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    SHIELDED PROBE SYSTEMS WITH CONTROLLED TESTING ENVIRONMENTS
    3.
    发明申请
    SHIELDED PROBE SYSTEMS WITH CONTROLLED TESTING ENVIRONMENTS 审中-公开

    公开(公告)号：US20180031608A1

    公开(公告)日：2018-02-01

    申请号：US15725650

    申请日：2017-10-05

    Applicant: Cascade Microtech, Inc.

    Inventor： Michael Teich ,  Karsten Stoll ,  Walter Matthias Clauss ,  Swen Schmiedchen

    IPC: G01R1/18 ,  G01R1/44 ,  G01R1/067

    CPC classification number: G01R1/18 ,  G01N27/42 ,  G01N31/02 ,  G01R1/06711 ,  G01R1/07378 ,  G01R1/07392 ,  G01R1/44

    Abstract: Shielded probe systems are disclosed herein. The shielded probe systems are configured to test a device under test (DUT) and include an enclosure that defines an enclosure volume, a translation stage with a stage surface, a substrate-supporting assembly extending from the stage surface, an electrically conductive shielding structure, an isolation structure, and a thermal shielding structure. The substrate-supporting assembly includes an electrically conductive support surface, which is configured to support a substrate that includes the DUT. The electrically conductive shielding structure defines a shielded volume. The isolation structure electrically isolates the electrically conductive shielding structure from the enclosure and from the translation stage. The thermal shielding structure extends within the enclosure volume and at least partially between the enclosure and the substrate-supporting assembly.

    SHIELDED PROBE SYSTEMS WITH CONTROLLED TESTING ENVIRONMENTS
    4.
    发明申请
    SHIELDED PROBE SYSTEMS WITH CONTROLLED TESTING ENVIRONMENTS 有权

    公开(公告)号：US20170292974A1

    公开(公告)日：2017-10-12

    申请号：US15094716

    申请日：2016-04-08

    Applicant: Cascade Microtech, Inc.

    Inventor： Michael Teich ,  Karsten Stoll ,  Walter Matthias Clauss ,  Swen Schmiedchen

    IPC: G01R1/18 ,  G01R1/44 ,  G01R1/067

    CPC classification number: G01R1/18 ,  G01N27/42 ,  G01N31/02 ,  G01R1/06711 ,  G01R1/07378 ,  G01R1/07392 ,  G01R1/44

    Abstract: Shielded probe systems are disclosed herein. The shielded probe systems are configured to test a device under test (DUT) and include an enclosure that defines an enclosure volume, a translation stage with a stage surface, a substrate-supporting stack extending from the stage surface, an electrically conductive shielding structure, an isolation structure, and a thermal shielding structure. The substrate-supporting stack includes an electrically conductive support surface and a temperature-controlled chuck. The electrically conductive shielding structure defines a shielded volume. The isolation structure electrically isolates the electrically conductive shielding structure from the enclosure and from the translation stage. The thermal shielding structure extends within the enclosure volume and at least partially between the enclosure and the substrate-supporting stack.

    Manufacturing a Low Profile Current Measurement Connector
    6.
    发明申请
    Manufacturing a Low Profile Current Measurement Connector 审中-公开
    制造薄型电流测量连接器

    公开(公告)号：US20160003870A1

    公开(公告)日：2016-01-07

    申请号：US14856988

    申请日：2015-09-17

    Applicant: NATIONAL INSTRUMENTS CORPORATION

    Inventor： David R. Pasternak

    IPC: G01R3/00 ,  G01R1/44 ,  G01R1/04 ,  G01R1/36 ,  G01R19/00

    CPC classification number: G01R19/0092 ,  G01R1/0416 ,  G01R1/36 ,  G01R1/44 ,  G01R3/00 ,  G01R15/18 ,  H01R13/504 ,  H01R13/6633 ,  H01R43/24 ,  H01R2201/20 ,  Y10T29/49208

    Abstract: A current measurement connector may include a first part and a second part. Each part may include a mount and a joint. The first and second part may be joined via the respective joints through a current transformer interposed between the first and second parts. The respective mounts may be configured to receive a current from a current source and pass the received current through the current transformer via the first and second parts inducing a current in the current transformer. The induced current may be useable to measure the current from the current source. Methods for fabricating the current measurement connector may include die casting the first and second parts and press fitting the first and second parts at the respective joints through the current transformer. Methods for use may include withstanding a fault current pulse and dissipating heat associated with the pulse via the first and second parts.

    Abstract translation: 电流测量连接器可以包括第一部分和第二部分。 每个部件可以包括一个安装座和一个接头。 第一和第二部分可以通过插入在第一和第二部分之间的电流互感器经由各个接头连接。 相应的安装件可以被配置为从电流源接收电流，并且经由第一和第二部分使接收的电流通过电流互感器，从而在电流互感器中引起电流。 感应电流可用于测量来自电流源的电流。 用于制造电流测量连接器的方法可以包括压铸第一和第二部分，并且通过电流互感器将各个接头处的第一和第二部分压配合。 使用的方法可以包括经由第一和第二部分承受故障电流脉冲并耗散与脉冲相关的热量。

    CAPACITANCE DETECTION DEVICE
    7.
    发明申请
    CAPACITANCE DETECTION DEVICE 有权
    电容检测装置

    公开(公告)号：US20150233972A1

    公开(公告)日：2015-08-20

    申请号：US14331927

    申请日：2014-07-15

    Applicant: KABUSHIKI KAISHA TOSHIBA

    Inventor： Daiki ONO ,  Jun DEGUCHI

    IPC: G01R1/44 ,  G01R27/26 ,  G01R1/30

    CPC classification number: G01R1/44 ,  G01R27/2605

    Abstract: According to one embodiment, a capacitance detection device includes a switched capacitor amplifying circuit including a variable capacitor and a reference capacitor, and a voltage applying circuit configured to apply, to the switched capacitor amplifying circuit, a reference voltage having a temperature characteristic for compensating fluctuation in an output voltage of the switched capacitor amplifying circuit due to a temperature characteristic of capacitance of the variable capacitor.

    Abstract translation: 根据一个实施例，电容检测装置包括具有可变电容器和参考电容器的开关电容器放大电路，以及电压施加电路，被配置为向开关电容放大电路施加具有用于补偿波动的温度特性的参考电压 在开关电容放大电路的输出电压中，由于可变电容器的电容的温度特性。

    Temperature compensated proximity sensor
    8.
    发明授权
    Temperature compensated proximity sensor 有权
    温度补偿接近传感器

    公开(公告)号：US09110103B2

    公开(公告)日：2015-08-18

    申请号：US13770285

    申请日：2013-02-19

    Applicant: HONEYWELL INTERNATIONAL INC.

    Inventor： John Kenneth Tillotson

    IPC: G01R27/28 ,  G01R31/08 ,  G01R1/44 ,  H03K17/95

    CPC classification number: G01R1/44 ,  H03K17/9502 ,  H03K17/9525 ,  H03K17/9547

    Abstract: A proximity sensor includes a relatively simple temperature compensation circuit, and includes a variable gain oscillator, a temperature sensor circuit, and a proximity determination circuit. The variable gain oscillator has a gain that varies with the proximity of a target to a sensor coil, generates an oscillating electrical signal having a substantially constant amplitude magnitude, and generates an energy signal representative of the electrical energy needed to sustain oscillations. The temperature compensation circuit senses proximity sensor temperature and supplies a temperature signal representative thereof, and the proximity determination circuit, based on the energy signal, supplies a proximity signal representative of target proximity to the sensor coil. The proximity determination circuit includes a comparator and a fixed resistor network. The comparator circuit supplies the proximity signal. The fixed resistor network is coupled between the temperature sensor circuit and comparator circuit and supplies a temperature compensation signal to the comparator circuit.

    Abstract translation: 接近传感器包括相对简单的温度补偿电路，并且包括可变增益振荡器，温度传感器电路和接近确定电路。 可变增益振荡器具有随着目标与传感器线圈的接近度而变化的增益，产生具有基本恒定幅度幅度的振荡电信号，并且产生代表维持振荡所需的电能的能量信号。 温度补偿电路检测接近传感器温度并提供代表其的温度信号，并且接近确定电路基于能量信号，提供代表传感器线圈的目标接近度的接近信号。 接近确定电路包括比较器和固定电阻器网络。 比较器电路提供接近信号。 固定电阻网络耦合在温度传感器电路和比较器电路之间，并向比较器电路提供温度补偿信号。

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