公开(公告)号：US20120253423A1

公开(公告)日：2012-10-04

申请号：US13166250

申请日：2011-06-22

申请人： In Chan Youn ,  Kui Won Choi ,  Jun-Kyo Francis Suh ,  Ji Yoon Kang ,  Jin Seok Kim ,  Jun Uk Chu ,  Ick Chan Kwon ,  Kwang Meyung Kim

发明人： In Chan Youn ,  Kui Won Choi ,  Jun-Kyo Francis Suh ,  Ji Yoon Kang ,  Jin Seok Kim ,  Jun Uk Chu ,  Ick Chan Kwon ,  Kwang Meyung Kim

IPC分类号： A61N1/00 ,  A61B17/00

CPC分类号： A61N1/36103 ,  A61N1/0551 ,  A61N1/0556 ,  A61N1/36057 ,  A61N1/36139 ,  A61N1/37288

摘要： Disclosed are a system and a method for artificial nerve networking capable of restoring a damaged nerve and allowing selective detection, analysis, transmission and stimulation of a signal from the damaged nerve. The artificial nerve networking system according to an embodiment of the present disclosure includes: a first nerve conduit connected at one end of a damaged nerve; a second nerve conduit connected at the other end of the damaged nerve; and an artificial nerve networking unit electrically connected to the first nerve conduit and the second nerve conduit and recovering the function of the damaged nerve by transmitting and receiving a signal to and from the damaged nerve.

摘要翻译： 公开了一种用于人造神经网络的系统和方法，其能够恢复受损的神经，并允许选择性地检测，分析，传输和刺激来自受损神经的信号。 根据本公开的实施例的人造神经网络系统包括：在受损神经的一端连接的第一神经导管; 在受损神经的另一端连接的第二神经管; 以及人造神经网络单元，电连接到第一神经导管和第二神经导管，并且通过向受损神经传导和接收信号来恢复损伤的神经的功能。

公开(公告)号：US07902647B2

公开(公告)日：2011-03-08

申请号：US12627361

申请日：2009-11-30

申请人： Ye-chung Chung ,  Sa-yoon Kang

发明人： Ye-chung Chung ,  Sa-yoon Kang

IPC分类号： H01L23/495

CPC分类号： H01L23/4985 ,  G02F1/13452 ,  H01L23/3157 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15151 ,  H01L2924/181 ,  H05K3/281 ,  H05K3/361 ,  H05K2201/09154 ,  H05K2201/09727 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A device is provided in which a glass panel having beveled edge is flexibly connected to a TAB package. The outer lead portions of the TAB package include an end portion of first width connected to a connection pattern on the glass panel, a terminal portion having a second width greater than the first width, and a transition portion having a width that varies between the first and second widths. When the TAB package is connected the transition portion of the respective outer lead portions are disposed over the beveled edge of the glass panel.

摘要翻译： 提供了一种装置，其中具有斜边的玻璃面板与TAB封装灵活地连接。 TAB封装的外引线部分包括连接到玻璃面板上的连接图案的第一宽度的端部，具有大于第一宽度的第二宽度的端子部分和具有在第一宽度之间变化的宽度的过渡部分 和第二宽度。 当连接TAB封装时，相应的外引线部分的过渡部分设置在玻璃面板的斜边上。

公开(公告)号：US20100060912A1

公开(公告)日：2010-03-11

申请号：US12389520

申请日：2009-02-20

申请人： Hee-yoon KANG

发明人： Hee-yoon KANG

IPC分类号： H04N1/60 ,  G06K15/00

CPC分类号： H04N1/506 ,  G06K15/129 ,  G06K15/181

摘要： A printing system can include an output unit to print printing data using main developers including a cyan (C) developer, a yellow (Y) developer, a magenta (M) developer, a black (K) developer, and a supplementary developer, a detection unit to detect whether a security mark is present in the printing data, and a control unit to control the output unit to print the security mark using the supplementary developer if the detection unit detects the security mark in the printing data.

摘要翻译： 打印系统可以包括使用包括青色（C）显影剂，黄色（Y）显影剂，品红色（M）显影剂，黑色（K）显影剂和辅助显影剂）的主要显影剂打印打印数据的输出单元， 检测单元，用于检测打印数据中是否存在安全标记;以及控制单元，如果检测单元检测到打印数据中的安全标记，则控制单元使用补充显影器来打印安全标记。

公开(公告)号：US20090136753A1

公开(公告)日：2009-05-28

申请号：US12282480

申请日：2006-12-19

申请人： Ji-Sang Park ,  Byung-Yoon Kang ,  Soon-II Sohn ,  Hyung-Soo Shin ,  Yune-Hyoun Kim ,  Lae-Hyuk Park

发明人： Ji-Sang Park ,  Byung-Yoon Kang ,  Soon-II Sohn ,  Hyung-Soo Shin ,  Yune-Hyoun Kim ,  Lae-Hyuk Park

IPC分类号： C03B37/018 ,  G02B6/00

CPC分类号： C03B37/018 ,  Y02P40/57 ,  Y10T428/2933

摘要： The present invention relates to a method for manufacturing an optical fiber preform using an MCVD process comprising (A) forming a predetermined thickness of a cladding layer in a preform tube by repeating a unit process of heating an outer peripheral surface of the preform tube at 1,700 to 2,5000 C using a heat source moving in a process direction, and simultaneously injecting cladding layer forming gas and chlorine (Cl) gas into the preform tube; and (B) forming a predetermined thickness of a core layer in the preform tube by repeating a unit process of heating the outer peripheral surface of the preform tube at 1,700 to 2,5000 C using the heat source moving in a process direction, and simultaneously injecting core layer forming gas and chlorine (Cl) gas into the preform tube having the cladding layer.

摘要翻译： 本发明涉及一种使用MCVD工艺制造光纤预制棒的方法，该方法包括：（A）通过重复将预制管的外圆周表面加热到1700℃的单元过程，在预制管中形成预定厚度的包覆层 使用沿工艺方向移动的热源至2,5000℃，同时将包覆层形成气体和氯（Cl）气体注入到预成型管中; 和（B）通过重复使用沿加工方向移动的热源在1700〜25000℃加热预成形管的外周面的单位加工，在预成型管中形成预定厚度的芯层，同时 将形成气体和氯（Cl）气体的核心层注入具有包层的预成型管中。

公开(公告)号：US07329597B2

公开(公告)日：2008-02-12

申请号：US11261260

申请日：2005-10-28

申请人： Ye-Chung Chung ,  Dong-Han Kim ,  Sa-Yoon Kang

发明人： Ye-Chung Chung ,  Dong-Han Kim ,  Sa-Yoon Kang

IPC分类号： H01L21/44 ,  H01L23/48

CPC分类号： H01L23/49838 ,  H01L21/4839 ,  H01L23/49572 ,  H01L23/4985 ,  H01L24/13 ,  H01L24/17 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor chip, having an active surface including a peripheral area and a central area, presents a connection area formed on a portion of the peripheral area. The semiconductor chip includes output pads formed in the peripheral area of the active surface and input pads formed in the central area of the active surface. The input pads may be connected to wiring patterns of a TAB tape passing over the connection area.

摘要翻译： 具有包括周边区域和中心区域的活性表面的半导体芯片具有形成在周边区域的一部分上的连接区域。 半导体芯片包括形成在有源表面的周边区域中的输出焊盘和形成在有源表面的中心区域中的输入焊盘。 输入焊盘可以连接到通过连接区域的TAB磁带的布线图案。

公开(公告)号：US20080029923A1

公开(公告)日：2008-02-07

申请号：US11872580

申请日：2007-10-15

申请人： Kyoung-Sei CHOI ,  Sa-Yoon KANG ,  Yong-Hwan KWON ,  Chung-Sun LEE

发明人： Kyoung-Sei CHOI ,  Sa-Yoon KANG ,  Yong-Hwan KWON ,  Chung-Sun LEE

IPC分类号： C04B35/00

CPC分类号： H05K3/28 ,  H05K1/036 ,  H05K1/0393 ,  H05K3/101 ,  H05K3/107 ,  H05K3/1258 ,  H05K2201/0129 ,  H05K2201/0162 ,  H05K2201/09036 ,  H05K2203/0108 ,  H05K2203/0759 ,  H05K2203/1105 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916

摘要： A method for manufacturing a tape wiring board in accordance with the present invention may employ an imprinting process in forming a wiring pattern thereby reducing the number of processes for manufacturing a tape wiring board and allowing the manufacturing process to proceed in a single production line. Therefore, the manufacturing time and cost may be reduced. A profile of the wiring pattern may be determined by the shape of an impression pattern of a mold. This may establish the top width of inner and outer leads and incorporate fine pad pitch. Although ILB and OLB process may use an NCP, connection reliability may be established due to the soft and elastic wiring pattern.

摘要翻译： 根据本发明的制造带布线板的方法可以在形成布线图案中采用压印工艺，从而减少制造带布线板的工艺的数量，并允许制造工艺在单个生产线中进行。 因此，制造时间和成本可能降低。 布线图案的轮廓可以通过模具的印模图案的形状来确定。 这可以建立内部和外部引线的顶部宽度并且结合细小的垫间距。 虽然ILB和OLB过程可能使用NCP，但是由于软和弹性布线图案可能建立连接可靠性。

公开(公告)号：US07183660B2

公开(公告)日：2007-02-27

申请号：US10949091

申请日：2004-09-23

申请人： Si-Hoon Lee ,  Sa-Yoon Kang ,  Dong-Han Kim

发明人： Si-Hoon Lee ,  Sa-Yoon Kang ,  Dong-Han Kim

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L23/49572 ,  H01L23/3157 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00 ,  H01L2224/05599

摘要： A tape circuit substrate comprises a base film made of an insulating material, and a wiring pattern layer which is formed on the base film and has first leads that are connected to electrode pads arranged near a periphery of a semiconductor chip and second leads that are connected to electrode pads arranged near the center of the semiconductor chip. The semiconductor chip package comprises a semiconductor chip electrically bonded to the tape circuit substrate through chip bumps. In such a case, each of the leads is configured such that a tip end thereof to be bonded to the electrode pad has a width larger than that of a body portion thereof. According to the present invention, since the interval between the lead and the electrode pad can be made even narrower, a fine pitch semiconductor device can be realized.

摘要翻译： 带状电路基板包括由绝缘材料制成的基膜和形成在基膜上的布线图案层，并且具有连接到布置在半导体芯片的周围附近的电极焊盘的第一引线和连接的第二引线 到布置在半导体芯片的中心附近的电极焊盘。 半导体芯片封装包括通过芯片凸块电连接到带电路基板的半导体芯片。 在这种情况下，每个引线被构造成使得其与电极焊盘接合的前端的宽度大于其主体部分的宽度。 根据本发明，由于可以使引线与电极焊盘之间的间隔更窄，所以可以实现精细的间距半导体器件。

公开(公告)号：US20060230793A1

公开(公告)日：2006-10-19

申请号：US10534589

申请日：2003-05-30

申请人： Choon-Keun Hong ,  Byung-Yoon Kang ,  Dong-Wook Lee ,  Byung-Chul Kang

发明人： Choon-Keun Hong ,  Byung-Yoon Kang ,  Dong-Wook Lee ,  Byung-Chul Kang

IPC分类号： C03B37/018

CPC分类号： C03B37/01861 ,  C03B37/01869 ,  C03B2201/31 ,  C03B2203/26

摘要： Disclosed is a method for manufacturing an optical fiber preform in MCVD, which simultaneously performs an etching process for injecting a reaction gas for etching into a tube and a collapsing process for heating and collapsing the tube in order to minimize or eliminate an index dip existing at the center of the preform core. By using this method, the index dip phenomenon of the optical fiber preform can be minimized or eliminated, so it is possible to make an optical fiber having improved optical characteristics, particularly having improvement in a bandwidth and a polarization mode dispersion (PMD).

摘要翻译： 公开了一种用于制造MCVD中的光纤预制件的方法，其同时进行用于将用于蚀刻的反应气体注入管的蚀刻工艺和用于加热和塌缩管的塌缩过程，以便最小化或消除存在于 预制核心的中心。 通过使用这种方法，可以使光纤预制棒的折射率现象最小化或消除，从而可以制造具有改善的光学特性的光纤，特别是带宽和偏振模色散（PMD）的改善。

公开(公告)号：US07115483B2

公开(公告)日：2006-10-03

申请号：US10962591

申请日：2004-10-13

申请人： Yong Hwan Kwon ,  Se Yong Oh ,  Sa Yoon Kang

发明人： Yong Hwan Kwon ,  Se Yong Oh ,  Sa Yoon Kang

IPC分类号： H01L21/00 ,  H01L21/44 ,  H01L21/30 ,  H01L23/02

CPC分类号： H01L23/3121 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L29/0657 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stacked chip package includes a substrate having an upper surface and a lower surface, a first semiconductor chip having an upper surface and a lower surface, wherein the lower surface of the first semiconductor chip is attached to the upper surface of the substrate and the upper surface of the first semiconductor chip includes a plurality of first electrode pads, and a second semiconductor chip having an upper surface and a lower surface. The lower surface of the second semiconductor chip is attached to the upper surface of the first semiconductor chip, and the lower surface of the second semiconductor chip includes trenches that correspond to the locations of the first electrode pads on the upper surface of the first semiconductor chip.

公开(公告)号：US20060208248A1

公开(公告)日：2006-09-21

申请号：US11249395

申请日：2005-10-14

申请人： Kwang Lee ,  Won Joo ,  Jin Yim ,  Yoon Kang

发明人： Kwang Lee ,  Won Joo ,  Jin Yim ,  Yoon Kang

IPC分类号： H01L23/58 ,  H01L21/4757

CPC分类号： G11C13/0014 ,  B82Y10/00 ,  G11C13/0016 ,  G11C2213/15 ,  H01L45/04 ,  H01L45/085 ,  H01L45/1233 ,  H01L45/1266 ,  H01L45/14 ,  H01L51/0036 ,  H01L51/0591

摘要： A memory device of the current invention includes a memory layer having nanochannels sandwiched between an upper electrode and a lower electrode, in which the memory layer is made of an organic-inorganic complex for use in formation of nanopores, and has metal nanoparticles or metal ions fed into the nanopores. Therefore, the memory device has excellent processability, high reproducibility, and uniform performance.