- 专利标题: Semiconductor device structure
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申请号: US18297868申请日: 2023-04-10
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公开(公告)号: US12040364B2公开(公告)日: 2024-07-16
- 发明人: Hsueh-Wen Tsau , Chun-I Wu , Ziwei Fang , Huang-Lin Chao , I-Ming Chang , Chung-Liang Cheng , Chih-Cheng Lin
- 申请人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Birch, Stewart, Kolasch & Birch, LLP
- 主分类号: H01L29/40
- IPC分类号: H01L29/40 ; H01L21/28 ; H01L21/768 ; H01L23/532 ; H01L29/423 ; H01L29/49 ; H01L29/66 ; H01L29/78 ; H01L21/285 ; H01L23/522 ; H01L29/06
摘要:
A semiconductor device structure is provided. The semiconductor device structure includes a substrate. The semiconductor device structure includes a gate stack over the substrate. The gate stack includes a gate dielectric layer, a first metal-containing layer, a silicon-containing layer, a second metal-containing layer, and a gate electrode layer sequentially stacked over the substrate, the silicon-containing layer is between the first metal-containing layer and the second metal-containing layer, and the silicon-containing layer includes an oxide material.
公开/授权文献
- US20230246080A1 SEMICONDUCTOR DEVICE STRUCTURE 公开/授权日:2023-08-03
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