DATA RECOVERY METHOD FOR FLASH MEMORY
    6.
    发明公开

    公开(公告)号:US20240220355A1

    公开(公告)日:2024-07-04

    申请号:US18553929

    申请日:2021-04-08

    IPC分类号: G06F11/10

    CPC分类号: G06F11/1008

    摘要: A data recovery method for a flash memory includes: reading data from the flash memory by using preset read voltage; calculating a check node error rate corresponding to the data; calculating a read voltage adjustment step size according to the check node error rate; adjusting the preset read voltage according to the read voltage adjustment step size and reading data from the flash memory by using the adjusted preset read voltage, and repeating the operation of calculating a check node error rate corresponding to the data to operation of adjusting the preset read voltage according to the read voltage adjustment step size and reading data from the flash memory by using the adjusted preset read voltage, until the check node error rate is minimum; and selecting a read voltage corresponding to the minimum check node error rate to read data from the flash memory, so as to perform data recovery.

    METHOD AND DEVICE FOR OPTIMIZING MASK PARAMETERS

    公开(公告)号:US20240176228A1

    公开(公告)日:2024-05-30

    申请号:US17773668

    申请日:2021-11-08

    IPC分类号: G03F1/44 G03F1/70

    CPC分类号: G03F1/44 G03F1/70

    摘要: The present disclosure provides a method for optimizing mask parameters, and the method includes: acquiring a test pattern, light source parameters, and initial mask parameters, the initial mask parameters including a mask thickness and an initial mask sidewall angle; generating multiple sets of candidate mask parameters according to the initial mask sidewall angle in the initial mask parameters; the multiple sets of candidate mask parameters including different mask sidewall angles and the same mask thickness; obtaining an imaging contrast of each set of candidate mask parameters based on the test pattern and the light source parameters; and selecting an optimal mask sidewall angle from the multiple sets of candidate mask parameters according to the imaging contrasts. By generating multiple sets of candidate mask parameters including different mask sidewall angles and the same mask thickness, and simulating these sets of candidate mask parameters respectively, the imaging contrast of each set of candidate mask parameters is obtained, so that the optimal mask sidewall angle is found according to the imaging contrasts. Therefore, by optimizing the mask parameters of the multi-layer film lens structure, the imaging contrast can also be significantly improved, and the imaging resolution can be improved.

    Parallel structure, method of manufacturing the same, and electronic device including the same

    公开(公告)号:US11942474B2

    公开(公告)日:2024-03-26

    申请号:US18172802

    申请日:2023-02-22

    发明人: Huilong Zhu

    摘要: A method of manufacturing a parallel structure of semiconductor devices includes: disposing a semiconductor stack, which includes source/drain layers disposed vertically in sequence and channel layers therebetween, on a substrate; patterning the semiconductor stack into a predetermined shape to define an active region; forming gate stacks around at least part of peripheries of the channel layers; forming an isolation layer on peripheries of the active region and the gate stack; forming first to third conductive channels on a sidewall of the isolation layer; determining the pre-determined shape and a shape of the gate stacks, such that one of the source/drain layers on two sides of the channel layer passes through the isolation layer to contact the first conductive channel, while the other one passes through the isolation layer to contact the second conductive channel, and the gate stack passes through the isolation layer to contact the third conductive channel.

    Voltage control of SOT-MRAM for deterministic writing

    公开(公告)号:US11930720B2

    公开(公告)日:2024-03-12

    申请号:US17495390

    申请日:2021-10-06

    摘要: The present disclosure provides a storage unit, a data writing method and a data reading method thereof, a memory and an electronic device. The storage unit includes a semiconductor substrate, a first insulating medium layer, a ferroelectric thin film layer, a bottom electrode, a tunnel junction, a first metal interconnection portion, a second metal interconnection portion, a third metal interconnection portion and a fourth metal interconnection portion. The first insulating medium layer is formed on the semiconductor substrate, the ferroelectric thin film layer is disposed on the first insulating medium layer, the bottom electrode is formed on the ferroelectric thin film layer, and the tunnel junction is formed on the bottom electrode. The first metal interconnection portion is connected to a first end of the bottom electrode, and the third metal interconnection portion is connected to a second end of the bottom electrode. The second metal interconnection portion is connected to the ferroelectric thin film layer, and the fourth metal interconnection portion is connected to the tunnel junction. As compared with the prior art, the present disclosure can control a directional flipping of the magnetic moment in the tunnel junction based on the ferroelectric thin film layer provided. Based on the structural design of the storage unit, the present disclosure does not require an external magnetic field, and fully meets the requirement of high integration of the device.

    Semiconductor apparatus with heat dissipation conduit in sidewall interconnection structure, method of manufacturing the same, and electronic device

    公开(公告)号:US11929304B2

    公开(公告)日:2024-03-12

    申请号:US17666790

    申请日:2022-02-08

    IPC分类号: H01L23/46 H01L21/48

    CPC分类号: H01L23/46 H01L21/4871

    摘要: A semiconductor apparatus with a heat dissipation conduit in a sidewall interconnection structure, a method of manufacturing the semiconductor apparatus, and an electronic device including the semiconductor apparatus. According to the embodiments, the semiconductor apparatus includes: a carrier substrate having a first region and a second region adjacent to each other; a semiconductor device on the first region; and an interconnection structure on the second region, wherein the interconnection structure includes: an electrical isolation layer; a conductive structure in the electrical isolation layer, wherein at least a part of components require to be electrically connected in the semiconductor device is in contact with and therefore electrically connected to the conductive structure in a lateral direction, wherein the conductive structure is located at a corresponding height in the interconnection structure; and a heat dissipation conduit in the electrical isolation layer.