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    RESIN COMPOSITION FOR FORMING OPTICAL COMPONENT, MOLDED PRODUCT, AND OPTICAL COMPONENT
    1.
    发明公开
    RESIN COMPOSITION FOR FORMING OPTICAL COMPONENT, MOLDED PRODUCT, AND OPTICAL COMPONENT 审中-公开

    公开(公告)号：US20240352227A1

    公开(公告)日：2024-10-24

    申请号：US18686481

    申请日：2022-11-28

    申请人： MITSUI CHEMICALS, INC.

    发明人： Yuki HASHIMOTO ,  Yoshiyuki TOTANI ,  Yasuyuki SOEDA ,  Takayuki OKUNO

    IPC分类号： C08K5/3417 ,  G02B1/04

    CPC分类号： C08K5/3417 ,  G02B1/041

    摘要： A resin composition for forming an optical component contains (A) a cyclic olefin-based polymer and (B) one or a plurality of coloring agents. The cyclic olefin-based polymer (A) includes at least one selected from a copolymer of ethylene or an α-olefin with a cyclic olefin, and a ring-opening polymer of a cyclic olefin. A molded product having a thickness at which transmittance of light having a wavelength of 700 nm is 30%, which is formed of the resin composition, satisfies all of the following conditions (1) to (3): (1) an average value of transmittance at a wavelength of 300 to 400 nm is equal to or less than 40%, (2) an average value of transmittance at a wavelength of 500 to 600 nm is equal to or more than 70%, and (3) transmittance at a wavelength of 650 nm is equal to or more than 60%.

    PHOTOCURABLE COMPOSITION
    3.
    发明公开
    PHOTOCURABLE COMPOSITION 审中-公开

    公开(公告)号：US20230374167A1

    公开(公告)日：2023-11-23

    申请号：US17664037

    申请日：2022-05-18

    申请人： Canon Kabushiki Kaisha

    发明人： Fen Wan ,  Weijun Liu ,  Timothy Brian Stachowiak

    IPC分类号： C08F2/50 ,  C08F212/36 ,  C08K5/3417 ,  C08K5/13 ,  C08F222/10

    CPC分类号： C08F2/50 ,  C08F212/36 ,  C08K5/3417 ,  C08K5/13 ,  C08F222/102

    摘要： A photocurable composition can comprise a polymerizable material and at least one photoinitiator, wherein the polymerizable material comprises a multi-functional vinylbenzene monomer in an amount of at least 30 wt % based on the total weight of the polymerizable material and the at least one photoinitiator includes an oxime ester compound. The photocurable composition can be adapted that a UV shrinkage after forming a photo-cured layer at 23° C. is not greater than 4.0%; and that a thermal shrinkage after conducting a baking treatment of the photo-cured layer at 350° C. is not greater than 3.5%.

    RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
    10.
    发明申请
    RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE 有权

    公开(公告)号：US20220204695A1

    公开(公告)日：2022-06-30

    申请号：US17621926

    申请日：2020-06-26

    申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC.

    发明人： Yune KUMAZAWA ,  Takuya SUZUKI ,  Seiji SHIKA ,  Shunsuke KATAGIRI

    IPC分类号： C08G73/10 ,  C08K5/3417 ,  H05K1/03 ,  H05K1/02

    摘要： The resin composition of the present invention is a resin composition containing: a bismaleimide compound (A) containing a constituent unit represented by the following formula (1) and maleimide groups at both ends of the molecular chain; a compound (B) containing one or more carboxy groups; and a photo initiator (C). In the formula (1), R1 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. R2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. Each R3 independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms. Each n independently represents an integer of 1 to 10.