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公开(公告)号：US09024910B2
公开(公告)日：2015-05-05
申请号：US13453923
申请日：2012-04-23
申请人： Philip Jason Stephanou , Nicholas Ian Buchan , David William Burns , Kristopher Andrew Lavery , Srinivasan Kodaganallur Ganapathi
发明人： Philip Jason Stephanou , Nicholas Ian Buchan , David William Burns , Kristopher Andrew Lavery , Srinivasan Kodaganallur Ganapathi
CPC分类号： G06F3/0414 , G06F3/044 , G06F2203/04103 , G06F2203/04106 , G06F2203/04111
摘要： A touch sensor may include a digital resistive touch (DRT) sensor architecture that is substantially free of air gaps. The DRT touch sensor may include a layer of force-sensitive resistor (FSR) material on an array of row and column electrodes. The electrodes may be formed on a substantially transparent substrate. Near the intersection of each row and column, one or more thin transparent patterned conductive bridges may be situated above the FSR. The conductive bridges may be configured for electrical connection with row and column electrodes when force is applied to the conductive bridge or surface of the touch sensor. Some touch sensors may include both DRT and projected capacitive touch (PCT) functionality.
摘要翻译： 触摸传感器可以包括基本上没有空气间隙的数字电阻式触摸（DRT）传感器架构。 DRT触摸传感器可以在行和列电极阵列上包括一层力敏电阻（FSR）材料。 电极可以形成在基本上透明的基底上。 在每行和列的交叉点附近，一个或多个薄透明图案化导电桥可以位于FSR上方。 当力被施加到触摸传感器的导电桥或表面时，导电桥可被配置为与行电极和列电极电连接。 一些触摸传感器可以包括DRT和投射电容触摸（PCT）功能。
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公开(公告)号：US08724832B2
公开(公告)日：2014-05-13
申请号：US13221791
申请日：2011-08-30
CPC分类号： H04R17/02 , G01H11/08 , G01L1/16 , H01L41/04 , H04R1/222 , H04R7/24 , H04R19/04 , H04R23/02 , H04R31/00 , H04R2201/003 , H04R2499/11 , H04R2499/15 , Y10T29/42
摘要： This disclosure provides systems, methods and apparatus for sense elements in an electromechanical microphone device. In one aspect, a piezoelectric sense element may include a glass substrate, electrode layers, piezoelectric layers, and elastic layers. The elastic layers may serve to modify the neutral plane of the piezoelectric sense element. Including an elastic layer or layers to modify the neutral plane of the piezoelectric sense element may serve to configure the sense element such that the piezoelectric layer generates a voltage in response to a sound wave or may serve to increase the sensitivity of the sense element.
摘要翻译： 本公开提供了用于机电麦克风装置中的感测元件的系统，方法和装置。 一方面，压电感测元件可以包括玻璃基板，电极层，压电层和弹性层。 弹性层可用于改变压电感测元件的中性平面。 包括用于改变压电感测元件的中性平面的弹性层可以用于构造感测元件，使得压电层响应于声波产生电压或者可以用于增加感测元件的灵敏度。
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3.发明申请GLASS AS A SUBSTRATE MATERIAL AND A FINAL PACKAGE FOR MEMS AND IC DEVICES 审中-公开作为基板材料的玻璃和用于MEMS和IC器件的最终封装公开(公告)号：US20130050227A1
公开(公告)日：2013-02-28
申请号：US13221701
申请日：2011-08-30
申请人： Kurt Edward Petersen , Ravindra V. Shenoy , Justin Phelps Black , David William Burns , Srinivasan Kodaganallur Ganapathi , Philip Jason Stephanou , Nicholas Ian Buchan
发明人： Kurt Edward Petersen , Ravindra V. Shenoy , Justin Phelps Black , David William Burns , Srinivasan Kodaganallur Ganapathi , Philip Jason Stephanou , Nicholas Ian Buchan
CPC分类号： H01L23/10 , B81B7/007 , B81B2201/047 , B81B2207/012 , B81B2207/095 , B81B2207/096 , B81B2207/097 , B81C2203/0118 , B81C2203/0792 , H01L23/053 , H01L23/055 , H01L23/057 , H01L23/08 , H01L23/15 , H01L23/49827 , H01L24/73 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/01322 , H01L2924/01327 , H01L2924/10253 , H01L2924/12044 , H01L2924/13091 , H01L2924/1461 , H01L2924/3025 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, a glass package may include a glass substrate, a cover glass and one or more devices encapsulated between the glass substrate and the cover glass. The cover glass may be bonded to the glass substrate with an adhesive such as an epoxy, or a metal bond ring. The glass package also may include one or more signal transmission pathways between the one or more devices and the package exterior. In some implementations, a glass package including an EMS and/or IC device is configured to be directly attached to a printed circuit board (PCB) or other integration substrate by surface mount technology.
摘要翻译： 本公开提供了用于集成电路（IC）和机电系统（EMS）装置的玻璃封装的系统，方法和装置。 在一个方面，玻璃包装可以包括玻璃基板，玻璃盖和一个或多个封装在玻璃基板和盖玻璃之间的装置。 覆盖玻璃可以用诸如环氧树脂或金属粘结环的粘合剂结合到玻璃基板上。 玻璃包装还可以包括在一个或多个装置和包装外部之间的一个或多个信号传输路径。 在一些实施方案中，包括EMS和/或IC器件的玻璃封装被配置为通过表面贴装技术直接附接到印刷电路板（PCB）或其它集成基板。
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公开(公告)号：US20130127879A1
公开(公告)日：2013-05-23
申请号：US13299645
申请日：2011-11-18
CPC分类号： G01L19/0084 , B81B2201/0264 , B81B2201/047 , B81B2207/012 , B81B2207/096 , B81B2207/097 , B81C1/00238 , B81C2203/0109 , B81C2203/032 , B81C2203/0792 , G01L9/0051 , G01L9/0072 , G01L9/008 , G01L19/143 , G01L19/147 , G01L19/148 , H01L23/047 , H01L2224/16227 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/1461 , H01L2924/15788 , Y10T29/5313 , H01L2924/00
摘要： This disclosure provides systems, methods and apparatus for glass-encapsulated pressure sensors. In one aspect, a glass-encapsulated pressure sensor may include a glass substrate, an electromechanical pressure sensor, an integrated circuit device, and a cover glass. The cover glass may be bonded to the glass substrate with an adhesive, such as epoxy, glass frit, or a metal bond ring. The cover glass may have any of a number of configurations. In some configurations, the cover glass may partially define a port for the electromechanical pressure sensor at an edge of the glass-encapsulated pressure sensor. In some configurations, the cover glass may form a cavity to accommodate the integrated circuit device that is separate from a cavity that accommodates the electromechanical pressure sensor.
摘要翻译： 本公开提供了用于玻璃封装的压力传感器的系统，方法和装置。 一方面，玻璃封装的压力传感器可以包括玻璃基板，机电压力传感器，集成电路装置和盖玻璃。 覆盖玻璃可以用粘合剂如环氧树脂，玻璃料或金属粘合环粘合到玻璃基板上。 盖玻璃可以具有多种构造中的任何一种。 在一些构造中，盖玻璃可以在玻璃封装的压力传感器的边缘部分地限定机电压力传感器的端口。 在一些配置中，盖玻璃可以形成空腔以容纳与容纳机电压力传感器的空腔分开的集成电路装置。
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5.发明授权Micromachined piezoelectric three-axis gyroscope and stacked lateral overlap transducer (slot) based three-axis accelerometer 有权微加工压电三轴陀螺仪和层叠横向重叠传感器（槽）三轴加速度计公开(公告)号：US09021880B2
公开(公告)日：2015-05-05
申请号：US12930229
申请日：2010-12-30
申请人： Philip Jason Stephanou , Cenk Acar , Ravindra Vaman Shenoy , David William Burns , Justin Phelps Black , Kurt Edward Petersen , Srinivasan Kodaganallur Ganapathi
发明人： Philip Jason Stephanou , Cenk Acar , Ravindra Vaman Shenoy , David William Burns , Justin Phelps Black , Kurt Edward Petersen , Srinivasan Kodaganallur Ganapathi
IPC分类号： G01P15/125 , G01P15/18 , G01C25/00 , G01C19/5712 , G01C19/5747 , G01P15/08
CPC分类号： G01C19/5769 , G01C19/5712 , G01C19/5719 , G01C19/5747 , G01C25/00 , G01P15/0802 , G01P15/125 , G01P15/18 , G01P2015/082 , H01L41/25 , H01L41/311 , H01L41/312 , Y10T29/42 , Y10T29/49002 , Y10T29/49005 , Y10T29/49155
摘要： This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using x-axis gyroscopes, y-axis gyroscopes, z-axis gyroscopes, two-axis accelerometers and three-axis accelerometers. Combining fabrication processes for such devices can enable the monolithic integration of six inertial sensing axes on a single substrate, such as a single glass substrate. Such devices may be included in a mobile device, such as a mobile display device.
摘要翻译： 本公开提供了系统，方法和装置，包括在计算机存储介质上编码的计算机程序，用于制造和使用x轴陀螺仪，y轴陀螺仪，z轴陀螺仪，双轴加速度计和三轴加速度计。 结合这样的装置的制造工艺可以使六个惯性感测轴在单个衬底（例如单个玻璃衬底）上的单片集成。 这样的设备可以被包括在诸如移动显示设备的移动设备中。
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公开(公告)号：US08824706B2
公开(公告)日：2014-09-02
申请号：US13221676
申请日：2011-08-30
IPC分类号： H04R25/00 , C03C17/36 , H04R1/04 , C03C27/08 , C03C27/10 , H04R1/06 , H04R17/02 , H04R19/04 , H04R1/08 , H04R19/00
CPC分类号： C03C17/3639 , C03C27/08 , C03C27/10 , H04R1/04 , H04R1/06 , H04R1/086 , H04R17/025 , H04R19/005 , H04R19/04 , H04R2499/11 , H04R2499/15
摘要： This disclosure provides systems, methods and apparatus for glass-encapsulated microphones. In one aspect, a glass-encapsulated microphone may include a glass substrate, an electromechanical microphone device, an integrated circuit device, and a cover glass. The cover glass may be bonded to the glass substrate with an adhesive, such as epoxy, or a metal bond ring. The cover glass may have any of a number of configurations. In some configurations, the cover glass may define an aperture for the electromechanical microphone device at an edge of the glass-encapsulated microphone. In some configurations, the cover glass may define a cavity to accommodate the integrated circuit device that is separate from a cavity that accommodates the electromechanical microphone device.
摘要翻译： 本公开提供了用于玻璃封装麦克风的系统，方法和装置。 一方面，玻璃封装的麦克风可以包括玻璃基板，机电麦克风装置，集成电路装置和盖玻璃。 覆盖玻璃可以用粘合剂如环氧树脂或金属结合环结合到玻璃基板上。 盖玻璃可以具有多种构造中的任何一种。 在一些配置中，盖玻璃可以在玻璃封装的麦克风的边缘处限定用于机电麦克风装置的孔。 在一些配置中，盖玻璃可以限定空腔以容纳与容纳机电麦克风装置的空腔分开的集成电路装置。
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公开(公告)号：US20130136280A1
公开(公告)日：2013-05-30
申请号：US13306397
申请日：2011-11-29
CPC分类号： H04R17/00 , G02B26/001 , G06F1/1626 , G06F1/1637 , H01L41/04 , H01L41/107 , H01L41/31 , H04R31/00 , H04R2201/003 , H04R2201/401 , H04R2499/15 , Y10T29/42
摘要： This disclosure provides systems, methods and apparatus for microspeaker devices. In one aspect, a microspeaker element may include a deformable dielectric membrane that spans a speaker cavity. The deformable dielectric membrane can include a piezoactuator and a dielectric layer. Upon application of a driving signal to the piezoactuator, the dielectric layer can deflect, producing sound. In some implementations, an array of microspeaker elements can be encapsulated between a glass substrate and a cover glass. Sound generated by the microspeaker elements can be emitted through a speaker grill formed in the cover glass.
摘要翻译： 本公开提供了用于微型扬声器装置的系统，方法和装置。 在一个方面，扬声器元件可以包括跨越扬声器腔的可变形介电膜。 可变形电介质膜可以包括压电致动器和电介质层。 当向压电致动器施加驱动信号时，电介质层可以偏转，产生声音。 在一些实施方案中，可以在玻璃基板和盖玻璃之间封装一组扬声器元件。 由扬声器元件产生的声音可以通过形成在盖玻璃上的扬声器格栅发射。
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8.发明申请GLASS AS A SUBSTRATE MATERIAL AND A FINAL PACKAGE FOR MEMS AND IC DEVICES 审中-公开作为基板材料的玻璃和用于MEMS和IC器件的最终封装公开(公告)号：US20130050228A1
公开(公告)日：2013-02-28
申请号：US13221717
申请日：2011-08-30
申请人： Kurt Edward Petersen , Ravindra V. Shenoy , Justin Phelps Black , David William Burns , Srinivasan Kodaganallur Ganapathi , Philip Jason Stephanou , Nicholas Ian Buchan
发明人： Kurt Edward Petersen , Ravindra V. Shenoy , Justin Phelps Black , David William Burns , Srinivasan Kodaganallur Ganapathi , Philip Jason Stephanou , Nicholas Ian Buchan
CPC分类号： H01L23/053 , B81B2201/047 , B81C1/0023 , H01L23/055 , H01L23/057 , H01L23/08 , H01L23/10 , H01L23/15 , H01L23/49827 , H01L24/73 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L27/14609 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/01322 , H01L2924/01327 , H01L2924/10253 , H01L2924/12044 , H01L2924/13091 , H01L2924/1461 , H01L2924/3025 , H01L2924/00012 , H01L2924/00
摘要： This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, fabricating a glass package includes joining a cover glass panel to a glass substrate panel, and singulating the joined panels to form individual glass packages, each including one or more encapsulated devices and one or more signal transmission pathways. In another aspect, a glass package may include a glass substrate, a cover glass and one or more devices encapsulated between the glass substrate and the cover glass.
摘要翻译： 本公开提供了用于集成电路（IC）和机电系统（EMS）装置的玻璃封装的系统，方法和装置。 在一个方面，制造玻璃封装包括将盖玻璃面板接合到玻璃基板面板，以及将接合的面板分开以形成各自包括一个或多个封装装置和一个或多个信号传输路径的单独的玻璃封装。 在另一方面，玻璃包装可以包括玻璃基板，玻璃盖和一个或多个封装在玻璃基板和盖玻璃之间的装置。
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9.发明申请GLASS AS A SUBSTRATE MATERIAL AND A FINAL PACKAGE FOR MEMS AND IC DEVICES 审中-公开作为基板材料的玻璃和用于MEMS和IC器件的最终封装公开(公告)号：US20130050155A1
公开(公告)日：2013-02-28
申请号：US13221744
申请日：2011-08-30
申请人： Kurt Edward Petersen , Ravindra V. Shenoy , Justin Phelps Black , David William Burns , Srinivasan Kodaganallur Ganapathi , Philip Jason Stephanou , Nicholas Ian Buchan
发明人： Kurt Edward Petersen , Ravindra V. Shenoy , Justin Phelps Black , David William Burns , Srinivasan Kodaganallur Ganapathi , Philip Jason Stephanou , Nicholas Ian Buchan
CPC分类号： B81B7/0067 , B81B2207/095 , B81B2207/096 , B81B2207/097 , B81C2203/0109 , H01L2224/16 , H01L2224/48091 , H01L2224/73204 , H01L2924/12044 , H01L2924/13091 , H01L2924/1461 , H01L2924/3025 , Y10T29/5313 , H01L2924/00014 , H01L2924/00
摘要： This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, a glass package may include a glass substrate, a cover glass, one or more devices encapsulated between the glass substrate and the cover glass, and bond pads configured to attach to a flexible connector and in electrical communication with an encapsulated device. In some implementations, a flexible connector may be used to electrically connect a device within the glass package to an electrical component, such as an integrated circuit (IC) device or PCB, outside the glass package.
摘要翻译： 本公开提供了用于集成电路（IC）和机电系统（EMS）装置的玻璃封装的系统，方法和装置。 在一个方面，玻璃包装可以包括玻璃基板，玻璃盖，一个或多个封装在玻璃基板和盖玻璃之间的装置，以及被配置成连接到柔性连接器并与封装装置电连通的接合垫。 在一些实施方案中，柔性连接器可以用于将玻璃封装内的器件电连接到玻璃封装外部的诸如集成电路（IC）器件或PCB之类的电气元件。
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10.发明授权Stacked lateral overlap transducer (SLOT) based three-axis accelerometer 有权基于叠加横向重叠传感器（SLOT）的三轴加速度计公开(公告)号：US09032796B2
公开(公告)日：2015-05-19
申请号：US12930187
申请日：2010-12-30
IPC分类号： G01P15/125 , G01P15/18 , G01C25/00 , G01C19/5712 , G01C19/5747 , G01P15/08
CPC分类号： G01C19/5769 , G01C19/5712 , G01C19/5719 , G01C19/5747 , G01C25/00 , G01P15/0802 , G01P15/125 , G01P15/18 , G01P2015/082 , H01L41/25 , H01L41/311 , H01L41/312 , Y10T29/42 , Y10T29/49002 , Y10T29/49005 , Y10T29/49155
摘要： This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using accelerometers. Some such accelerometers include a substrate, a first plurality of electrodes, a second plurality of electrodes, a first anchor attached to the substrate, a frame and a proof mass. The substrate may extend substantially in a first plane. The proof mass may be attached to the frame, may extend substantially in a second plane and may be substantially constrained for motion along first and second axes. The frame may be attached to the first anchor, may extend substantially in a second plane and may be substantially constrained for motion along the second axis. A lateral movement of the proof mass in response to an applied lateral acceleration along the first or second axes may result in a change in capacitance at the first or second plurality of electrodes.
摘要翻译： 本公开提供了系统，方法和装置，包括在计算机存储介质上编码的用于制造和使用加速度计的计算机程序。 一些这样的加速度计包括基板，第一多个电极，第二多个电极，附接到基板的第一锚固件，框架和检验块。 衬底可以基本上在第一平面中延伸。 检测块可以附接到框架，可以基本上在第二平面中延伸，并且可以基本上被约束用于沿着第一和第二轴线的运动。 框架可以附接到第一锚固件，可以基本上在第二平面中延伸，并且可以基本上被约束用于沿着第二轴线的运动。 响应于沿着第一或第二轴的施加的横向加速度，检测质量块的横向移动可能导致第一或第二多个电极处的电容变化。
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