公开(公告)号：US20240363611A1

公开(公告)日：2024-10-31

申请号：US18766674

申请日：2024-07-09

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Tsung-Shu Lin ,  Tsung-Yu Chen ,  Wensen Hung

IPC分类号： H01L25/18 ,  H01L23/00 ,  H01L23/31 ,  H01L23/40 ,  H01L23/46 ,  H01L23/498

CPC分类号： H01L25/18 ,  H01L23/3135 ,  H01L23/4006 ,  H01L23/46 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/16 ,  H01L2023/405 ,  H01L2023/4087 ,  H01L2224/16227

摘要： A structure including a wiring substrate, an interposer disposed on and electrically connected to the wiring substrate, a semiconductor die disposed on and electrically connected to the interposer, a first insulating encapsulation disposed on the interposer, a second insulating encapsulation disposed on the wiring substrate, and a lid is provided. The semiconductor die is laterally encapsulated by the first insulating encapsulation. The semiconductor die and the first insulating encapsulation are laterally encapsulated by the second insulating encapsulation. A top surface of the first insulating encapsulation is substantially leveled with a top surface of the second insulating encapsulation and a surface of the semiconductor die. The lid is disposed on the semiconductor die, the first insulating encapsulation and the second insulating encapsulation.

公开(公告)号：US20240290632A1

公开(公告)日：2024-08-29

申请号：US18115359

申请日：2023-02-28

申请人： Toyota motor Engineering & Manufacturing North America, Inc.

发明人： Feng Zhou ,  Tianzhu Fan ,  Ercan Mehmet Dede

IPC分类号： H01L21/56 ,  H01L23/46 ,  H01L25/00 ,  H05K3/00 ,  H05K7/20

CPC分类号： H01L21/561 ,  H01L23/46 ,  H01L25/50 ,  H05K3/0052 ,  H05K3/0061 ,  H05K7/2089 ,  H01L23/3121 ,  H01L23/49822 ,  H01L25/072

摘要： A method for high volume manufacture of highly integrated power electronics embedded printed circuit board (PCB)—cold plate assemblies or units includes assembling an integrated power electronics embedded PCB fabrication panel onto a cold plate fabrication panel and forming an integrated power electronics embedded PCB—cold plate fabrication panel. The integrated power electronics embedded PCB—cold plate fabrication panel is cut into a plurality of highly integrated power electronics embedded PCB—cold plate assemblies such that the plurality of highly integrated power electronics embedded PCB—cold plate assemblies individually include an integrated power electronics embedded PCB attached to and in thermal communication with a cold plate. Also, the cold plate can include a fluid chamber configured for a cooling fluid to flow therethrough.

公开(公告)号：US11993247B2

公开(公告)日：2024-05-28

申请号：US17666295

申请日：2022-02-07

申请人： ROHM CO., LTD.

发明人： Hideki Sawada

IPC分类号： B60W20/10 ,  H01L23/36 ,  H01L23/40 ,  H01L23/46 ,  H01L23/473 ,  H01L25/16 ,  H05K7/14 ,  H05K7/20

CPC分类号： B60W20/10 ,  H01L23/36 ,  H01L23/4006 ,  H01L23/46 ,  H01L23/473 ,  H01L25/16 ,  H01L25/162 ,  H05K7/1432 ,  H05K7/209 ,  H05K7/20927 ,  H01L2924/13055 ,  H01L2924/13091

摘要： An intelligent power module includes: a heat radiation device; an attachment frame disposed on a mounting surface of the heat radiation device; a power semiconductor module mounted on the attachment frame and configured to seal a semiconductor device; and a drive circuit part mounted on the power semiconductor module via a heat insulating sheet and configured to drive the power semiconductor module.

公开(公告)号：US20240136782A1

公开(公告)日：2024-04-25

申请号：US18494952

申请日：2023-10-25

申请人： Transportation IP Holdings, LLC

发明人： Henry Todd Young ,  Alvaro Jorge Mari Curbelo ,  Jason Daniel Kuttenkuler ,  Tiziana Bertoncelli ,  Sean Patrick Cillessen

IPC分类号： H01R25/16 ,  H01L23/46 ,  H01L23/492 ,  H01L25/11 ,  H01R43/16 ,  H02G5/00 ,  H02M7/00 ,  H05K7/20

CPC分类号： H01R25/162 ,  H01L23/46 ,  H01L23/492 ,  H01L25/115 ,  H01R43/16 ,  H02G5/005 ,  H02M7/003 ,  H05K7/2089 ,  H05K7/20927 ,  H02M7/537

摘要： A bus bar includes a load terminal connector comprising a conductive plate that extends from a first edge to an opposite second edge and extends from a third edge to an opposite fourth edge. The third and fourth edges extend from the first edge to the second edge. The plate includes a window opening located between the first and second edges and between the third and fourth edges. The plate also includes a slot extending into the plate from the first edge to the window opening. The plate includes first and second sets of openings configured to receive connections with first and second power terminals of switch packages. The first set of openings and the second set of openings are located on opposite sides of the slot.

公开(公告)号：US20240136252A1

公开(公告)日：2024-04-25

申请号：US18207635

申请日：2023-06-07

申请人： Frore Systems Inc.

发明人： Suryaprakash Ganti ,  Seshagiri Rao Madhavapeddy

IPC分类号： H01L23/473 ,  B06B1/06 ,  F04B17/00 ,  F04B39/06 ,  F04B43/04 ,  F04B43/09 ,  F04B45/04 ,  F04B45/047 ,  F04B53/10 ,  F04D33/00 ,  F25B21/02 ,  H01L23/42 ,  H01L23/427 ,  H01L23/433 ,  H01L23/46 ,  H04M1/02 ,  H05K7/20 ,  H10N30/00 ,  H10N30/20 ,  H10N30/80 ,  H10N35/80

CPC分类号： H01L23/4735 ,  B06B1/06 ,  F04B17/003 ,  F04B39/06 ,  F04B43/04 ,  F04B43/046 ,  F04B43/095 ,  F04B45/043 ,  F04B45/047 ,  F04B53/1077 ,  F04D33/00 ,  F25B21/02 ,  H01L23/42 ,  H01L23/427 ,  H01L23/433 ,  H01L23/4336 ,  H01L23/46 ,  H01L23/473 ,  H04M1/0202 ,  H05K7/20 ,  H05K7/20009 ,  H05K7/20272 ,  H05K7/20281 ,  H05K7/2039 ,  H10N30/00 ,  H10N30/20 ,  H10N30/204 ,  H10N30/2047 ,  H10N30/80 ,  H10N35/80 ,  F04B43/08 ,  F25B2321/0212 ,  F25B2321/023 ,  F25B2321/025 ,  F25B2321/0252

摘要： An active cooling system and method for using the active cooling system are described. The active cooling system includes a cooling element having a first side and a second side. The first side of the cooling element is distal to a heat-generating structure and in communication with a fluid. The second side of the cooling element is proximal to the heat-generating structure. The cooling element is configured to direct the fluid using a vibrational motion from the first side of the cooling element to the second side such that the fluid moves in a direction that is incident on a surface of the heat-generating structure at a substantially perpendicular angle and then is deflected to move along the surface of the heat-generating structure to extract heat from the heat-generating structure.

公开(公告)号：US20240112983A1

公开(公告)日：2024-04-04

申请号：US18099697

申请日：2023-01-20

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Li WANG ,  Chen-Hua YU ,  Chuei-Tang WANG ,  Shih-Chang KU

IPC分类号： H01L23/46 ,  H01L21/52 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H10B80/00

CPC分类号： H01L23/46 ,  H01L21/52 ,  H01L21/56 ,  H01L23/3121 ,  H01L24/32 ,  H10B80/00 ,  H01L23/295 ,  H01L2224/32245

摘要： A semiconductor device includes a substrate, a semiconductor component and a heat dissipation component. The semiconductor component is disposed on the substrate. The heat dissipation component is disposed on the substrate and having a cavity, an inlet and an outlet, wherein the inlet and the outlet communicate with the cavity.

公开(公告)号：US20240096745A1

公开(公告)日：2024-03-21

申请号：US17946883

申请日：2022-09-16

申请人： Broadcom International Pte. Ltd.

发明人： Mayank Mayukh ,  Anwar Ali ,  Jayanthi Pallinti ,  Shrikara Prabhu Tendel ,  Gregory Dix

IPC分类号： H01L23/46 ,  H01L23/00 ,  H01L23/48

CPC分类号： H01L23/46 ,  H01L23/481 ,  H01L24/05 ,  H01L24/08 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L2224/05647 ,  H01L2224/08145 ,  H01L2224/131 ,  H01L2224/29186 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29393 ,  H01L2224/29439 ,  H01L2224/29447 ,  H01L2224/32225 ,  H01L2224/80379 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/8385

摘要： A manufacturing method of a chip package, performing a coupling of first and second interconnecting layers between one or more top dies and one or more bottom dies via hybrid copper bonding; depositing a material to at least partially cover the second interconnecting layer; thinning a second surface of the one or more top dies, wherein both the one or more top dies and the material define a continuous surface; coupling a first surface of a support die to the second surface of at least one of the one or more top dies; thinning a second surface of at least one of the one or more bottom dies; and coupling the second surface of at least one of the one or more bottom dies to a plurality of microbumps.

公开(公告)号：US11929298B2

公开(公告)日：2024-03-12

申请号：US17097098

申请日：2020-11-13

申请人： Infineon Technologies AG

发明人： Jo Ean Joanna Chye ,  Edward Fuergut ,  Ralf Otremba

IPC分类号： H01L23/367 ,  H01L21/56 ,  H01L23/31 ,  H01L23/46 ,  H01L23/495

CPC分类号： H01L23/367 ,  H01L21/56 ,  H01L23/3157 ,  H01L23/46 ,  H01L23/49568

摘要： A molded semiconductor package includes: a semiconductor die embedded in a mold compound; a first heat spreader partly embedded in the mold compound and thermally coupled to a first side of the semiconductor die; and a second heat spreader partly embedded in the mold compound and thermally coupled to a second side of the semiconductor die opposite the first side. The first heat spreader includes at least one heat dissipative structure protruding from a side of the first heat spreader uncovered by the mold compound and facing away from the semiconductor die. The mold compound is configured to channel a fluid over the at least one heat dissipative structure in a direction parallel to the first side of the power semiconductor die. Corresponding methods of production and electronic assemblies are also described.

公开(公告)号：US11837826B2

公开(公告)日：2023-12-05

申请号：US17544443

申请日：2021-12-07

申请人： Transportation IP Holdings, LLC

发明人： Henry Todd Young ,  Alvaro Jorge Mari Curbelo ,  Jason Daniel Kuttenkuler ,  Tiziana Bertoncelli ,  Sean Patrick Cillessen

IPC分类号： H01R25/16 ,  H02M7/00 ,  H02G5/00 ,  H05K7/20 ,  H01L23/46 ,  H01L23/492 ,  H01L25/11 ,  H01R43/16 ,  H02M7/537

CPC分类号： H01R25/162 ,  H01L23/46 ,  H01L23/492 ,  H01L25/115 ,  H01R43/16 ,  H02G5/005 ,  H02M7/003 ,  H05K7/2089 ,  H05K7/20927 ,  H02M7/537

摘要： A bus bar includes a load terminal connector comprising a conductive plate that extends from a first edge to an opposite second edge and extends from a third edge to an opposite fourth edge. The third and fourth edges extend from the first edge to the second edge. The plate includes a window opening located between the first and second edges and between the third and fourth edges. The plate also includes a slot extending into the plate from the first edge to the window opening. The plate includes first and second sets of openings configured to receive connections with first and second power terminals of switch packages. The first set of openings and the second set of openings are located on opposite sides of the slot.

公开(公告)号：US11802908B2

公开(公告)日：2023-10-31

申请号：US16866062

申请日：2020-05-04

申请人： Delta Design, Inc.

发明人： Jerry Ihor Tustaniwskyj ,  James Wittman Babcock

IPC分类号： F28F7/00 ,  G01R31/28 ,  H01L23/46 ,  H01L23/467 ,  H01L23/427 ,  H01L23/473

CPC分类号： G01R31/2874 ,  H01L23/427 ,  H01L23/46 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/0002 ,  H01L2924/00

摘要： An alignment mechanism is disclosed which includes a mount, a beam having a first end affixed to the mount and a second end. The beam is an order of magnitude more rigid along its longitudinal axis than along an axis orthogonal to its longitudinal axis. The second end of the beam is affixed to a first device having a surface configured to contact a second device. The beam applies a normal force component to the second device through the first device and allows movement at the second end in directions orthogonal to the normal force component.