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    Composite motion probing
    3.
    发明授权
    Composite motion probing 失效
    复合运动探测

    公开(公告)号：US07202682B2

    公开(公告)日：2007-04-10

    申请号：US10328113

    申请日：2002-12-20

    Applicant: Timothy E. Cooper ,  Benjamin N. Eldridge ,  Igor Y. Khandros ,  Rod Martens ,  Gaetan L. Mathieu

    Inventor： Timothy E. Cooper ,  Benjamin N. Eldridge ,  Igor Y. Khandros ,  Rod Martens ,  Gaetan L. Mathieu

    IPC: G01R31/02

    CPC classification number: G01R31/2887 ,  G01R1/06705 ,  G01R31/2886

    Abstract: An electronic device is moved into a first position with respect to probes for making electrical contact with the device. The electronic device is then moved into a second position in which the electronic device is pressed against the probes, compressing the probes. The movement into the second position includes two components. One component of the movement tends to press the electronic device against the probes, compressing the probes and inducing a stress in the probes. The second movement tends to reduce that stress. Test data are then communicated to and from the electronic device through the probes.

    Abstract translation: 电子设备相对于用于与设备电接触的探针移动到第一位置。 然后将电子设备移动到第二位置，其中电子设备被压靠在探针上，压缩探针。 进入第二位置的运动包括两个部件。 移动的一个组件倾向于将电子装置压靠在探针上，压缩探针并在探针中引起应力。 第二动作往往会减轻压力。 然后通过探头将测试数据传送到电子设备和从电子设备传送。

    Composite motion probing
    4.
    发明授权
    Composite motion probing 失效
    复合运动探测

    公开(公告)号：US07868632B2

    公开(公告)日：2011-01-11

    申请号：US11697603

    申请日：2007-04-06

    Applicant: Timothy E. Cooper ,  Benjamin N. Eldridge ,  Igor Y. Khandros ,  Rod Martens ,  Gaetan L. Mathieu

    Inventor： Timothy E. Cooper ,  Benjamin N. Eldridge ,  Igor Y. Khandros ,  Rod Martens ,  Gaetan L. Mathieu

    IPC: G01R31/02

    CPC classification number: G01R31/2887 ,  G01R1/06705 ,  G01R31/2886

    Abstract: An electronic device is moved into a first position with respect to probes for making electrical contact with the device. The electronic device is then moved into a second position in which the electronic device is pressed against the probes, compressing the probes. The movement into the second position includes two components. One component of the movement tends to press the electronic device against the probes, compressing the probes and inducing a stress in the probes. The second movement tends to reduce that stress. Test data are then communicated to and from the electronic device through the probes.

    Abstract translation: 电子设备相对于用于与设备电接触的探针移动到第一位置。 然后将电子设备移动到第二位置，其中电子设备被压靠在探针上，压缩探针。 进入第二位置的运动包括两个部件。 移动的一个组件倾向于将电子装置压靠在探针上，压缩探针并在探针中引起应力。 第二动作往往会减轻压力。 然后通过探头将测试数据传送到电子设备和从电子设备传送。

    Probe card configuration for low mechanical flexural strength electrical routing substrates
    6.
    发明授权
    Probe card configuration for low mechanical flexural strength electrical routing substrates 失效
    用于低机械抗弯强度电路基板的探针卡配置

    公开(公告)号：US07825674B2

    公开(公告)日：2010-11-02

    申请号：US11479068

    申请日：2006-06-30

    Applicant: Makarand S. Shinde ,  Richard A. Larder ,  Timothy E. Cooper ,  Ravindra V. Shenoy ,  Benjamin N. Eldridge

    Inventor： Makarand S. Shinde ,  Richard A. Larder ,  Timothy E. Cooper ,  Ravindra V. Shenoy ,  Benjamin N. Eldridge

    IPC: G01R31/02 ,  H01R11/18

    CPC classification number: G01R31/2889 ,  G01R1/07378

    Abstract: A mechanical support configuration for a probe card of a wafer test system is provided to increase support for a very low flexural strength substrate that supports spring probes. Increased mechanical support is provided by: (1) a frame around the periphery of the substrate having an increased sized horizontal extension over the surface of the substrate; (2) leaf springs with a bend enabling the leaf springs to extend vertically and engage the inner frame closer to the spring probes; (3) an insulating flexible membrane, or load support member machined into the inner frame, to engage the low flexural strength substrate farther away from its edge; (4) a support structure, such as support pins, added to provide support to counteract probe loading near the center of the space transformer substrate; and/or (5) a highly rigid interface tile provided between the probes and a lower flexural strength space transformer substrate.

    Abstract translation: 提供了用于晶片测试系统的探针卡的机械支撑结构，以增加对支撑弹簧探针的极低弯曲强度基底的支撑。 通过以下方式提供增加的机械支撑：（1）围绕基板的周边的框架，在基板的表面上具有增大尺寸的水平延伸; （2）具有弯曲的板簧，使得板簧能够垂直延伸并使内框架接近弹簧探针; （3）绝缘柔性膜或加工到内框架中的负载支撑构件，使低弯曲强度基板与其边缘更远地接合; （4）加载支撑结构，例如支撑销，以提供支撑以抵消在空间变压器基板的中心附近的探头负载; 和/或（5）设置在所述探针与下弯曲强度空间变换器基板之间的高刚性界面砖。

    Probe card configuration for low mechanical flexural strength electrical routing substrates
    8.
    发明授权
    Probe card configuration for low mechanical flexural strength electrical routing substrates 失效
    用于低机械抗弯强度电路基板的探针卡配置

    公开(公告)号：US07071715B2

    公开(公告)日：2006-07-04

    申请号：US10771099

    申请日：2004-02-02

    Applicant: Makarand S. Shinde ,  Richard A. Larder ,  Timothy E. Cooper ,  Ravindra V. Shenoy ,  Benjamin N. Eldridge

    Inventor： Makarand S. Shinde ,  Richard A. Larder ,  Timothy E. Cooper ,  Ravindra V. Shenoy ,  Benjamin N. Eldridge

    IPC: G01R31/02 ,  G01R31/26 ,  H05K7/02 ,  H01R12/04

    CPC classification number: G01R31/2889 ,  G01R1/07378

    Abstract: A mechanical support configuration for a probe card of a wafer test system is provided to increase support for a very low flexural strength substrate that supports spring probes. Increased mechanical support is provided by: (1) a frame around the periphery of the substrate having an increased sized horizontal extension over the surface of the substrate; (2) leaf springs with a bend enabling the leaf springs to extend vertically and engage the inner frame closer to the spring probes; (3) an insulating flexible membrane, or load support member machined into the inner frame, to engage the low flexural strength substrate farther away from its edge; (4) a support structure, such as support pins, added to provide support to counteract probe loading near the center of the space transformer substrate; and/or (5) a highly rigid interface tile provided between the probes and a lower flexural strength space transformer substrate.

    Abstract translation: 提供了用于晶片测试系统的探针卡的机械支撑结构，以增加对支撑弹簧探针的极低弯曲强度基底的支撑。 通过以下方式提供增加的机械支撑：（1）围绕基板的周边的框架，在基板的表面上具有增大尺寸的水平延伸; （2）具有弯曲的板簧，使得板簧能够垂直延伸并使内框架接近弹簧探针; （3）绝缘柔性膜或加工到内框架中的负载支撑构件，使低弯曲强度基板与其边缘更远地接合; （4）加载支撑结构，例如支撑销，以提供支撑以抵消在空间变压器基板的中心附近的探头负载; 和/或（5）设置在所述探针与下弯曲强度空间变换器基板之间的高刚性界面砖。

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