公开(公告)号：US09362123B2

公开(公告)日：2016-06-07

申请号：US13725330

申请日：2012-12-21

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Liang-Gi Yao ,  I-Ming Chang ,  Yasutoshi Okuno ,  Chih-Hao Chang ,  Shou Zen Chang ,  Clement Hsingjen Wann

IPC分类号： H01L21/20 ,  H01L29/78 ,  H01L27/12 ,  H01L21/28 ,  H01L29/66 ,  H01L29/10 ,  H01L21/02 ,  H01L29/51

CPC分类号： H01L21/2807 ,  H01L21/02381 ,  H01L21/02532 ,  H01L29/1054 ,  H01L29/513 ,  H01L29/517 ,  H01L29/66545 ,  H01L29/66651 ,  H01L29/785

摘要： The present disclosure provides one embodiment of a semiconductor structure. The semiconductor structure includes a semiconductor substrate having a first semiconductor material and a first reactivity; and a low reactivity capping layer of disposed on the semiconductor substrate, wherein the low reactivity capping layer includes a second semiconductor material and a second reactivity less than the first reactivity, the low reactivity capping layer includes silicon germanium Si1-xGex and x is less than about 30%.

摘要翻译： 本公开提供了半导体结构的一个实施例。 半导体结构包括具有第一半导体材料和第一反应性的半导体衬底; 以及设置在所述半导体衬底上的低反应性覆盖层，其中所述低反应性覆盖层包括第二半导体材料和小于所述第一反应性的第二反应性，所述低反应性覆盖层包括硅锗Si1-xGex，并且x小于 约30％。

公开(公告)号：US20150270153A1

公开(公告)日：2015-09-24

申请号：US14733352

申请日：2015-06-08

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： I-Ming Chang ,  Wen-Huei Guo ,  Chih-Hao Chang ,  Shou-Zen Chang ,  Clement Hsingjen Wann ,  Tung Ying Lee ,  Cheng-Long Chen ,  Jui-Chien Huang

IPC分类号： H01L21/687 ,  H01L21/683

CPC分类号： H01L21/687 ,  H01L21/6838 ,  H01L29/1054 ,  H01L29/66545 ,  H01L29/7845 ,  H01L29/7847 ,  H01L29/7848 ,  H01L29/785

摘要： An apparatus for and a method of forming a semiconductor structure is provided. The apparatus includes a substrate holder that maintains a substrate such that the processing surface is curved, such as a convex or a concave shape. The substrate is held in place using point contacts, a plurality of continuous contacts extending partially around the substrate, and/or a continuous ring extending completely around the substrate. The processing may include, for example, forming source/drain regions, channel regions, silicides, stress memorization layers, or the like.

摘要翻译： 提供了一种形成半导体结构的装置和方法。 该装置包括：基板保持件，其保持基板，使得处理表面是弯曲的，例如凸形或凹形。 基板使用点接触保持就位，多个连续接触部分围绕基板延伸，和/或完全围绕基板延伸的连续环。 处理可以包括例如形成源极/漏极区域，沟道区域，硅化物，应力存储层等。

公开(公告)号：US11894461B2

公开(公告)日：2024-02-06

申请号：US17537339

申请日：2021-11-29

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Hsiang-Pi Chang ,  Yen-Tien Tung ,  Dawei Heh ,  Chung-Liang Cheng ,  I-Ming Chang ,  Yao-Sheng Huang ,  Tzer-Min Shen ,  Huang-Lin Chao

IPC分类号： H01L29/78 ,  H01L29/51 ,  H01L29/66 ,  H01L29/40

CPC分类号： H01L29/78391 ,  H01L29/401 ,  H01L29/516 ,  H01L29/6684 ,  H01L29/66545

摘要： A semiconductor device includes a semiconductor substrate, an interfacial layer formed on the semiconductor substrate, a high-k dielectric layer formed on the interfacial layer, and a conductive gate electrode layer formed on the high-k dielectric layer. At least one of the high-k dielectric layer and the interfacial layer is doped with: a first dopant species, a second dopant species, and a third dopant species. The first dopant species and the second dopant species form a plurality of first dipole elements having a first polarity. The third dopant species forms a plurality of second dipole elements having a second polarity, and the first and second polarities are opposite.

公开(公告)号：US11728414B2

公开(公告)日：2023-08-15

申请号：US17671405

申请日：2022-02-14

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

发明人： Yasutoshi Okuno ,  Cheng-Yi Peng ,  Ziwei Fang ,  I-Ming Chang ,  Akira Mineji ,  Yu-Ming Lin ,  Meng-Hsuan Hsiao

IPC分类号： H01L21/8234 ,  H01L29/66 ,  H01L29/78 ,  H01L21/203 ,  H01L27/092 ,  H01L21/8238 ,  H01L29/165 ,  H01L27/12 ,  H01L21/84 ,  H01L29/161

CPC分类号： H01L21/823431 ,  H01L21/2033 ,  H01L21/823821 ,  H01L27/0924 ,  H01L29/66545 ,  H01L29/66795 ,  H01L29/785 ,  H01L29/7848 ,  H01L21/845 ,  H01L27/1211 ,  H01L29/161 ,  H01L29/165 ,  H01L2029/7858

摘要： A method of forming a semiconductor device comprises forming a fin structure; forming a source/drain structure in the fin structure; and forming a gate electrode over the fin structure. The source/drain structure includes Si1−x−yM1xM2y, where M1 includes Sn, M2 is one or more of P and As, 0.01≤x≤0.1, and 0.01≤y≤0.

公开(公告)号：US09978630B2

公开(公告)日：2018-05-22

申请号：US14733352

申请日：2015-06-08

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： I-Ming Chang ,  Wen-Huei Guo ,  Chih-Hao Chang ,  Shou-Zen Chang ,  Clement Hsingjen Wann ,  Tung Ying Lee ,  Cheng-Long Chen ,  Jui-Chien Huang

IPC分类号： H01L21/687 ,  H01L29/78 ,  H01L29/10 ,  H01L21/683 ,  H01L29/66

CPC分类号： H01L21/687 ,  H01L21/6838 ,  H01L29/1054 ,  H01L29/66545 ,  H01L29/7845 ,  H01L29/7847 ,  H01L29/7848 ,  H01L29/785

摘要： An apparatus for and a method of forming a semiconductor structure is provided. The apparatus includes a substrate holder that maintains a substrate such that the processing surface is curved, such as a convex or a concave shape. The substrate is held in place using point contacts, a plurality of continuous contacts extending partially around the substrate, and/or a continuous ring extending completely around the substrate. The processing may include, for example, forming source/drain regions, channel regions, silicides, stress memorization layers, or the like.

公开(公告)号：US11978674B2

公开(公告)日：2024-05-07

申请号：US17497128

申请日：2021-10-08

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

发明人： I-Ming Chang ,  Jung-Hung Chang ,  Chung-Liang Cheng ,  Hsiang-Pi Chang ,  Yao-Sheng Huang ,  Huang-Lin Chao

IPC分类号： H01L21/8234 ,  H01L29/06 ,  H01L29/423 ,  H01L29/66 ,  H01L29/78 ,  H01L29/786

CPC分类号： H01L21/823481 ,  H01L21/823418 ,  H01L21/823431 ,  H01L29/0665 ,  H01L29/42392 ,  H01L29/66742 ,  H01L29/785 ,  H01L29/78618 ,  H01L29/7869

摘要： A semiconductor device structure is provided. The semiconductor device structure includes a first source/drain epitaxial feature formed over a substrate, a second source/drain epitaxial feature formed over the substrate, two or more semiconductor layers disposed between the first source/drain epitaxial feature and the second source/drain epitaxial feature, a gate electrode layer surrounding a portion of one of the two or more semiconductor layers, a first dielectric region disposed in the substrate and in contact with a first side of the first source/drain epitaxial feature, and a second dielectric region disposed in the substrate and in contact with a first side of the second source/drain epitaxial feature, the second dielectric region being separated from the first dielectric region by a substrate.

公开(公告)号：US09257558B2

公开(公告)日：2016-02-09

申请号：US14328350

申请日：2014-07-10

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Tung Ying Lee ,  Yu-Lien Huang ,  I-Ming Chang

IPC分类号： H01L21/336 ,  H01L29/78 ,  H01L29/66 ,  H01L29/51 ,  H01L29/36

CPC分类号： H01L29/785 ,  H01L29/66795

摘要： The present disclosure provides a semiconductor structure. In accordance with some embodiments, the semiconductor structure includes a substrate, one or more fins each including a first semiconductor layer formed over the substrate, an oxide layer formed wrapping over an upper portion of each of the one or more fins, and a gate stack including a high-K (HK) dielectric layer and a metal gate (MG) electrode formed wrapping over the oxide layer. The first semiconductor layer may include silicon germanium (SiGex), and the oxide layer may include silicon germanium oxide (SiGexOy).

摘要翻译： 本公开提供了一种半导体结构。 根据一些实施例，半导体结构包括衬底，每个包括形成在衬底上的第一半导体层的一个或多个鳍，形成在一个或多个翅片中的每一个的上部包裹的氧化物层，以及栅叠层 包括形成在氧化物层上的高K（HK）电介质层和金属栅极（MG）电极。 第一半导体层可以包括硅锗（SiGex），并且氧化物层可以包括硅锗氧化物（SiGexOy）。

公开(公告)号：US20240297244A1

公开(公告)日：2024-09-05

申请号：US18177381

申请日：2023-03-02

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： I-Ming Chang ,  Yao-Sheng Huang ,  Hsiang-Pi Chang ,  Yi-Ruei Jhan ,  Huang-Lin Chao

IPC分类号： H01L29/775 ,  H01L21/8234 ,  H01L27/088 ,  H01L29/06 ,  H01L29/423 ,  H01L29/66

CPC分类号： H01L29/775 ,  H01L21/823481 ,  H01L27/088 ,  H01L29/0673 ,  H01L29/42392 ,  H01L29/66439 ,  H01L29/66545

摘要： A method for fabricating semiconductor devices includes forming a stack structure protruding from a substrate and including a plurality of first semiconductor layers and a plurality of second semiconductor layers stacked on top of one another. The method includes forming an isolation structure overlaying the substrate and a lower portion of the stack structure. The method includes implanting dopants into at least an upper portion of the isolation structure.

公开(公告)号：US12040364B2

公开(公告)日：2024-07-16

申请号：US18297868

申请日：2023-04-10

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Hsueh-Wen Tsau ,  Chun-I Wu ,  Ziwei Fang ,  Huang-Lin Chao ,  I-Ming Chang ,  Chung-Liang Cheng ,  Chih-Cheng Lin

IPC分类号： H01L29/40 ,  H01L21/28 ,  H01L21/768 ,  H01L23/532 ,  H01L29/423 ,  H01L29/49 ,  H01L29/66 ,  H01L29/78 ,  H01L21/285 ,  H01L23/522 ,  H01L29/06

CPC分类号： H01L29/401 ,  H01L21/28247 ,  H01L21/76831 ,  H01L21/76843 ,  H01L23/53223 ,  H01L23/53252 ,  H01L23/53266 ,  H01L29/42392 ,  H01L29/4966 ,  H01L29/66795 ,  H01L29/785 ,  H01L21/28088 ,  H01L21/28568 ,  H01L23/5226 ,  H01L29/0673

摘要： A semiconductor device structure is provided. The semiconductor device structure includes a substrate. The semiconductor device structure includes a gate stack over the substrate. The gate stack includes a gate dielectric layer, a first metal-containing layer, a silicon-containing layer, a second metal-containing layer, and a gate electrode layer sequentially stacked over the substrate, the silicon-containing layer is between the first metal-containing layer and the second metal-containing layer, and the silicon-containing layer includes an oxide material.

公开(公告)号：US20240178319A1

公开(公告)日：2024-05-30

申请号：US18431921

申请日：2024-02-02

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Hsiang-Pi Chang ,  Yen-Tien Tung ,  Dawei Heh ,  Chung-Liang Cheng ,  I-Ming Chang ,  Yao-Sheng Huang ,  Tzer-Min Shen ,  Huang-Lin Chao

IPC分类号： H01L29/78 ,  H01L29/40 ,  H01L29/51 ,  H01L29/66

CPC分类号： H01L29/78391 ,  H01L29/401 ,  H01L29/516 ,  H01L29/66545 ,  H01L29/6684

摘要： A semiconductor device includes a substrate, an interfacial layer formed on the semiconductor substrate, and a high-k dielectric layer formed on the interfacial layer. At least one of the high-k dielectric layer and the interfacial layer is doped with: a first dopant species, a second dopant species, and a third dopant species. The first dopant species and the second dopant species form a plurality of first dipole elements having a first polarity. The third dopant species forms a plurality of second dipole elements having a second polarity. A first concentration ratio of the first concentration of the first dopant species to the second concentration of the second dopant species of the p-type transistor is different from a second concentration ratio of the first concentration of the first dopant species to the second concentration of the second dopant species of the n-type transistor.