公开(公告)号：US08420444B2

公开(公告)日：2013-04-16

申请号：US13028419

申请日：2011-02-16

申请人： Motoaki Tani ,  Shinya Iijima ,  Shinichi Sugiura ,  Hiromichi Watanabe

发明人： Motoaki Tani ,  Shinya Iijima ,  Shinichi Sugiura ,  Hiromichi Watanabe

IPC分类号： H01L23/492 ,  H01L21/52 ,  H01L23/498

CPC分类号： H01L23/49811 ,  H01L21/563 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/81 ,  H01L2224/02166 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02331 ,  H01L2224/0239 ,  H01L2224/0345 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05024 ,  H01L2224/05166 ,  H01L2224/05567 ,  H01L2224/05644 ,  H01L2224/0603 ,  H01L2224/06102 ,  H01L2224/09103 ,  H01L2224/1134 ,  H01L2224/11462 ,  H01L2224/11472 ,  H01L2224/13014 ,  H01L2224/13021 ,  H01L2224/13023 ,  H01L2224/13024 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/141 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81444 ,  H01L2224/81801 ,  H01L2224/83104 ,  H01L2224/92 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/80203 ,  H01L2224/11 ,  H01L21/78 ,  H01L2224/81 ,  H01L2924/01047 ,  H01L2224/05552

摘要： A semiconductor device includes a first bump that is located over a surface of a semiconductor element, and is formed on a first bump formation face distanced from a back surface of the semiconductor element at a first distance, and a second bump that is located over the surface of the semiconductor element, and is formed on a second bump formation face distanced from the back surface of the semiconductor element at a second distance being longer than the first distance, the second bump having a diameter larger than a diameter of the first bump.

摘要翻译： 半导体器件包括位于半导体元件的表面上方的第一凸点，并且形成在距半导体元件的背面远离第一距离处的第一凸起形成面和位于半导体元件的上方的第二凸起 并且形成在距离半导体元件的背面远离第二距离的第二凸起形成面上，第二距离比第一距离长，第二凸起的直径大于第一凸起的直径。

公开(公告)号：US07388157B2

公开(公告)日：2008-06-17

申请号：US11320965

申请日：2005-12-30

申请人： Tomoyuki Abe ,  Nobuyuki Hayashi ,  Motoaki Tani ,  Kenichiro Abe ,  Kenji Iida

发明人： Tomoyuki Abe ,  Nobuyuki Hayashi ,  Motoaki Tani ,  Kenichiro Abe ,  Kenji Iida

IPC分类号： H05K1/03

CPC分类号： G01R1/07314 ,  G01R1/44 ,  H05K1/0366 ,  H05K1/056 ,  H05K1/117 ,  H05K3/429 ,  H05K3/4608 ,  H05K3/4623 ,  H05K3/4641 ,  H05K3/4688 ,  H05K2201/0323 ,  H05K2201/0919 ,  H05K2201/09536 ,  H05K2201/09845 ,  H05K2203/061

摘要： A printed wiring board is made of first and second substrates superimposed on each other. The first and second substrates respectively include a core layer made of resin containing carbon fibers. The second substrate has the outline different from that of the first substrate. A stepped surface is defined on the front surface at least of the first substrate. Electrodes can be formed on the stepped surface as well as on the back surface of the first substrate and the front surface of the second substrate. This structure enables detection of an electric signal from the stepped surface. A further flexibility can thus be achieved in locating electrodes as compared with a conventional printed wiring board having uniform substrates simply superimposed on each other. This results in an expanded use or purpose for a printed wiring board.

摘要翻译： 印刷电路板由彼此重叠的第一和第二基板制成。 第一和第二基板分别包括由含有碳纤维的树脂制成的芯层。 第二基板具有与第一基板的轮廓不同的轮廓。 至少在第一基板的表面上限定有台阶面。 电极可以形成在阶梯表面以及第一基板的背面和第二基板的前表面上。 该结构能够检测来自台阶表面的电信号。 因此与具有简单地叠加的均匀基板的传统印刷线路板相比，可以在定位电极方面实现更大的灵活性。 这导致印刷电路板的使用或目的的扩大。

公开(公告)号：US20070186414A1

公开(公告)日：2007-08-16

申请号：US11737340

申请日：2007-04-19

申请人： Tomoyuki ABE ,  Nobuyuki Hayashi ,  Motoaki Tani

发明人： Tomoyuki ABE ,  Nobuyuki Hayashi ,  Motoaki Tani

IPC分类号： H05K1/11

CPC分类号： H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0366 ,  H05K1/056 ,  H05K1/09 ,  H05K3/429 ,  H05K3/4608 ,  H05K3/4641 ,  H05K3/4688 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0355 ,  H05K2201/09536 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49162 ,  Y10T428/24917 ,  H01L2924/00

摘要： A multilayer wiring board (X1) comprises a core portion (100) and out-core wiring portion (30). The core portion (100) comprises a carbon fiber reinforced portion (10) composed of a carbon fiber material (11) and resin composition (12), and an in-core wiring portion (20) which has a laminated structure of at least one insulating layer (21) containing a glass fiber material (21a) and a wiring pattern (22) composed of a conductor having an elastic modulus of 10 to 40 GPa and which is bonded to the carbon fiber reinforced portion (10). The out-core wiring portion (30) has a laminated structure of at least one insulating layer (31) and a wiring pattern (32) and is bonded to the core portion (100) at the in-core wiring portion (20).

摘要翻译： 多层布线板（X 1）包括芯部（100）和外芯布线部（30）。 芯部（100）包括由碳纤维材料（11）和树脂组合物（12）构成的碳纤维增强部（10），以及具有层叠结构的芯内配线部（20） 包含玻璃纤维材料（21a）的绝缘层（21）和由弹性模量为10〜40GPa的导体构成并与碳纤维增强部（10）接合的布线图案（22）。 外芯接线部（30）具有至少一个绝缘层（31）和布线图案（32）的叠层结构，并且在芯部布线部（20）处与芯部（100）接合。

公开(公告)号：US5972562A

公开(公告)日：1999-10-26

申请号：US819804

申请日：1997-03-18

申请人： Motoaki Tani ,  Hiroyuki Machida ,  Nobuyuki Hayashi

发明人： Motoaki Tani ,  Hiroyuki Machida ,  Nobuyuki Hayashi

IPC分类号： G03F7/027 ,  C09D4/00 ,  C09D4/06 ,  C09D163/00 ,  G03F7/031 ,  G03F7/038 ,  H05K3/28 ,  G03C1/73

CPC分类号： G03F7/0385 ,  G03F7/031 ,  H05K3/287 ,  Y10S430/114 ,  Y10S430/116 ,  Y10S430/121

摘要： A visible radiation-curable solder resist composition which comprises a resin component, a component for promoting photo-polymerization or -crosslinking, and optionally a diluent and any other additives, the resion componebt comprising a novolak resin skeleton and a polyfunctional acrylic monomer and the component for promoting photo-polymerization or -crosslinking comprising a photo-reaction initiator, a sensitizing dye and a heterocyclic compound having at least two endocyclic nitrogen atoms.

摘要翻译： 一种可见的可辐射固化阻焊组合物，其包含树脂组分，用于促进光聚合或交联的组分，以及任选的稀释剂和任何其它添加剂，所述组合物包含酚醛清漆树脂骨架和多官能丙烯酸单体， 用于促进包含光反应引发剂，敏化染料和具有至少两个环内氮原子的杂环化合物的光聚合或交联。

公开(公告)号：US07799604B2

公开(公告)日：2010-09-21

申请号：US11822084

申请日：2007-07-02

申请人： Tomoyuki Abe ,  Motoaki Tani

发明人： Tomoyuki Abe ,  Motoaki Tani

IPC分类号： H01L21/44

CPC分类号： H01L21/4857 ,  H01L23/13 ,  H01L23/36 ,  H01L23/49833 ,  H01L23/5389 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3011 ,  H01L2924/3511

摘要： A semiconductor device includes a support body, a first substrate provided on a surface at one side of the support body, a second substrate provided on a surface at the other side of the support body, and a semiconductor chip provided on the first substrate exposed to an opening part piercing the support body and the second substrate. The first substrate includes a first dielectric layer and a wiring layer, a plurality of first electrodes connected to the semiconductor chip which first electrodes are provided on a first surface of the first substrate exposed to an inside of the opening part, and the second substrate includes a second dielectric layer made of a material substantially the same as the first dielectric layer.

摘要翻译： 半导体器件包括支撑体，设置在支撑体的一侧的表面上的第一基板，设置在支撑体的另一侧的表面上的第二基板和设置在第一基板上的半导体芯片， 穿过所述支撑体和所述第二基板的开口部。 第一基板包括第一电介质层和布线层，多个与半导体芯片连接的第一电极，第一电极设置在暴露于开口部的内部的第一基板的第一表面上，第二基板包括 由与第一电介质层基本相同的材料制成的第二电介质层。

公开(公告)号：US07400035B2

公开(公告)日：2008-07-15

申请号：US11023044

申请日：2004-12-28

申请人： Tomoyuki Abe ,  Motoaki Tani

发明人： Tomoyuki Abe ,  Motoaki Tani

IPC分类号： H01L23/04 ,  H01L21/48

CPC分类号： H01L21/4857 ,  H01L23/13 ,  H01L23/36 ,  H01L23/49833 ,  H01L23/5389 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3011 ,  H01L2924/3511

摘要： A semiconductor device includes a support body, a first substrate provided on a surface at one side of the support body, a second substrate provided on a surface at the other side of the support body, and a semiconductor chip provided on the first substrate exposed to an opening part piercing the support body and the second substrate. The first substrate includes a first dielectric layer and a wiring layer, a plurality of first electrodes connected to the semiconductor chip which first electrodes are provided on a first surface of the first substrate exposed to an inside of the opening part, and the second substrate includes a second dielectric layer made of a material substantially the same as the first dielectric layer.

摘要翻译： 半导体器件包括支撑体，设置在支撑体的一侧的表面上的第一基板，设置在支撑体的另一侧的表面上的第二基板和设置在第一基板上的半导体芯片， 穿过所述支撑体和所述第二基板的开口部。 第一基板包括第一介电层和布线层，多个与半导体芯片连接的第一电极，第一电极设置在暴露于开口部的内部的第一基板的第一表面上，第二基板包括 由与第一电介质层基本相同的材料制成的第二电介质层。

公开(公告)号：US20060175084A1

公开(公告)日：2006-08-10

申请号：US11138467

申请日：2005-05-27

申请人： Keishiro Okamoto ,  Tomoyuki Abe ,  Motoaki Tani ,  Nobuyuki Hayashi

发明人： Keishiro Okamoto ,  Tomoyuki Abe ,  Motoaki Tani ,  Nobuyuki Hayashi

IPC分类号： H05K1/11 ,  H05K3/42

CPC分类号： H05K3/445 ,  H05K1/056 ,  H05K3/426 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/09581 ,  H05K2203/135 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165

摘要： The wiring board comprises a plate-shaped conductive core material 10 with a through-hole 12 formed in, an insulation layer 14 formed on the surface of the conductive core material 10 and on the inside wall of the through-hole 12, a resin 18 buried in the through-hole 12 with the insulation layer 14 formed in, wirings 22a, 22b formed on the upper surface and the undersurface of the conductive core material 10 with the insulation layer 14 formed on, and an wiring 22d formed in the through-hole 20 formed in the resin 18 and electrically connected to the wirings 22a, 22b.

摘要翻译： 布线板包括具有形成在其中的通孔12的板状导电芯材10，形成在导电芯材10的表面上的绝缘层14和通孔12的内壁上的树脂18 埋置在通孔12中，其中形成有绝缘层14，形成在形成有绝缘层14的导电芯材10的上表面和下表面上的布线22a，22b以及形成在其中的布线22d 通孔20形成在树脂18中并电连接到布线22a，22b。

公开(公告)号：US20060108147A1

公开(公告)日：2006-05-25

申请号：US11320965

申请日：2005-12-30

申请人： Tomoyuki Abe ,  Nobuyuki Hayashi ,  Motoaki Tani ,  Kenichiro Abe ,  Kenji Iida

发明人： Tomoyuki Abe ,  Nobuyuki Hayashi ,  Motoaki Tani ,  Kenichiro Abe ,  Kenji Iida

IPC分类号： H05K1/11 ,  H01R12/04

CPC分类号： G01R1/07314 ,  G01R1/44 ,  H05K1/0366 ,  H05K1/056 ,  H05K1/117 ,  H05K3/429 ,  H05K3/4608 ,  H05K3/4623 ,  H05K3/4641 ,  H05K3/4688 ,  H05K2201/0323 ,  H05K2201/0919 ,  H05K2201/09536 ,  H05K2201/09845 ,  H05K2203/061

摘要： A printed wiring board is made of first and second substrates superimposed on each other. The first and second substrates respectively include a core layer made of resin containing carbon fibers. The second substrate has the outline different from that of the first substrate. A stepped surface is defined on the front surface at least of the first substrate. Electrodes can be formed on the stepped surface as well as on the back surface of the first substrate and the front surface of the second substrate. This structure enables detection of an electric signal from the stepped surface. A further flexibility can thus be achieved in locating electrodes as compared with a conventional printed wiring board having uniform substrates simply superimposed on each other. This results in an expanded use or purpose for a printed wiring board.

摘要翻译： 印刷电路板由彼此重叠的第一和第二基板制成。 第一和第二基板分别包括由含有碳纤维的树脂制成的芯层。 第二基板具有与第一基板的轮廓不同的轮廓。 至少在第一基板的表面上限定有台阶面。 电极可以形成在台阶表面以及第一基板的背面和第二基板的前表面上。 该结构能够检测来自台阶表面的电信号。 因此与具有简单地叠加的均匀基板的传统印刷线路板相比，可以在定位电极方面实现更大的灵活性。 这导致印刷电路板的使用或目的的扩大。

公开(公告)号：US07002080B2

公开(公告)日：2006-02-21

申请号：US10629770

申请日：2003-07-30

申请人： Motoaki Tani ,  Nobuyuki Hayashi ,  Tomoyuki Abe ,  Yasuhito Takahashi ,  Takashi Shuto

发明人： Motoaki Tani ,  Nobuyuki Hayashi ,  Tomoyuki Abe ,  Yasuhito Takahashi ,  Takashi Shuto

IPC分类号： H05K1/00

CPC分类号： H05K3/4641 ,  H05K1/0366 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/0323 ,  H05K2201/09536 ,  Y10T428/24917

摘要： A multilayer wiring board is composed of a core portion, a first wiring portion and a second wiring portion. The core portion includes a core insulating layer containing a carbon fiber material. The first wiring portion is bonded to the core portion and has a laminated structure including at least a first insulating layer and a first wiring pattern, the first insulating layer containing glass cloth. The second wiring portion is bonded to the first wiring portion and has a laminated structure including at least a second insulating layer and a second wiring pattern. The core portion, the first wiring portion and the second wiring portion are arranged in a stack.

摘要翻译： 多层布线板由芯部，第一布线部和第二布线部构成。 芯部包括含有碳纤维材料的芯绝缘层。 第一布线部分结合到芯部，并具有包括至少第一绝缘层和第一布线图案的层压结构，第一绝缘层包含玻璃布。 第二布线部分接合到第一布线部分，并且具有至少包括第二绝缘层和第二布线图案的层叠结构。 芯部分，第一布线部分和第二布线部分布置成堆叠。

公开(公告)号：US5236772A

公开(公告)日：1993-08-17

申请号：US761646

申请日：1991-09-18

申请人： Eiji Horikoshi ,  Motoaki Tani ,  Isao Watanabe ,  Katsuhide Natori ,  Takehiko Sato

发明人： Eiji Horikoshi ,  Motoaki Tani ,  Isao Watanabe ,  Katsuhide Natori ,  Takehiko Sato

IPC分类号： H05K1/05 ,  H05K3/00 ,  H05K3/44 ,  H05K3/46 ,  H05K5/02

CPC分类号： H05K1/056 ,  H05K3/44 ,  H05K2201/0166 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2203/135 ,  H05K3/0023 ,  H05K3/0041 ,  H05K3/445 ,  H05K3/4608 ,  H05K3/4644 ,  Y10T428/24917 ,  Y10T428/256

摘要： A circuit board comprising: a core material made from magnesium, a magnesium alloy, or a magnesium-based composite material, and an electric circuit formed on the core material. A process for producing the circuit board comprises the steps of (1) forming an electrodeposition-painted coating on such a core material, (2) forming a polyimide resin coating on the electrodeposition-painted coating, (3) forming a via hole extending through the resin coating to the underlying electrodeposition-painted coating, (4) etching and removing the electrodeposition-painted coating in the region exposed in the bottom of the via hole while masking the other region with the resin coating thereby extending the via hole to the core material, (5) forming a metal film on at least a free surface of the resin coating and an inner surface of the extended via hole, and (6) etching the metal film by using a photoresist mask to form a conductor layer having a predetermined pattern.