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公开(公告)号:USRE49963E1
公开(公告)日:2024-05-07
申请号:US17155615
申请日:2021-01-22
发明人: Ki Hwan Kim , Gigwan Park , Junggun You , DongSuk Shin , Jin-Wook Kim
IPC分类号: H01L29/78 , H01L21/8238 , H01L21/84 , H01L23/535 , H01L27/092 , H01L29/06 , H01L29/08 , H01L29/16 , H01L29/161 , H01L29/66 , H10B10/00 , H01L27/12 , H01L29/165
CPC分类号: H01L29/7848 , H01L21/823814 , H01L21/823821 , H01L21/823871 , H01L21/823878 , H01L23/535 , H01L27/0924 , H01L29/0653 , H01L29/0847 , H01L29/1608 , H01L29/161 , H01L29/66545 , H01L29/66636 , H10B10/12 , H10B10/18 , H01L21/845 , H01L27/1211 , H01L29/165
摘要: A semiconductor device includes first and second active patterns protruding upward from a substrate, a gate electrode crossing the first and second active patterns and extending in a first direction, a first source/drain region on the first active pattern and on at least one side of the gate electrode, and a second source/drain region on the second active pattern and on at least one side of the gate electrode. The first and second source/drain regions have a conductivity type different from each other, and the second source/drain region has a bottom surface in contact with a top surface of the second active pattern and at a lower level than that of a bottom surface of the first source/drain region in contact with a top surface of the first active pattern. The first active pattern has a first width smaller than a second width of the second active pattern.
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公开(公告)号:US10784376B2
公开(公告)日:2020-09-22
申请号:US16450193
申请日:2019-06-24
发明人: Ki Hwan Kim , Gigwan Park , Junggun You , DongSuk Shin , Jin-Wook Kim
IPC分类号: H01L29/78 , H01L21/8238 , H01L23/535 , H01L27/092 , H01L27/11 , H01L29/06 , H01L29/08 , H01L29/16 , H01L29/161 , H01L29/66 , H01L27/12 , H01L21/84 , H01L29/165
摘要: A semiconductor device includes first and second active patterns protruding upward from a substrate, a gate electrode crossing the first and second active patterns and extending in a first direction, a first source/drain region on the first active pattern and on at least one side of the gate electrode, and a second source/drain region on the second active pattern and on at least one side of the gate electrode. The first and second source/drain regions have a conductivity type different from each other, and the second source/drain region has a bottom surface in contact with a top surface of the second active pattern and at a lower level than that of a bottom surface of the first source/drain region in contact with a top surface of the first active pattern. The first active pattern has a first width smaller than a second width of the second active pattern.
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公开(公告)号:US20190319127A1
公开(公告)日:2019-10-17
申请号:US16450193
申请日:2019-06-24
发明人: Ki Hwan Kim , Gigwan Park , Junggun You , DongSuk Shin , Jin-Wook Kim
IPC分类号: H01L29/78 , H01L27/11 , H01L29/16 , H01L21/8238 , H01L27/092 , H01L29/06 , H01L29/08 , H01L29/161 , H01L29/66 , H01L23/535
摘要: A semiconductor device includes first and second active patterns protruding upward from a substrate, a gate electrode crossing the first and second active patterns and extending in a first direction, a first source/drain region on the first active pattern and on at least one side of the gate electrode, and a second source/drain region on the second active pattern and on at least one side of the gate electrode. The first and second source/drain regions have a conductivity type different from each other, and the second source/drain region has a bottom surface in contact with a top surface of the second active pattern and at a lower level than that of a bottom surface of the first source/drain region in contact with a top surface of the first active pattern. The first active pattern has a first width smaller than a second width of the second active pattern.
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公开(公告)号:US10411131B2
公开(公告)日:2019-09-10
申请号:US16111854
申请日:2018-08-24
发明人: Ki Hwan Kim , Gigwan Park , Junggun You , DongSuk Shin , Jin-Wook Kim
IPC分类号: H01L29/78 , H01L21/8238 , H01L23/535 , H01L27/092 , H01L27/11 , H01L29/06 , H01L29/08 , H01L29/16 , H01L29/161 , H01L29/165 , H01L29/66
摘要: A semiconductor device includes first and second active patterns protruding upward from a substrate, a gate electrode crossing the first and second active patterns and extending in a first direction, a first source/drain region on the first active pattern and on at least one side of the gate electrode, and a second source/drain region on the second active pattern and on at least one side of the gate electrode. The first and second source/drain regions have a conductivity type different from each other, and the second source/drain region has a bottom surface in contact with a top surface of the second active pattern and at a lower level than that of a bottom surface of the first source/drain region in contact with a top surface of the first active pattern. The first active pattern has a first width smaller than a second width of the second active pattern.
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公开(公告)号:US10090413B2
公开(公告)日:2018-10-02
申请号:US15288080
申请日:2016-10-07
发明人: Ki Hwan Kim , Gigwan Park , Junggun You , DongSuk Shin , Jin-Wook Kim
IPC分类号: H01L29/78 , H01L29/16 , H01L23/535 , H01L27/11 , H01L21/8238 , H01L27/092 , H01L29/06 , H01L29/08 , H01L29/161 , H01L29/165 , H01L29/66
摘要: A semiconductor device includes first and second active patterns protruding upward from a substrate, a gate electrode crossing the first and second active patterns and extending in a first direction, a first source/drain region on the first active pattern and on at least one side of the gate electrode, and a second source/drain region on the second active pattern and on at least one side of the gate electrode. The first and second source/drain regions have a conductivity type different from each other, and the second source/drain region has a bottom surface in contact with a top surface of the second active pattern and at a lower level than that of a bottom surface of the first source/drain region in contact with a top surface of the first active pattern. The first active pattern has a first width smaller than a second width of the second active pattern.
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公开(公告)号:US09812332B2
公开(公告)日:2017-11-07
申请号:US15398776
申请日:2017-01-05
发明人: Hyun-Kwan Yu , Woonki Shin , Moonhan Park , DongSuk Shin , HanJin Lim
IPC分类号: H01L21/461 , H01L21/306 , H01L21/02 , H01L21/8234
CPC分类号: H01L21/30604 , H01L21/02057 , H01L21/31111 , H01L21/31144 , H01L21/823418 , H01L21/823437 , H01L21/823468 , H01L21/823481
摘要: An etching method is disclosed. The etching method comprises providing on a substrate a structure comprising a recess region formed therein. The recess region includes an inner part and a mouth part whose width is less than that of the inner part. The etching method further comprises performing a clean-then-etch process to remove at least a portion of etching object formed outside the recess region. The performing a clean-then-etch process comprises performing a cleaning process to fill at least a portion of the recess region with a cleaning solution, and performing a wet etch process to the substrate in a state that the cleaning solution remains in the recess region.
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