公开(公告)号：US12193192B2

公开(公告)日：2025-01-07

申请号：US18596562

申请日：2024-03-05

Applicant: Frore Systems Inc.

Inventor： Suryaprakash Ganti ,  Sangkyu Kim ,  Vikram Mukundan ,  Prathima Kapa ,  Ji Hoon Kim ,  Wen-Sheng Chan

IPC: H05K7/20

Abstract: A flow chamber having an upper chamber, a lower chamber, and an actuator is described. The upper chamber includes a top wall. The actuator is located distally from the top wall. The lower chamber includes a bottom wall and a sidewall. The lower chamber receives a fluid from the upper chamber when the actuator is activated. The bottom wall has orifices and at least one cavity therein. The orifices are vertically aligned with a portion of the actuator and allow the fluid to exit the lower chamber. The at least one cavity is proximate to the sidewall and distally located from the orifices.

公开(公告)号：US12167574B2

公开(公告)日：2024-12-10

申请号：US18229602

申请日：2023-08-02

Applicant: Frore Systems Inc.

Inventor： Ananth Saran Yalamarthy ,  Prabhu Sathyamurthy ,  Suryaprakash Ganti ,  Seshagiri Rao Madhavapeddy ,  Vikram Mukundan

IPC: H05K7/20 ,  F28F13/10

Abstract: A system including a cooling element and a support structure is described. The cooling element has a first side and a second side opposite to the first side. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid from the first side to the second side. The support structure thermally couples the cooling element to a heat-generating structure via thermal conduction.

公开(公告)号：US20240351862A1

公开(公告)日：2024-10-24

申请号：US18652726

申请日：2024-05-01

Applicant: Frore Systems Inc.

Inventor： Suryaprakash Ganti ,  Vikram Mukundan ,  Seshagiri Rao Madhavapeddy ,  Ananth Saran Yalamarthy ,  Prathima Kapa ,  Brian James Gally

IPC: B81B7/00

CPC classification number: B81B7/0061 ,  B81B2203/0118 ,  B81B2203/0307 ,  B81B2203/0315 ,  B81B2203/04 ,  B81B2203/058

Abstract: A cooling system is described. The cooling system includes a bottom plate, a support structure, and a cooling element. The bottom plate has orifices therein. The cooling element has a central axis and is supported by the support structure at the central axis. A first portion of the cooling element is on a first side of the central axis and a second portion of the cooling element is on a second side of the central axis opposite to the first side. The first and second portions of the cooling element are unpinned. The first portion and the second portion are configured to undergo vibrational motion when actuated to drive a fluid through the orifices. The support structure couples the cooling element to the bottom plate. The support structure is coupled with at least one of the cooling element or the bottom plate by diffusion bond(s).

公开(公告)号：US12055351B2

公开(公告)日：2024-08-06

申请号：US18197701

申请日：2023-05-15

Applicant: Frore Systems Inc.

Inventor： Prabhu Sathyamurthy ,  Suryaprakash Ganti ,  Seshagiri Rao Madhavapeddy ,  Lumaya Ahmed ,  Shekhar Halakatti

IPC: F28D9/00 ,  H10N30/20

CPC classification number: F28D9/0081 ,  H10N30/2042

Abstract: A cooling system including a heat spreader, an active cooling element, and a base is described. The heat spreader is in thermal communication with a heat-generating structure mounted on a substrate. The heat spreader over hangs the heat-generating structure. The active cooling element is in thermal communication with the heat spreader. The base supports the heat spreader and transfers a load from the heat spreader to the substrate such that a bending of the heat spreader does not exceed ten degrees.

公开(公告)号：US20240234247A9

公开(公告)日：2024-07-11

申请号：US18207635

申请日：2023-06-08

Applicant: Frore Systems Inc.

Inventor： Suryaprakash Ganti ,  Seshagiri Rao Madhavapeddy

IPC: H01L23/473 ,  B06B1/06 ,  F04B17/00 ,  F04B39/06 ,  F04B43/04 ,  F04B43/09 ,  F04B45/04 ,  F04B45/047 ,  F04B53/10 ,  F04D33/00 ,  F25B21/02 ,  H01L23/42 ,  H01L23/427 ,  H01L23/433 ,  H01L23/46 ,  H04M1/02 ,  H05K7/20 ,  H10N30/00 ,  H10N30/20 ,  H10N30/80 ,  H10N35/80

CPC classification number: H01L23/4735 ,  B06B1/06 ,  F04B17/003 ,  F04B39/06 ,  F04B43/04 ,  F04B43/046 ,  F04B43/095 ,  F04B45/043 ,  F04B45/047 ,  F04B53/1077 ,  F04D33/00 ,  F25B21/02 ,  H01L23/42 ,  H01L23/427 ,  H01L23/433 ,  H01L23/4336 ,  H01L23/46 ,  H01L23/473 ,  H04M1/0202 ,  H05K7/20 ,  H05K7/20009 ,  H05K7/20272 ,  H05K7/20281 ,  H05K7/2039 ,  H10N30/00 ,  H10N30/20 ,  H10N30/204 ,  H10N30/2047 ,  H10N30/80 ,  H10N35/80 ,  F04B43/08 ,  F25B2321/0212 ,  F25B2321/023 ,  F25B2321/025 ,  F25B2321/0252

Abstract: An active cooling system and method for using the active cooling system are described. The active cooling system includes a cooling element having a first side and a second side. The first side of the cooling element is distal to a heat-generating structure and in communication with a fluid. The second side of the cooling element is proximal to the heat-generating structure. The cooling element is configured to direct the fluid using a vibrational motion from the first side of the cooling element to the second side such that the fluid moves in a direction that is incident on a surface of the heat-generating structure at a substantially perpendicular angle and then is deflected to move along the surface of the heat-generating structure to extract heat from the heat-generating structure.

公开(公告)号：US11830789B2

公开(公告)日：2023-11-28

申请号：US17578257

申请日：2022-01-18

Applicant: Frore Systems Inc.

Inventor： Suryaprakash Ganti ,  Seshagiri Rao Madhavapeddy

IPC: H01L23/473 ,  F04B53/10 ,  F04B43/04 ,  F04B45/047 ,  B06B1/06 ,  H01L23/427 ,  H01L23/433 ,  H05K7/20 ,  F25B21/02 ,  F04D33/00 ,  H04M1/02 ,  F04B43/09 ,  H01L23/46 ,  H01L23/42 ,  F04B17/00 ,  F04B45/04 ,  H10N30/00 ,  H10N30/20 ,  H10N30/80 ,  H10N35/80

CPC classification number: H01L23/4735 ,  B06B1/06 ,  F04B17/003 ,  F04B43/04 ,  F04B43/046 ,  F04B43/095 ,  F04B45/043 ,  F04B45/047 ,  F04B53/1077 ,  F04D33/00 ,  F25B21/02 ,  H01L23/42 ,  H01L23/427 ,  H01L23/433 ,  H01L23/4336 ,  H01L23/46 ,  H01L23/473 ,  H04M1/0202 ,  H05K7/20 ,  H05K7/20009 ,  H05K7/2039 ,  H05K7/20272 ,  H05K7/20281 ,  H10N30/00 ,  H10N30/20 ,  H10N30/204 ,  H10N30/2047 ,  H10N30/80 ,  H10N35/80 ,  F25B2321/023 ,  F25B2321/025 ,  F25B2321/0212 ,  F25B2321/0252

Abstract: A system for cooling a mobile phone and method for using the system are described. The system includes an active piezoelectric cooling system, a controller and an interface. The active piezoelectric cooling system is configured to be disposed in a rear portion of the mobile phone distal from a front screen of the mobile phone. The controller is configured to activate the active piezoelectric cooling system in response to heat generated by heat-generating structures of the mobile phone. The interface is configured to receive power from a mobile phone power source when the active piezoelectric cooling system is activated.

公开(公告)号：US11802554B2

公开(公告)日：2023-10-31

申请号：US17081890

申请日：2020-10-27

Applicant: Frore Systems Inc.

Inventor： Ananth Saran Yalamarthy ,  Vikram Mukundan ,  Suryaprakash Ganti ,  Narayana Prasad Rayapati ,  Prabhu Sathyamurthy ,  Seshagiri Rao Madhavapeddy ,  Marc Mignard ,  Brian James Gally

IPC: F04B43/04 ,  F04B49/00 ,  F04B45/047

CPC classification number: F04B43/046 ,  F04B45/047 ,  F04B49/00

Abstract: A system including an orifice plate, a fan element and at least one channel is disclosed. The orifice plate has at least one orifice therein. The fan element is configured to undergo vibrational motion to drive a fluid through the orifice(s). The fluid is drawn through the channel(s) in response to the fluid being driven through the at least one orifice.

公开(公告)号：US11785739B2

公开(公告)日：2023-10-10

申请号：US17473774

申请日：2021-09-13

Applicant: Frore Systems Inc.

Inventor： Ganapathy Sankar ,  Marc Mignard ,  Shekhar Halakatti ,  Suchitra Ramesh ,  Suryaprakash Ganti ,  Seshagiri Rao Madhavapeddy ,  Prabhu Sathyamurthy

IPC: H05K7/20

CPC classification number: H05K7/20172

Abstract: A system including a plurality of cooling cells and a switching and control module is described. The cooling cells including cooling elements configured to be actuated to induce vibrational motion to drive a fluid toward a heat-generating structure. The switching and control module is coupled to the cooling elements and provides drive signals to the cooling elements based on at least one drive signal input. Each of the drive signals has a frequency corresponding to a cooling element. The frequency of the drive signal corresponds to a resonant state of the cooling element.

公开(公告)号：US11765863B2

公开(公告)日：2023-09-19

申请号：US17486747

申请日：2021-09-27

Applicant: Frore Systems Inc.

Inventor： Ananth Saran Yalamarthy ,  Prabhu Sathyamurthy ,  Suryaprakash Ganti ,  Seshagiri Rao Madhavapeddy ,  Vikram Mukundan

IPC: H05K7/20 ,  F28F13/10

CPC classification number: H05K7/2039 ,  F28F13/10

Abstract: A system including a cooling element and a support structure is described. The cooling element has a first side and a second side opposite to the first side. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid from the first side to the second side. The support structure thermally couples the cooling element to a heat-generating structure via thermal conduction.

公开(公告)号：US20210183743A1

公开(公告)日：2021-06-17

申请号：US17179263

申请日：2021-02-18

Applicant: Frore Systems Inc.

Inventor： Suryaprakash Ganti ,  Seshagiri Rao Madhavapeddy

IPC: H01L23/473 ,  F04B53/10 ,  F04B43/04 ,  F04B45/047 ,  B06B1/06 ,  H01L23/427 ,  H01L23/433 ,  H01L41/09 ,  H05K7/20 ,  F25B21/02 ,  F04D33/00 ,  H04M1/02 ,  H01L41/02 ,  H01L41/00 ,  F04B43/09 ,  H01L23/46 ,  H01L23/42 ,  F04B17/00 ,  F04B45/04 ,  H01L41/08

Abstract: A cooling system and method for using the cooling system are described. The cooling system includes a plurality of individual piezoelectric cooling elements spatially arranged in an array extending in at least two dimensions, a communications interface and driving circuitry. The communications interface is associated with the individual piezoelectric cooling elements such that selected individual piezoelectric cooling elements within the array can be activated based at least in part on heat energy generated in the vicinity of the selected individual piezoelectric cooling elements. The driving circuitry is associated with the individual piezoelectric cooling elements and is configured to drive the selected individual piezoelectric cooling elements.