SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

    公开(公告)号:US20190319127A1

    公开(公告)日:2019-10-17

    申请号:US16450193

    申请日:2019-06-24

    Abstract: A semiconductor device includes first and second active patterns protruding upward from a substrate, a gate electrode crossing the first and second active patterns and extending in a first direction, a first source/drain region on the first active pattern and on at least one side of the gate electrode, and a second source/drain region on the second active pattern and on at least one side of the gate electrode. The first and second source/drain regions have a conductivity type different from each other, and the second source/drain region has a bottom surface in contact with a top surface of the second active pattern and at a lower level than that of a bottom surface of the first source/drain region in contact with a top surface of the first active pattern. The first active pattern has a first width smaller than a second width of the second active pattern.

    Semiconductor device
    9.
    发明授权

    公开(公告)号:US10205020B2

    公开(公告)日:2019-02-12

    申请号:US15348586

    申请日:2016-11-10

    Abstract: A semiconductor device includes an active pattern having sidewalls defined by a device isolation pattern disposed on a substrate and an upper portion protruding from a top surface of the device isolation pattern, a liner insulating layer on the sidewalls of the active pattern, a gate structure on the active pattern, and source/drain regions at both sides of the gate structure. The liner insulating layer includes a first liner insulating layer and a second liner insulating layer having a top surface higher than a top surface of the first liner insulating layer. Each of the source/drain regions includes a first portion defined by the second liner insulating layer, and a second portion protruding upward from the second liner insulating layer and covering the top surface of the first liner insulating layer.

Patent Agency Ranking