonding material layer portions within the gaps and aligned with at least some of the contacts. When the wafer level packaged integrated circuit is configured as an image sensor or display having a pixel array, the additional bonding material layer portions are not used in an area of the pixel array.

    摘要翻译： 晶圆级封装集成电路包括触点阵列，硅层和玻璃层。 硅和玻璃层结合在一起，以在它们之间形成接合材料层。 接合材料层在不存在接合材料的区域包括硅层和玻璃层之间的间隙。 触点阵列在与结合层相对的一侧与半导体层相邻。 晶片级封装集成电路在间隙内提供附加的结合材料层部分并与至少一些触点对准。 当晶片级封装集成电路被配置为具有像素阵列的图像传感器或显示器时，在像素阵列的区域中不使用附加的接合材料层部分。

    Compositions and methods for co-amplifying subsequences of a nucleic acid fragment sequence
    4.
    发明授权
    Compositions and methods for co-amplifying subsequences of a nucleic acid fragment sequence 有权

    公开(公告)号：US10364464B2

    公开(公告)日：2019-07-30

    申请号：US14237603

    申请日：2012-08-08

    申请人： Robert Nicol ,  Niall J. Lennon

    发明人： Robert Nicol ,  Niall J. Lennon

    IPC分类号： C12Q1/68 ,  C12Q1/6874 ,  C12Q1/6869 ,  C12N15/10

    摘要： The present invention is related to genomic nucleotide sequencing. In particular, the invention describes a single reaction method to co-amplify multiple subsequences of a nucleic acid fragment sequence (i.e., for example, at least two read pairs from a single library insert sequence). Nucleic acid fragment sequences may include, but are not limited to, localizing library insert sequences and/or unique read pair sequences in specific orientations on a single emulsion polymerase chain reaction bead. Methods may include, but are not limited to, annealing, melting, digesting, and/or reannealing high throughput sequencing primers to high throughput sequencing primer binding sites. The compositions and methods disclosed herein contemplate sequencing complex genomes, amplified genomic regions, as well as detecting chromosomal structural rearrangements that are compatible with massively parallel high throughput sequencing platforms as well as ion semiconductor matching sequencing platforms (i.e., for example, Ion Torrent platforms).

    Method of manufacturing an image sensing micromodule
    5.
    发明授权
    Method of manufacturing an image sensing micromodule 有权
    制造图像感测微模块的方法

    公开(公告)号：US07956431B2

    公开(公告)日：2011-06-07

    申请号：US12254672

    申请日：2008-10-20

    申请人： Brendan Dunne ,  Kevin Channon ,  Eric Christison ,  Robert Nicol

    发明人： Brendan Dunne ,  Kevin Channon ,  Eric Christison ,  Robert Nicol

    IPC分类号： H01L31/02

    CPC分类号： H01L27/14618 ,  H01L27/14636 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method of manufacturing a micromodule including the steps of: producing an integrated circuit on an active face of a chip made of a semi-conductive material, making a via passing through the chip, electrically linked to the integrated circuit, and inserting the chip into a box comprising a cavity and an electrically conductive element, the active face of the chip being disposed towards the bottom of the cavity, forming on at least one part of a lateral face of the chip a conductive lateral layer made of an electrically conductive material, electrically linked to a conductive element of the rear face of the chip, and producing a connection between the conductive lateral layer and the conductive element by depositing an electrically conductive material in the cavity.

    摘要翻译： 一种制造微型组件的方法，包括以下步骤：在由半导体材料制成的芯片的有源面上制造集成电路，使通过芯片的通孔电连接到集成电路，并将芯片插入 包括空腔和导电元件的盒子，所述芯片的有源面朝向所述空腔的底部设置，在所述芯片的侧面的至少一部分上形成由导电材料制成的导电横向层， 电连接到芯片的后表面的导电元件，并且通过在空腔中沉积导电材料而在导电横向层和导电元件之间产生连接。

    COMPOSITIONS AND METHODS FOR CO-AMPLIFYING SUBSEQUENCES OF A NUCLEIC ACID FRAGMENT SEQUENCE
    6.
    发明申请
    COMPOSITIONS AND METHODS FOR CO-AMPLIFYING SUBSEQUENCES OF A NUCLEIC ACID FRAGMENT SEQUENCE 审中-公开
    用于共扩增核酸序列序列的组成和方法

    公开(公告)号：US20140243242A1

    公开(公告)日：2014-08-28

    申请号：US14237603

    申请日：2012-08-08

    申请人： Robert Nicol ,  Niall J. Lennon

    发明人： Robert Nicol ,  Niall J. Lennon

    IPC分类号： C12Q1/68 ,  C12N15/10

    CPC分类号： C12Q1/6874 ,  C12N15/1065 ,  C12Q1/6869 ,  C12Q2525/15 ,  C12Q2525/197 ,  C12Q2527/137 ,  C12Q2535/122 ,  C12Q2563/131 ,  C12Q2563/149 ,  C12Q2565/50 ,  C12Q2565/514

    摘要： The present invention is related to genomic nucleotide sequencing. In particular, the invention describes a single reaction method to co-amplify multiple subsequences of a nucleic acid fragment sequence (i.e., for example, at least two read pairs from a single library insert sequence). Nucleic acid fragment sequences may include, but are not limited to, localizing library insert sequences and/or unique read pair sequences in specific orientations on a single emulsion polymerase chain reaction bead. Methods may include, but are not limited to, annealing, melting, digesting, and/or reannealing high throughput sequencing primers to high throughput sequencing primer binding sites. The compositions and methods disclosed herein contemplate sequencing complex genomes, amplified genomic regions, as well as detecting chromosomal structural rearrangements that are compatible with massively parallel high throughput sequencing platforms as well as ion semiconductor matching sequencing platforms (i.e., for example, Ion Torrent platforms).

    摘要翻译： 本发明涉及基因组核苷酸测序。 特别地，本发明描述了一种用于共同扩增核酸片段序列的多个子序列的单一反应方法（即，例如，来自单个文库插入序列的至少两个读取对）。 核酸片段序列可以包括但不限于在单一乳液聚合酶链反应珠上以特定取向定位文库插入序列和/或唯一读对对序列。 方法可以包括但不限于将高通量测序引物退火，熔化，消化和/或再退火至高通量测序引物结合位点。 本文公开的组合物和方法考虑了对复合基因组，扩增的基因组区域进行测序，以及检测与大规模并行高通量测序平台以及离子半导体匹配测序平台（例如，离子洪流平台）兼容的染色体结构重排， 。

    METHOD OF MANUFACTURING AN IMAGE SENSING MICROMODULE
    7.
    发明申请
    METHOD OF MANUFACTURING AN IMAGE SENSING MICROMODULE 有权
    制造图像感测显微镜的方法

    公开(公告)号：US20090267172A1

    公开(公告)日：2009-10-29

    申请号：US12254672

    申请日：2008-10-20

    申请人： Brendan Dunne ,  Kevin Channon ,  Eric Christison ,  Robert Nicol

    发明人： Brendan Dunne ,  Kevin Channon ,  Eric Christison ,  Robert Nicol

    IPC分类号： H01L31/02 ,  H01L21/50 ,  H01L23/02

    CPC分类号： H01L27/14618 ,  H01L27/14636 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method of manufacturing a micromodule including the steps of: producing an integrated circuit on an active face of a chip made of a semi-conductive material, making a via passing through the chip, electrically linked to the integrated circuit, and inserting the chip into a box comprising a cavity and an electrically conductive element, the active face of the chip being disposed towards the bottom of the cavity, forming on at least one part of a lateral face of the chip a conductive lateral layer made of an electrically conductive material, electrically linked to a conductive element of the rear face of the chip, and producing a connection between the conductive lateral layer and the conductive element by depositing an electrically conductive material in the cavity.

    摘要翻译： 一种制造微型组件的方法，包括以下步骤：在由半导体材料制成的芯片的有源面上制造集成电路，使通过芯片的通孔电连接到集成电路，并将芯片插入 包括空腔和导电元件的盒子，所述芯片的有源面朝向所述空腔的底部设置，在所述芯片的侧面的至少一部分上形成由导电材料制成的导电横向层， 电连接到芯片的后表面的导电元件，并且通过在空腔中沉积导电材料而在导电横向层和导电元件之间产生连接。

    FILTERS IN AN IMAGE SENSOR
    9.
    发明申请
    FILTERS IN AN IMAGE SENSOR 审中-公开
    图像传感器中的滤镜

    公开(公告)号：US20110042767A1

    公开(公告)日：2011-02-24

    申请号：US12857287

    申请日：2010-08-16

    申请人： Ewan Findlay ,  Robert Nicol

    发明人： Ewan Findlay ,  Robert Nicol

    IPC分类号： H01L31/0232 ,  H01L31/18

    CPC分类号： H01L27/14621 ,  H01L21/784 ,  H01L27/1462 ,  H01L27/14625 ,  H01L27/14632 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/14689 ,  H01L31/0232

    摘要： A method of forming an image sensor having a sensor, a cover, and a filter, that may include applying a filter layer to a cover layer by masking the cover layer with a predetermined pattern and applying the filter layer by a deposition process. The method may also include bonding the cover layer to a sensor layer including a plurality of sensors. The predetermined pattern may result in a filter layer which is aligned with each sensor. There may be gaps in the filter layer around each sensor.

    摘要翻译： 一种形成具有传感器，盖和滤光器的图像传感器的方法，其可以包括通过用预定图案掩蔽覆盖层而将覆盖层施加到覆盖层，并通过沉积工艺施加滤光层。 该方法还可以包括将覆盖层粘合到包括多个传感器的传感器层。 预定图案可以产生与每个传感器对准的过滤层。 每个传感器周围的过滤层可能有间隙。