发明申请
US20130050227A1 GLASS AS A SUBSTRATE MATERIAL AND A FINAL PACKAGE FOR MEMS AND IC DEVICES
审中-公开
作为基板材料的玻璃和用于MEMS和IC器件的最终封装
- 专利标题： GLASS AS A SUBSTRATE MATERIAL AND A FINAL PACKAGE FOR MEMS AND IC DEVICES
- 专利标题（中）： 作为基板材料的玻璃和用于MEMS和IC器件的最终封装
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申请号： US13221701申请日： 2011-08-30
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公开(公告)号： US20130050227A1公开(公告)日： 2013-02-28
- 发明人: Kurt Edward Petersen , Ravindra V. Shenoy , Justin Phelps Black , David William Burns , Srinivasan Kodaganallur Ganapathi , Philip Jason Stephanou , Nicholas Ian Buchan
- 申请人： Kurt Edward Petersen , Ravindra V. Shenoy , Justin Phelps Black , David William Burns , Srinivasan Kodaganallur Ganapathi , Philip Jason Stephanou , Nicholas Ian Buchan
- 申请人地址： US CA San Diego
- 专利权人： QUALCOMM MEMS TECHNOLOGIES, INC.
- 当前专利权人： QUALCOMM MEMS TECHNOLOGIES, INC.
- 当前专利权人地址： US CA San Diego
- 主分类号： G06T1/00
- IPC分类号： G06T1/00 ; H01L29/04 ; B65D85/00 ; H01L23/48
摘要：
This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, a glass package may include a glass substrate, a cover glass and one or more devices encapsulated between the glass substrate and the cover glass. The cover glass may be bonded to the glass substrate with an adhesive such as an epoxy, or a metal bond ring. The glass package also may include one or more signal transmission pathways between the one or more devices and the package exterior. In some implementations, a glass package including an EMS and/or IC device is configured to be directly attached to a printed circuit board (PCB) or other integration substrate by surface mount technology.
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