公开(公告)号：US20110299255A1

公开(公告)日：2011-12-08

申请号：US13212467

申请日：2011-08-18

Applicant: Teru NAKANISHI ,  Nobuyuki HAYASHI ,  Masaru MORITA ,  Yasuhiro YONEDA

Inventor： Teru NAKANISHI ,  Nobuyuki HAYASHI ,  Masaru MORITA ,  Yasuhiro YONEDA

IPC: H05K1/18 ,  H01L21/60

CPC classification number: H05K1/0296 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/4985 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/1379 ,  H01L2224/13839 ,  H01L2224/13847 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15311 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/10287 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10719 ,  Y02P70/613 ,  H01L2924/00

Abstract: A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.

Abstract translation: 半导体器件包括：布线板，其表面上包括第一电极焊盘; 电路板，被布置成站立在所述布线板上，并且包括连接到所述第一电极焊盘的互连; 以及半导体封装，其设置成与所述布线板面对所述电路板，并且在其表面上包括第二电极焊盘，所述第二电极焊盘连接到所述互连。

公开(公告)号：US07721455B2

公开(公告)日：2010-05-25

申请号：US12289684

申请日：2008-10-31

Applicant: Sadayuki Matsumiya ,  Mikio Suzuki ,  Shuji Hayashida ,  Yoshiaki Shiraishi ,  Nobuyuki Hayashi

Inventor： Sadayuki Matsumiya ,  Mikio Suzuki ,  Shuji Hayashida ,  Yoshiaki Shiraishi ,  Nobuyuki Hayashi

IPC: G01B7/02

CPC classification number: G01B3/205

Abstract: A measuring instrument includes a detector that outputs a measured value, a digital display unit, an analog display unit having a plurality of display segments, and a display controller. The display controller includes: a tolerance range display unit that lights or blinks display segments corresponding to a preset tolerance range relative to a preset value; a first determiner that obtains a difference between the present value and a present measured value and determines whether the difference is within an analog display range wider than the tolerance range; a difference display unit that lights a display segment corresponding to the last one or the last two digits of the present measured value when the first determiner determines that the difference is within the analog display range; a second determiner that determines whether the difference is within the tolerance range; and an acceptance or rejection display unit that displays a result determined by the second determiner.

Abstract translation: 测量仪器包括输出测量值的检测器，数字显示单元，具有多个显示段的模拟显示单元和显示控制器。 显示控制器包括：公差范围显示单元，其相对于预设值点亮或闪烁与预设公差范围相对应的显示段; 第一确定器，其获得当前值和当前测量值之间的差异，并且确定差异是否在比公差范围更宽的模拟显示范围内; 差分显示单元，当第一确定器确定差在模拟显示范围内时，点亮与当前测量值的最后两位数相对应的显示段; 确定差值是否在公差范围内的第二确定器; 以及显示由第二确定器确定的结果的接受或拒绝显示单元。

公开(公告)号：US07436679B2

公开(公告)日：2008-10-14

申请号：US11188113

申请日：2005-07-25

Applicant: Shinya Iijima ,  Tomoyuki Abe ,  Nobuyuki Hayashi ,  Yoji Ohashi ,  Toshihiro Shimura

Inventor： Shinya Iijima ,  Tomoyuki Abe ,  Nobuyuki Hayashi ,  Yoji Ohashi ,  Toshihiro Shimura

IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC classification number: H01Q1/2283 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/16152 ,  H01Q1/22 ,  H01Q9/04 ,  H01Q9/0407 ,  H01Q21/0025 ,  H05K1/0237 ,  H05K3/0058 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A communication radio-frequency module is provided that has a semiconductor device to which an antenna element is connected. This communication radio-frequency module includes: a supporting body that has a waveguide formed therein; a wiring board that is fixed onto a surface of the supporting body; the semiconductor device that is flip-chip mounted onto the wiring board by ultrasonic bonding; and the antenna element that is disposed on the other surface of the supporting body. In this module, the wiring board includes a board core member that is made of a resin material, and the supporting body includes a supporting body core member that is also made of a resin material.

Abstract translation: 提供一种具有连接有天线元件的半导体器件的通信射频模块。 该通信射频模块包括：形成有波导的支撑体; 固定在支撑体的表面上的布线板; 通过超声波接合将倒装芯片安装在布线板上的半导体器件; 以及设置在支撑体的另一个表面上的天线元件。 在该模块中，布线板包括由树脂材料制成的板芯构件，并且支撑体包括也由树脂材料制成的支撑体芯构件。

公开(公告)号：US07420130B2

公开(公告)日：2008-09-02

申请号：US11812124

申请日：2007-06-15

Applicant: Keishiro Okamoto ,  Tomoyuki Abe ,  Motoaki Tani ,  Nobuyuki Hayashi

Inventor： Keishiro Okamoto ,  Tomoyuki Abe ,  Motoaki Tani ,  Nobuyuki Hayashi

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H05K3/445 ,  H05K1/056 ,  H05K3/426 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/09581 ,  H05K2203/135 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: The wiring board comprises a plate-shaped conductive core material 10 with a through-hole 12 formed in, an insulation layer 14 formed on the surface of the conductive core material 10 and on the inside wall of the through-hole 12, a resin 18 buried in the through-hole 12 with the insulation layer 14 formed in, wirings 22a, 22b formed on the upper surface and the undersurface of the conductive core material 10 with the insulation layer 14 formed on, and an wiring 22d formed in the through-hole 20 formed in the resin 18 and electrically connected to the wirings 22a, 22b.

Abstract translation: 布线板包括具有形成在其中的通孔12的板状导电芯材10，形成在导电芯材10的表面上的绝缘层14和通孔12的内壁上的树脂18 埋置在通孔12中，其中形成有绝缘层14，形成在形成有绝缘层14的导电芯材10的上表面和下表面上的布线22a，22b以及形成在其中的布线22d 通孔20形成在树脂18中并电连接到布线22a，22b。

公开(公告)号：US20070013581A1

公开(公告)日：2007-01-18

申请号：US11167568

申请日：2005-06-28

Applicant: Shinya Iijima ,  Tomoyuki Abe ,  Nobuyuki Hayashi ,  Yoji Ohashi ,  Toshihiro Shimura

Inventor： Shinya Iijima ,  Tomoyuki Abe ,  Nobuyuki Hayashi ,  Yoji Ohashi ,  Toshihiro Shimura

IPC: G01S7/28

CPC classification number: G01S7/032 ,  G01S13/931 ,  H01L23/552 ,  H01L23/66 ,  H01L25/16 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1903 ,  H01L2924/19105 ,  H01L2924/3011

Abstract: A high-frequency module includes a stiffener (a support substrate), a resin base member of which one surface is fixed to the stiffener, a first conductive pattern formed on said one surface of the resin base member, a second conductive pattern formed on the other surface of the resin base member for constituting a waveguide in combination with the first conductive pattern to pass a high-frequency signal through the resin base member and including a window for allowing the high-frequency signal to pass therethrough, a cap for covering a semiconductor element and for absorbing or reflecting the high-frequency signal, an adopter (a waveguide tube) fixed onto the second conductive pattern such that one open end thereof surrounds the window, and an antenna fixed to the other open end of the adaptor.

公开(公告)号：US20060202312A1

公开(公告)日：2006-09-14

申请号：US11188113

申请日：2005-07-25

Applicant: Shinya Iijima ,  Tomoyuki Abe ,  Nobuyuki Hayashi ,  Yoji Ohashi ,  Toshihiro Shimura

Inventor： Shinya Iijima ,  Tomoyuki Abe ,  Nobuyuki Hayashi ,  Yoji Ohashi ,  Toshihiro Shimura

IPC: H01L29/40 ,  H01Q9/04

CPC classification number: H01Q1/2283 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/16152 ,  H01Q1/22 ,  H01Q9/04 ,  H01Q9/0407 ,  H01Q21/0025 ,  H05K1/0237 ,  H05K3/0058 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A communication radio-frequency module is provided that has a semiconductor device to which an antenna element is connected. This communication radio-frequency module includes: a supporting body that has a waveguide formed therein; a wiring board that is fixed onto a surface of the supporting body; the semiconductor device that is flip-chip mounted onto the wiring board by ultrasonic bonding; and the antenna element that is disposed on the other surface of the supporting body. In this module, the wiring board includes a board core member that is made of a resin material, and the supporting body includes a supporting body core member that is also made of a resin material.

Abstract translation: 提供一种具有连接有天线元件的半导体器件的通信射频模块。 该通信射频模块包括：形成有波导的支撑体; 固定在支撑体的表面上的布线板; 通过超声波接合将倒装芯片安装在布线板上的半导体器件; 以及设置在支撑体的另一个表面上的天线元件。 在该模块中，布线板包括由树脂材料制成的板芯构件，并且支撑体包括也由树脂材料制成的支撑体芯构件。

公开(公告)号：US07043852B2

公开(公告)日：2006-05-16

申请号：US10520942

申请日：2004-06-09

Applicant: Shuuji Hayashida ,  Yuji Fujikawa ,  Yuichi Ichikawa ,  Osamu Saito ,  Nobuyuki Hayashi ,  Takahiro Nakamura ,  Yuuzou Hashimoto ,  Tomio Omori

Inventor： Shuuji Hayashida ,  Yuji Fujikawa ,  Yuichi Ichikawa ,  Osamu Saito ,  Nobuyuki Hayashi ,  Takahiro Nakamura ,  Yuuzou Hashimoto ,  Tomio Omori

IPC: G01B3/18

CPC classification number: G01B3/18

Abstract: A measuring instrument that includes a tube 21 having a female thread 211 and a spindle 3 having a lead screw 31 screwing with the female thread 211 and capable of being advanced and retracted in an axial direction along with rotation around the axial center, and measures dimensions etc. of a workpiece according to displacement in an axial direction of the spindle 3 based on a rotation amount of the spindle 3. According to this measuring instrument, a pitch P of the lead screw 31 is twice as large or more than the difference between an external diameter R and a core diameter r thereof, and the difference between the external diameter R and the core diameter r is one-fifth or less of the external diameter R. Because of the lead screw 31 with the large pitch, the spindle 3 can be moved at high speed, thus enhancing operational performance of the measuring instrument.

Abstract translation: 一种测量仪器，其包括具有阴螺纹211的管21和具有与内螺纹211螺合的导螺杆31的心轴3，并且能够沿轴向方向前进和后退，同时围绕轴心旋转，并且测量尺寸 根据该主轴3的旋转量，根据该主轴3的轴方向的位移而使工件相等。根据该测量仪器，导螺杆31的间距P是两倍以上 外径R和芯直径r，外径R和芯直径r之差为外径R的五分之一以下。由于螺距大的螺杆31，主轴3 可以高速移动，从而提高测量仪器的运行性能。

公开(公告)号：US06869665B2

公开(公告)日：2005-03-22

申请号：US10644004

申请日：2003-08-20

Applicant: Motoaki Tani ,  Nobuyuki Hayashi ,  Tomoyuki Abe ,  Yasuhito Takahashi ,  Yoshiyasu Saeki

Inventor： Motoaki Tani ,  Nobuyuki Hayashi ,  Tomoyuki Abe ,  Yasuhito Takahashi ,  Yoshiyasu Saeki

IPC: H05K1/11 ,  H01L23/12 ,  H01L23/14 ,  H05K1/03 ,  H05K1/05 ,  H05K3/46 ,  B32B3/00

CPC classification number: H05K1/056 ,  H05K3/4608 ,  H05K2201/0209 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/068 ,  Y10S428/901 ,  Y10T428/24917

Abstract: A wiring board includes a core layer and a pair of multilayer wiring portions. The core layer, having an upper surface and a lower surface, is formed from a resin composite which contains resin filler and encloses several pieces of carbon fiber cloth. One of the multilayer wiring portions is stacked on the upper surface of the core layer, while the other is stacked on the lower surface of the core layer. Each multilayer wiring portion is composed of a number of insulating layers and wiring patterns stacked alternately with the insulating layers. The wiring patterns of the upper and the lower wiring portions are connected to each other by conductors extending through the entire thickness of the core layer.

Abstract translation: 布线板包括芯层和一对多层布线部。 具有上表面和下表面的芯层由包含树脂填料的树脂复合材料形成，并包围几片碳纤维布。 多层布线部分中的一个堆叠在芯层的上表面上，而另一个层叠在芯层的下表面上。 每个多层布线部分由与绝缘层交替堆叠的多个绝缘层和布线图形组成。 上布线部分和下布线部分的布线图案通过延伸穿过芯层整个厚度的导体彼此连接。

公开(公告)号：US5953955A

公开(公告)日：1999-09-21

申请号：US681464

申请日：1996-07-23

Applicant: Tsutomu Shiga ,  Nobuyuki Hayashi ,  Masanori Ohmi ,  Yasuhiro Nagao

Inventor： Tsutomu Shiga ,  Nobuyuki Hayashi ,  Masanori Ohmi ,  Yasuhiro Nagao

IPC: F02N15/06

CPC classification number: F02N15/065 ,  F02N15/006 ,  Y10T74/131 ,  Y10T74/132

Abstract: In a starter with a planetary gear speed reduction mechanism, a first output shaft retaining member (retaining member 10, washer 20) and a second output shaft retaining member (pinion retaining ring 250) are mounted on an output shaft 220 in such a manner as to sandwich from axially front and rear directions a bearing support portion of a housing 400 which supports one end of the output shaft 220, so that a thrust load in the frontward and rearward directions of the output shaft 220 is received at the front and rear end faces of the bearing support portion of the housing 400. Therefore, the axially rearward movement of the output shaft 220 is regulated assuredly without regulating it by the rear end face of the center bracket 360 and the mortor partition wall 800, thereby preventing deformation of the center bracket.

Abstract translation: 在具有行星齿轮减速机构的起动器中，第一输出轴保持构件（保持构件10，垫圈20）和第二输出轴保持构件（小齿轮保持环250）以如下方式安装在输出轴220上： 从轴向前后方向夹持支撑输出轴220的一端的壳体400的轴承支撑部，使得输出轴220的前后方向上的推力载荷在前端和后端 壳体400的轴承支撑部分的表面。因此，输出轴220的轴向向后运动被可靠地调节，而不会由中心托架360的后端面和挡块分隔壁800进行调节，从而防止 中心支架。

公开(公告)号：US5866374A

公开(公告)日：1999-02-02

申请号：US716284

申请日：1996-10-01

Applicant: Osamu Kobayashi ,  Nobuyuki Hayashi ,  Hidetaka Sone

Inventor： Osamu Kobayashi ,  Nobuyuki Hayashi ,  Hidetaka Sone

IPC: C12N15/09 ,  C07H21/04 ,  C07K14/37 ,  C07K14/395 ,  C07K14/41 ,  C12C11/02 ,  C12N1/19 ,  C12N15/00 ,  C12N15/31 ,  C12P21/02 ,  C12R1/865 ,  C07K7/00 ,  C12N15/81

CPC classification number: C07K14/395

Abstract: A protein designated "Lg-Flo1" can be produced recombinantly and confers brewer's yeast-type flocculating property, for example, when Lg-FLO1 DNA is expressed in non-flocculent yeast strain. Conversely, a flocculent yeast strain can be rendered non-flocculent by eliminating or disrupting the ability of the strain to express Lg-Flo1.

Abstract translation: PCT No.PCT / JP96 / 00183 Sec。 371日期：1996年10月1日 102（e）日期1996年10月1日PCT提交1996年1月31日PCT公布。 第WO96 / 23877号公报 日期1996年8月8日可以重组产生一种称为“Lg-Flo1”的蛋白质，例如当在非絮状酵母菌株中表达Lg-FLO1 DNA时，赋予啤酒酵母型絮凝特性。 相反，通过消除或破坏菌株表达Lg-Flo1的能力，可以使絮状酵母菌株变得非絮状。