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公开(公告)号：US20180108477A1
公开(公告)日：2018-04-19
申请号：US15707793
申请日：2017-09-18
发明人： Monsen LIU , Chung-Hao TSAI , En-Hsiang YEH , Chuei-Tang WANG , Chen-Hua YU
IPC分类号： H01F41/04 , H01R43/26 , H01R24/56 , H01F17/00 , H01F27/28 , H01R24/48 , H01R24/40 , H01L49/02 , H01L23/00 , H01L23/64 , H01L23/522 , H01L23/50
CPC分类号： H01F41/04 , H01F17/0006 , H01F27/2804 , H01F41/042 , H01F41/043 , H01F41/045 , H01F41/046 , H01F2027/2814 , H01L23/50 , H01L23/5227 , H01L23/645 , H01L24/29 , H01L28/10 , H01R24/40 , H01R24/48 , H01R24/56 , H01R43/26 , Y10T29/4902 , Y10T29/49073 , Y10T29/49158 , Y10T29/49165 , Y10T29/49169
摘要： A tunable three-dimensional (3D) inductor comprises a plurality of vias arranged with spacing among them, a plurality of interconnects in a metal layer, wherein the plurality of interconnects connect the plurality of vias on one end, and a plurality of tunable wires that connects to the plurality of vias on the other end to form the 3D inductor. The physical configuration and inductance value of the 3D inductor are adjustable by tuning the plurality of tunable wires during manufacturing process.
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公开(公告)号：US20170232251A1
公开(公告)日：2017-08-17
申请号：US15585093
申请日：2017-05-02
发明人： Jordan Neysmith , Robert Greenberg , James Little , Brian Mech , Neil Talbot , Qingfang Yao , David Zhou
CPC分类号： A61N1/0543 , A61N1/0541 , A61N1/36046 , H05K1/028 , H05K1/0353 , H05K1/09 , H05K1/111 , H05K1/115 , H05K1/118 , H05K3/0014 , H05K3/0017 , H05K3/0041 , H05K3/06 , H05K3/188 , H05K3/22 , H05K3/388 , H05K3/4644 , H05K2201/0129 , H05K2201/0133 , H05K2201/0141 , H05K2201/0154 , Y10T29/49156 , Y10T29/49158
摘要： A flexible circuit electrode array with more than one layer of metal traces comprising: a polymer base layer; more than one layer of metal traces, separated by polymer layers, deposited on the polymer base layer, including electrodes suitable to stimulate neural tissue; and a polymer top layer deposited on the polymer base layer and the metal traces. Polymer materials are useful as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision, cochlear stimulation to create artificial hearing, or cortical stimulation many purposes. The pressure applied against the retina, or other neural tissue, by an electrode array is critical. Too little pressure causes increased electrical resistance, along with electric field dispersion. Too much pressure may block blood flow.
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公开(公告)号：US09707031B2
公开(公告)日：2017-07-18
申请号：US14717636
申请日：2015-05-20
申请人： COVIDIEN LP
发明人： Russell D. Hempstead , Keir Hart
CPC分类号： A61B18/1445 , A61B18/1442 , A61B2017/00526 , A61B2018/00077 , A61B2018/00148 , A61B2018/0063 , B29C45/0053 , B29C2045/0079 , B29L2031/7546 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49158 , Y10T29/49162 , Y10T29/49885
摘要： A method of manufacturing a forceps includes providing first and second jaw members and depositing an electrically-conductive tissue sealing plate atop each jaw member via vapor deposition. The jaw members are then coupled to one another to permit movement of one (or both) of the jaw members relative to the other between a spaced-apart position and an approximated position for grasping tissue between the tissue sealing plates thereof.
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公开(公告)号：US09706653B2
公开(公告)日：2017-07-11
申请号：US14766085
申请日：2014-11-04
申请人： LG CHEM, LTD.
发明人： Junghwan Yoon , Jin Hyong Lim , Yong Chan Kim , Ilha Lee , Ki-Hwan Kim
IPC分类号： B32B3/00 , H05K1/09 , G06F3/041 , G06F3/047 , H01L31/02 , H05K1/02 , H05K3/06 , G06F3/044 , H01L31/0224
CPC分类号： H05K1/09 , G06F3/041 , G06F3/044 , G06F3/047 , G06F2203/04103 , H01L31/02008 , H01L31/022425 , H01L31/022466 , H05K1/0274 , H05K3/067 , Y02E10/50 , Y10T29/49158
摘要： The present specification relates to a conductive structure body and a method for manufacturing the same.
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公开(公告)号：US09698459B2
公开(公告)日：2017-07-04
申请号：US14764928
申请日：2014-01-23
CPC分类号： H01P3/12 , H01P1/207 , H01P3/087 , H01P11/002 , H05K1/02 , H05K3/007 , H05K2201/09781 , H05K2201/2009 , Y10T29/49158
摘要： A substrate-based circuit (31) provides a carrier substrate (2), wherein a bond layer (5) is embodied on at least one part of the carrier substrate (2), and wherein a contact layer (6) which forms at least one conductor line (7) and/or at least one antenna element (8) is embodied on at least one first part (51) of the bond layer (5). The carrier substrate (2) provides at least one fastening element (20), which is deposited at the outer region of the carrier substrate (2) and projects beyond the outer region of the carrier substrate (2).
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公开(公告)号：US20170047230A1
公开(公告)日：2017-02-16
申请号：US15293858
申请日：2016-10-14
发明人： Chi-Ching Ho , Ying-Chou Tsai , Sheng-Che Huang
IPC分类号： H01L21/48 , H01L23/00 , H05K3/46 , H05K3/06 , H05K3/34 , H01L21/683 , H01L23/498 , H05K3/40
CPC分类号： H01L21/4853 , H01L21/4857 , H01L21/486 , H01L21/6835 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/49866 , H01L24/16 , H01L24/81 , H01L2221/68345 , H01L2224/16225 , H01L2224/16238 , H01L2224/81193 , H05K3/064 , H05K3/205 , H05K3/3436 , H05K3/4007 , H05K3/4038 , H05K3/4682 , H05K2201/0376 , Y02P70/613 , Y10T29/49158
摘要： A packaging substrate is disclosed, which includes: a dielectric layer; a circuit layer embedded in and exposed from a surface of the dielectric layer, wherein the circuit layer has a plurality of conductive pads; and a plurality of conductive bumps formed on the conductive pads and protruding above the surface of the dielectric layer. As such, when an electronic element is disposed on the conductive pads through a plurality of conductive elements, the conductive elements can come into contact with both top and side surfaces of the conductive bumps so as to increase the contact area between the conductive elements and the conductive pads, thereby strengthening the bonding between the conductive elements and the conductive pads and preventing delamination of the conductive elements from the conductive pads.
摘要翻译： 公开了一种封装基板，包括：介电层; 电介质层，其中所述电路层嵌入并暴露于所述电介质层的表面，其中所述电路层具有多个导电焊盘; 以及形成在所述导电焊盘上并突出在所述电介质层的表面上方的多个导电凸块。 这样，当通过多个导电元件将电子元件设置在导电焊盘上时，导电元件可以与导电凸块的顶表面和侧表面接触，从而增加导电元件与导电元件之间的接触面积 导电焊盘，从而加强导电元件和导电焊盘之间的接合，并防止导电元件与导电焊盘分层。
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7.发明授权公开(公告)号：US09559293B2
公开(公告)日：2017-01-31
申请号：US13594974
申请日：2012-08-27
申请人： Udo Ausserlechner
发明人： Udo Ausserlechner
CPC分类号： H01L43/02 , G01R33/072 , H01L43/00 , H01L43/12 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/49171 , H01L2224/73265 , Y10T29/49121 , Y10T29/49158 , H01L2924/00014 , H01L2924/00
摘要： An integrated circuit includes a magnetic field sensor and an injection molded magnetic material enclosing at least a portion of the magnetic field sensor.
摘要翻译： 集成电路包括磁场传感器和封装有磁场传感器的至少一部分的注射成型的磁性材料。
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公开(公告)号：US20160378144A1
公开(公告)日：2016-12-29
申请号：US15250224
申请日：2016-08-29
申请人： Dell Products L.P.
CPC分类号： G06F1/1656 , B29C45/14336 , B29C70/68 , B29C70/882 , B29C71/02 , B29C2071/022 , B29K2105/16 , B29K2509/02 , B29L2031/3481 , Y10T29/49158
摘要： An information handling system chassis is built at least in part from ceramic elements. For example, a transparent aluminum oxide ceramic portion covers a touchscreen to provide a rigid outer surface for accepting end user inputs. As another example, a ceramic chassis element has a ceramic material formed around a metal material of similar substance with bonding of the ceramic to the underlying material enhanced with oxidation of the outer surface of the metal material.
摘要翻译： 信息处理系统底盘至少部分地由陶瓷元件构成。 例如，透明氧化铝陶瓷部分覆盖触摸屏以提供用于接受最终用户输入的刚性外表面。 作为另一示例，陶瓷底盘元件具有形成在具有相似物质的金属材料周围的陶瓷材料，其中陶瓷与通过金属材料的外表面的氧化而增强的下层材料结合。
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9.发明申请A circuit on a thin carrier for use in hollow conductors and a manufacturing method 有权用于中空导体的薄载体上的电路和制造方法公开(公告)号：US20150372368A1
公开(公告)日：2015-12-24
申请号：US14764928
申请日：2014-01-23
CPC分类号： H01P3/12 , H01P1/207 , H01P3/087 , H01P11/002 , H05K1/02 , H05K3/007 , H05K2201/09781 , H05K2201/2009 , Y10T29/49158
摘要： A substrate-based circuit (31) provides a carrier substrate (2), wherein a bond layer (5) is embodied on at least one part of the carrier substrate (2), and wherein a contact layer (6) which forms at least one conductor line (7) and/or at least one antenna element (8) is embodied on at least one first part (51) of the bond layer (5). The carrier substrate (2) provides at least one fastening element (20), which is deposited at the outer region of the carrier substrate (2) and projects beyond the outer region of the carrier substrate (2).
摘要翻译： 基于基板的电路（31）提供载体基板（2），其中在载体基板（2）的至少一部分上具有接合层（5），并且其中至少形成接触层（6） 一个导线（7）和/或至少一个天线元件（8）被实施在接合层（5）的至少一个第一部分（51）上。 载体基板（2）提供至少一个紧固元件（20），其被沉积在载体基板（2）的外部区域并突出超出载体基板（2）的外部区域。
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公开(公告)号：US20150366068A1
公开(公告)日：2015-12-17
申请号：US14415694
申请日：2014-04-22
发明人： Fangzhen ZHANG
CPC分类号： H05K3/0017 , G06F3/044 , G06F2203/04103 , G06F2203/04111 , H05K1/0274 , H05K1/0284 , H05K1/162 , H05K3/0023 , H05K3/4644 , H05K2201/0108 , H05K2201/0195 , H05K2201/0326 , H05K2201/10128 , Y10T29/49147 , Y10T29/49155 , Y10T29/49158
摘要： The present disclosure relates to the field of touch technology, and provides a touch panel and its manufacturing method. In the touch panel, a transparent conductive layer is partitioned by a height difference structure into first electrodes, an array of second electrode components and filling blocks. The array of second electrode components is connected serially by an array of conductive bridging lines so as to form several columns of second electrodes. A layout process for the transparent conductive layer will be omitted, and as a result, it is able to reduce the process steps and the production cost. In addition, the transparent conductive layer covers the entire base substrate, and as a result, it is able to improve the evenness of the transmittance and reflectance of the entire touch panel, thereby to improve the evenness of the image display.
摘要翻译： 本公开涉及触摸技术领域，并且提供了触摸面板及其制造方法。 在触摸面板中，透明导电层通过高差结构划分为第一电极，第二电极组件和填充块的阵列。 第二电极部件的阵列通过导电桥接线的阵列串联连接，以形成多列第二电极。 将省略透明导电层的布局处理，结果能够减少工艺步骤和生产成本。 此外，透明导电层覆盖整个基底基板，结果能够提高整个触摸面板的透射率和反射率的均匀性，从而提高图像显示的均匀性。
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