知搜-全球专利检索

  1. 登录
  2. 注册
发明授权
US07183660B2 Tape circuit substrate and semicondutor chip package using the same 有权
胶带电路基板和半导体芯片封装使用相同

Tape circuit substrate and semicondutor chip package using the same
摘要：
A tape circuit substrate comprises a base film made of an insulating material, and a wiring pattern layer which is formed on the base film and has first leads that are connected to electrode pads arranged near a periphery of a semiconductor chip and second leads that are connected to electrode pads arranged near the center of the semiconductor chip. The semiconductor chip package comprises a semiconductor chip electrically bonded to the tape circuit substrate through chip bumps. In such a case, each of the leads is configured such that a tip end thereof to be bonded to the electrode pad has a width larger than that of a body portion thereof. According to the present invention, since the interval between the lead and the electrode pad can be made even narrower, a fine pitch semiconductor device can be realized.
摘要（中）：

带状电路基板包括由绝缘材料制成的基膜和形成在基膜上的布线图案层，并且具有连接到布置在半导体芯片的周围附近的电极焊盘的第一引线和连接的第二引线 到布置在半导体芯片的中心附近的电极焊盘。 半导体芯片封装包括通过芯片凸块电连接到带电路基板的半导体芯片。 在这种情况下，每个引线被构造成使得其与电极焊盘接合的前端的宽度大于其主体部分的宽度。 根据本发明，由于可以使引线与电极焊盘之间的间隔更窄，所以可以实现精细的间距半导体器件。

公开/授权文献
信息查询
Espacenet
0/0