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21 条记录 (耗时 0.029 秒)

    Stacked lateral overlap transducer (SLOT) based three-axis accelerometer
    1.
    发明授权
    Stacked lateral overlap transducer (SLOT) based three-axis accelerometer 有权
    基于叠加横向重叠传感器（SLOT）的三轴加速度计

    公开(公告)号：US09032796B2

    公开(公告)日：2015-05-19

    申请号：US12930187

    申请日：2010-12-30

    申请人： Philip Jason Stephanou ,  David William Burns ,  Ravindra Vaman Shenoy

    发明人： Philip Jason Stephanou ,  David William Burns ,  Ravindra Vaman Shenoy

    IPC分类号： G01P15/125 ,  G01P15/18 ,  G01C25/00 ,  G01C19/5712 ,  G01C19/5747 ,  G01P15/08

    CPC分类号： G01C19/5769 ,  G01C19/5712 ,  G01C19/5719 ,  G01C19/5747 ,  G01C25/00 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/082 ,  H01L41/25 ,  H01L41/311 ,  H01L41/312 ,  Y10T29/42 ,  Y10T29/49002 ,  Y10T29/49005 ,  Y10T29/49155

    摘要： This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using accelerometers. Some such accelerometers include a substrate, a first plurality of electrodes, a second plurality of electrodes, a first anchor attached to the substrate, a frame and a proof mass. The substrate may extend substantially in a first plane. The proof mass may be attached to the frame, may extend substantially in a second plane and may be substantially constrained for motion along first and second axes. The frame may be attached to the first anchor, may extend substantially in a second plane and may be substantially constrained for motion along the second axis. A lateral movement of the proof mass in response to an applied lateral acceleration along the first or second axes may result in a change in capacitance at the first or second plurality of electrodes.

    摘要翻译： 本公开提供了系统，方法和装置，包括在计算机存储介质上编码的用于制造和使用加速度计的计算机程序。 一些这样的加速度计包括基板，第一多个电极，第二多个电极，附接到基板的第一锚固件，框架和检验块。 衬底可以基本上在第一平面中延伸。 检测块可以附接到框架，可以基本上在第二平面中延伸，并且可以基本上被约束用于沿着第一和第二轴线的运动。 框架可以附接到第一锚固件，可以基本上在第二平面中延伸，并且可以基本上被约束用于沿着第二轴线的运动。 响应于沿着第一或第二轴的施加的横向加速度，检测质量块的横向移动可能导致第一或第二多个电极处的电容变化。

    Stacked lateral overlap transducer (slot) based three-axis accelerometer
    3.
    发明申请
    Stacked lateral overlap transducer (slot) based three-axis accelerometer 有权
    叠加横向重叠传感器（槽）三轴加速度计

    公开(公告)号：US20110265568A1

    公开(公告)日：2011-11-03

    申请号：US12930187

    申请日：2010-12-30

    申请人： Philip Jason Stephanou ,  David William Burns ,  Ravindra Vaman Shenoy

    发明人： Philip Jason Stephanou ,  David William Burns ,  Ravindra Vaman Shenoy

    IPC分类号： G01P15/125 ,  H05K3/10

    CPC分类号： G01C19/5769 ,  G01C19/5712 ,  G01C19/5719 ,  G01C19/5747 ,  G01C25/00 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/082 ,  H01L41/25 ,  H01L41/311 ,  H01L41/312 ,  Y10T29/42 ,  Y10T29/49002 ,  Y10T29/49005 ,  Y10T29/49155

    摘要： This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using accelerometers. Some such accelerometers include a substrate, a first plurality of electrodes, a second plurality of electrodes, a first anchor attached to the substrate, a frame and a proof mass. The substrate may extend substantially in a first plane. The proof mass may be attached to the frame, may extend substantially in a second plane and may be substantially constrained for motion along first and second axes. The frame may be attached to the first anchor, may extend substantially in a second plane and may be substantially constrained for motion along the second axis. A lateral movement of the proof mass in response to an applied lateral acceleration along the first or second axes may result in a change in capacitance at the first or second plurality of electrodes.

    摘要翻译： 本公开提供了系统，方法和装置，包括在计算机存储介质上编码的用于制造和使用加速度计的计算机程序。 一些这样的加速度计包括基板，第一多个电极，第二多个电极，附接到基板的第一锚固件，框架和检验块。 衬底可以基本上在第一平面中延伸。 检测块可以附接到框架，可以基本上在第二平面中延伸，并且可以基本上被约束用于沿着第一和第二轴线的运动。 框架可以附接到第一锚固件，可以基本上在第二平面中延伸，并且可以基本上被约束用于沿着第二轴线的运动。 响应于沿着第一或第二轴的施加的横向加速度，检测质量块的横向移动可能导致第一或第二多个电极处的电容变化。

    THIN FILM THROUGH-GLASS VIA AND METHODS FOR FORMING SAME
    5.
    发明申请
    THIN FILM THROUGH-GLASS VIA AND METHODS FOR FORMING SAME 审中-公开
    通过玻璃的薄膜和形成它们的方法

    公开(公告)号：US20120235969A1

    公开(公告)日：2012-09-20

    申请号：US13048768

    申请日：2011-03-15

    申请人： David William Burns ,  Ravindra Vaman Shenoy

    发明人： David William Burns ,  Ravindra Vaman Shenoy

    IPC分类号： G06F3/038 ,  H05K7/00 ,  H05K3/42 ,  H01L23/48

    CPC分类号： B81C1/00095 ,  H01L2924/0002 ,  H05K3/0017 ,  H05K3/002 ,  H05K3/42 ,  H05K2201/09854 ,  H05K2203/025 ,  H05K2203/1572 ,  Y10T29/49165 ,  H01L2924/00

    摘要： This disclosure provides systems, methods and apparatus providing electrical connections through glass substrates. In one aspect, a thin film through-glass via including a through-glass via hole and a thin conductive film that conformally coats the sidewalls of the through-glass via hole is provided. A contour of a through-glass via hole may include concave portions that overlap at a midsection of the glass, with the through-glass via hole sidewalls curved inward to form the concave portions. In another aspect, one or more methods of forming through-glass vias are provided. In some implementations, the methods include double-sided processes to form aligned via holes in a glass substrate that together form a contoured through-glass via hole, followed by deposition of a thin continuous film of a conductive material.

    摘要翻译： 本公开提供了通过玻璃基板提供电连接的系统，方法和装置。 在一个方面，提供了一种包括透玻璃通孔的薄膜贯穿玻璃通孔和共形地涂覆透玻璃通孔的侧壁的薄导电膜。 透玻璃通孔的轮廓可以包括在玻璃的中间部分重叠的凹部，其中贯通玻璃通孔侧壁向内弯曲以形成凹部。 在另一方面，提供一种或多种形成透玻璃通孔的方法。 在一些实施方案中，所述方法包括双面工艺以在玻璃基板中形成对准的通孔，其一起形成轮廓的贯穿玻璃通孔，随后沉积导电材料的薄的连续膜。