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公开(公告)号：US09362244B2
公开(公告)日：2016-06-07
申请号：US14375408
申请日：2012-10-22
发明人： Chin Tien Chiu , Cheeman Yu , Hem Takiar
IPC分类号： H01L23/48 , H01L23/00 , H01L21/56 , H01L21/82 , H01L23/31 , H01L25/065 , H01L25/00 , H01L23/14 , H01L23/495 , H01L23/538
CPC分类号： H01L24/06 , H01L21/561 , H01L21/82 , H01L23/145 , H01L23/3121 , H01L23/49575 , H01L23/5386 , H01L24/03 , H01L24/24 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/82 , H01L24/85 , H01L24/92 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/03011 , H01L2224/04042 , H01L2224/05554 , H01L2224/24145 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/49113 , H01L2224/49175 , H01L2224/73265 , H01L2224/78301 , H01L2224/85001 , H01L2224/85947 , H01L2224/85986 , H01L2224/92247 , H01L2224/97 , H01L2225/0651 , H01L2225/06527 , H01L2225/06551 , H01L2225/06562 , H01L2225/06565 , H01L2924/00014 , H01L2924/12042 , H01L2924/1431 , H01L2924/1434 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/00 , H01L2224/48247 , H01L2924/00012 , H01L2224/83 , H01L2224/85 , H01L2224/45099 , H01L2224/05599
摘要： A memory device, and a method of making the memory device, are disclosed. The memory device is fabricated by mounting one or more semiconductor die on a substrate, and wire bonding the die to the substrate. The die and wire bonds are encapsuated, and the encapsulated device is singulated. The wire bonds are severed during the singulation step, and thereafter the severed wire bonds are connected to the substrate by external connectors on one or more surfaces of the molding compound.
摘要翻译： 公开了一种存储器件及其制造方法。 存储器件通过将一个或多个半导体管芯安装在衬底上并将管芯接合到衬底来制造。 管芯和引线键合被封装，并且封装的器件被分割。 在分割步骤期间，线接合被切断，此后，切断的线接合通过模塑料的一个或多个表面上的外部连接器连接到基底。
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公开(公告)号：US09093612B2
公开(公告)日：2015-07-28
申请号：US14261136
申请日：2014-04-24
申请人： Nichia Corporation
发明人： Akinori Yoneda , Akiyoshi Kinouchi , Hisashi Kasai , Yoshiyuki Aihara , Hirokazu Sasa , Shinji Nakamura
IPC分类号： H01L27/15 , H01L31/12 , H01L33/00 , H01L33/38 , H01L33/62 , H01L33/48 , H01L33/54 , H01L21/60
CPC分类号： H01L33/62 , H01L21/6835 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/45 , H01L24/48 , H01L24/82 , H01L24/85 , H01L24/96 , H01L33/24 , H01L33/38 , H01L33/387 , H01L33/40 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/56 , H01L2021/60 , H01L2221/6835 , H01L2221/68368 , H01L2221/68372 , H01L2221/68381 , H01L2221/68386 , H01L2224/04105 , H01L2224/05644 , H01L2224/05647 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/2101 , H01L2224/2105 , H01L2224/211 , H01L2224/215 , H01L2224/2401 , H01L2224/24011 , H01L2224/2405 , H01L2224/2413 , H01L2224/245 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48095 , H01L2224/48101 , H01L2224/4813 , H01L2224/48644 , H01L2224/48647 , H01L2224/48844 , H01L2224/48847 , H01L2224/821 , H01L2224/82106 , H01L2224/85947 , H01L2224/96 , H01L2924/0002 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H01L2924/3511 , H01L2933/0016 , H01L2933/005 , H01L2933/0066 , H01L2924/00 , H01L2924/00012 , H01L2924/014 , H01L2924/01079 , H01L2924/01047 , H01L2924/01029 , H01L2924/0105 , H01L2924/00014 , H01L2224/82
摘要： A provided light includes a semiconductor chip including a p-type semiconductor layer and an n-type semiconductor layer, the semiconductor chip being adapted to emit light between the p-type semiconductor layer and the n-type semiconductor layer; a p-side pad electrode disposed on an upper surface side of the semiconductor chip and over the p-type semiconductor layer; an n-side pad electrode disposed on an upper surface side of the semiconductor chip and over the n-type semiconductor layer; a resin layer disposed to cover the upper surface of the semiconductor chip; a p-side connection electrode and an n-side connection electrode disposed at an outer surface of the resin layer and positioned on the upper surface side of the semiconductor chip; and a metal wire disposed in the resin. The metal wire is adapted to make connection at least one of between the p-side pad electrode and the p-side connection electrode, and between the n-side pad electrode and the n-side connection electrode.
摘要翻译： 所提供的光包括包括p型半导体层和n型半导体层的半导体芯片，所述半导体芯片适于在p型半导体层和n型半导体层之间发光; p侧焊盘电极，设置在所述半导体芯片的上表面侧并且位于所述p型半导体层上方; 设置在所述半导体芯片的上表面侧并且位于所述n型半导体层上的n侧焊盘电极; 设置成覆盖半导体芯片的上表面的树脂层; p侧连接电极和n侧连接电极，设置在树脂层的外表面并位于半导体芯片的上表面侧; 以及设置在树脂中的金属线。 金属线适于连接p侧焊盘电极和p侧连接电极之间以及n侧焊盘电极和n侧连接电极之中的至少一个。
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公开(公告)号：US20150001739A1
公开(公告)日：2015-01-01
申请号：US14375408
申请日：2012-10-22
发明人： Chin Tien Chiu , Cheeman Yu , Hem Takiar
CPC分类号： H01L24/06 , H01L21/561 , H01L21/82 , H01L23/145 , H01L23/3121 , H01L23/49575 , H01L23/5386 , H01L24/03 , H01L24/24 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/82 , H01L24/85 , H01L24/92 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/03011 , H01L2224/04042 , H01L2224/05554 , H01L2224/24145 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/49113 , H01L2224/49175 , H01L2224/73265 , H01L2224/78301 , H01L2224/85001 , H01L2224/85947 , H01L2224/85986 , H01L2224/92247 , H01L2224/97 , H01L2225/0651 , H01L2225/06527 , H01L2225/06551 , H01L2225/06562 , H01L2225/06565 , H01L2924/00014 , H01L2924/12042 , H01L2924/1431 , H01L2924/1434 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/00 , H01L2224/48247 , H01L2924/00012 , H01L2224/83 , H01L2224/85 , H01L2224/45099 , H01L2224/05599
摘要： A memory device, and a method of making the memory device, are disclosed. The memory device is fabricated by mounting one or more semiconductor die on a substrate, and wire bonding the die to the substrate. The die and wire bonds are encapsuated, and the encapsulated device is singulated. The wire bonds are severed during the singulation step, and thereafter the severed wire bonds are connected to the substrate by external connectors on one or more surfaces of the molding compound.
摘要翻译： 公开了一种存储器件及其制造方法。 存储器件通过将一个或多个半导体管芯安装在衬底上并将管芯接合到衬底来制造。 管芯和引线键合被封装，并且封装的器件被分割。 在分割步骤期间，线接合被切断，此后，切断的线接合通过模塑料的一个或多个表面上的外部连接器连接到基底。
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公开(公告)号：US20120018905A1
公开(公告)日：2012-01-26
申请号：US13252179
申请日：2011-10-03
IPC分类号： H01L23/48
CPC分类号： H01L24/85 , H01L21/56 , H01L23/3157 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/45015 , H01L2224/45124 , H01L2224/4809 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/48699 , H01L2224/4899 , H01L2224/78313 , H01L2224/85181 , H01L2224/85201 , H01L2224/85205 , H01L2224/859 , H01L2224/8592 , H01L2224/8593 , H01L2224/85947 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/01057 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
摘要： An electronic component assembly is provided having an integrated circuit supported on a first mounting area such that a first surface of the integrated circuit contacts the first mounting area, electrical conductors supported on a second mounting area, and a series of wire bonds extending from contact pads on a second surface of the integrated circuit, opposite the first surface, to the electrical conductors. The first and second mounting areas are stepped relative to one another and the wire bonds are covered in a bead of encapsulant. The bead of encapsulant has a profiled surface that is flat and inclined relative to the second surface.
摘要翻译： 提供一种电子部件组件，其具有支撑在第一安装区域上的集成电路，使得集成电路的第一表面接触第一安装区域，支撑在第二安装区域上的电导体和从接触焊盘延伸的一系列引线接合 在集成电路的与第一表面相对的第二表面上与电导体相对。 第一和第二安装区域相对于彼此是阶梯式的，并且引线接合被覆盖在密封剂的珠粒中。 密封剂珠具有相对于第二表面平坦且倾斜的成型表面。
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公开(公告)号：US08053906B2
公开(公告)日：2011-11-08
申请号：US12501285
申请日：2009-07-10
申请人： Hsiao Chuan Chang , Tsung Yueh Tsai , Yi Shao Lai , Ho Ming Tong , Jian Cheng Chen , Wei Chi Yih , Chang Ying Hung , Cheng Tsung Hsu , Chih Cheng Hung
发明人： Hsiao Chuan Chang , Tsung Yueh Tsai , Yi Shao Lai , Ho Ming Tong , Jian Cheng Chen , Wei Chi Yih , Chang Ying Hung , Cheng Tsung Hsu , Chih Cheng Hung
IPC分类号： H01L23/48
CPC分类号： H01L24/85 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L2224/05624 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48624 , H01L2224/73265 , H01L2224/78301 , H01L2224/85043 , H01L2224/85045 , H01L2224/85047 , H01L2224/85201 , H01L2224/85365 , H01L2224/85947 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2224/48824 , H01L2924/00012
摘要： A copper bonding wire includes a line portion and a non-spherical block portion. The non-spherical block portion is physically connected to the line portion, and the cross-sectional area of the non-spherical block portion is bigger than that of the line portion.
摘要翻译： 铜接合线包括线部分和非球形块部分。 非球形块部分物理连接到线路部分，非球形块部分的横截面面积大于线路部分的横截面面积。
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公开(公告)号：US08048720B2
公开(公告)日：2011-11-01
申请号：US12375238
申请日：2008-01-30
CPC分类号： H01L24/85 , H01L21/6835 , H01L23/4952 , H01L24/05 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/78 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/32225 , H01L2224/4809 , H01L2224/48095 , H01L2224/48247 , H01L2224/48455 , H01L2224/4846 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/48511 , H01L2224/49171 , H01L2224/73265 , H01L2224/78302 , H01L2224/78901 , H01L2224/85001 , H01L2224/85045 , H01L2224/85047 , H01L2224/85051 , H01L2224/85181 , H01L2224/85186 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2224/85399 , H01L2224/85947 , H01L2224/85986 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/10161 , H01L2924/14 , H01L2224/45099 , H01L2224/48227 , H01L2924/00 , H01L2224/4554
摘要： A method of forming a wire loop is provided. The method includes: (1) forming a first fold of wire; (2) bonding the first fold of wire to a first bonding location to form a first bond; (3) extending a length of wire, continuous with the first bond, between (a) the first bond and (b) a second bonding location; and (4) bonding a portion of the wire to the second bonding location to form a second bond.
摘要翻译： 提供一种形成线环的方法。 该方法包括：（1）形成线的第一折叠; （2）将所述第一折叠线接合到第一接合位置以形成第一接合; （3）在（a）第一键和（b）第二结合位置之间延伸一段与第一键连续的线的长度; 和（4）将所述导线的一部分接合到所述第二接合位置以形成第二接合。
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公开(公告)号：US08017450B2
公开(公告)日：2011-09-13
申请号：US12364517
申请日：2009-02-03
CPC分类号： H01L21/56 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49175 , H01L2224/78 , H01L2224/85181 , H01L2224/85205 , H01L2224/8592 , H01L2224/85947 , H01L2924/00014 , H01L2924/01014 , H01L2924/01033 , H01L2924/01082 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/20753 , H05K1/189 , H05K2201/09045 , H05K2203/049 , H01L2924/00 , H01L2224/45099 , H01L2924/20752 , H01L2924/20754 , H01L2224/05599
摘要： A method of forming an asymmetrical encapsulant bead on a series of wire bonds electrically connecting a micro-electronic device to a series of conductors, the micro-electronic device having a planar active surface. The method has the steps of positioning the die and the wire bonds beneath an encapsulant jetter that jets drops of encapsulant on to the wire bonds, the drops of encapsulant following a vertical trajectory, tilting the die such that the active surface is inclined to the horizontal and, jetting the drops of encapsulant to form a bead of encapsulant material covering the series of wire bonds, the bead having a cross sectional profile that is asymmetrical about an axis parallel to a normal to the active surface.
摘要翻译： 在将微电子器件电连接到一系列导体的一系列引线键合上形成不对称密封剂珠的方法，该微电子器件具有平坦的有源表面。 该方法具有以下步骤：将管芯和引线接合在密封剂喷射器下方，将密封剂滴喷射到引线键合上，密封剂液滴沿垂直轨迹移动，倾斜模具使得活性表面倾斜于水平 并且，喷射所述密封剂滴以形成覆盖所述一系列引线接合的密封剂材料珠，所述珠具有围绕平行于所述活性表面的法线的轴线不对称的横截面轮廓。
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公开(公告)号：US20110068469A1
公开(公告)日：2011-03-24
申请号：US12957419
申请日：2010-12-01
申请人： Kai Yun Yow , Poh Leng Eu
发明人： Kai Yun Yow , Poh Leng Eu
IPC分类号： H01L23/498
CPC分类号： H01L24/85 , B23K20/007 , B23K2101/40 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/05624 , H01L2224/1134 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4807 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48453 , H01L2224/48465 , H01L2224/48624 , H01L2224/48724 , H01L2224/48824 , H01L2224/78301 , H01L2224/78309 , H01L2224/85043 , H01L2224/85205 , H01L2224/85947 , H01L2924/00013 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/14 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要： A semiconductor package includes an integrated circuit die having first and second sets of connection pads, bond wires, and a substrate with connection pads. The bond wires electrically connect the second set of connection pads of the die with the substrate connection pads. Prior to connecting the wires to the second connection pads, a free air ball (FAB) is formed and pressed against a respective one of the connection pads of the first set to form a pre-formed ball bond.
摘要翻译： 半导体封装包括具有第一和第二组连接焊盘，接合线以及具有连接焊盘的衬底的集成电路管芯。 接合线将管芯的第二组连接焊盘与衬底连接焊盘电连接。 在将电线连接到第二连接焊盘之前，形成自由空气球（FAB）并将其按压在第一组的相应的一个连接焊盘上以形成预先形成的球接合。
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公开(公告)号：US07875504B2
公开(公告)日：2011-01-25
申请号：US12046454
申请日：2008-03-12
IPC分类号： H01L21/00
CPC分类号： H01L24/85 , H01L21/56 , H01L23/3157 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/05599 , H01L2224/45015 , H01L2224/45124 , H01L2224/4809 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/48699 , H01L2224/4899 , H01L2224/78313 , H01L2224/85181 , H01L2224/85201 , H01L2224/85205 , H01L2224/859 , H01L2224/8592 , H01L2224/8593 , H01L2224/85947 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/01057 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , Y10T29/49169 , H01L2924/00 , H01L2224/85399
摘要： A method of reducing wire bond loop heights in wire bonds electrically connecting an integrated circuit die with a contact pad to a printed circuit board with a conductor, by mounting the integrated circuit die such that the contact pad is spaced from the conductor, positioning an adhesive surface between the contact pad and the conductor on the printed circuit board, attaching wire to one of the contact pad or the conductor, drawing the wire towards the other of the contact pad or the conductor, allowing the wire to contact the adhesive surface, and, attaching the wire to the other of the contact pad of the conductor to form a wire bond adhered to the adhesive surface and a point intermediate its ends.
摘要翻译： 通过安装集成电路管芯使得接触焊盘与导体间隔开来，将集成电路管芯与接触焊盘电连接到具有导体的印刷电路板的引线键合中减少引线接合环高度的方法， 接触焊盘和印刷电路板上的导体之间的表面，将导线附接到接触焊盘或导体中的一个，将导线拉向接触垫或导体中的另一个，允许电线接触粘合剂表面，以及 将导线连接到导体的接触垫中的另一个，以形成粘合到粘合剂表面上的引线键和在其端部之间的点。
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公开(公告)号：US20100075466A1
公开(公告)日：2010-03-25
申请号：US12364517
申请日：2009-02-03
IPC分类号： H01L21/00
CPC分类号： H01L21/56 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49175 , H01L2224/78 , H01L2224/85181 , H01L2224/85205 , H01L2224/8592 , H01L2224/85947 , H01L2924/00014 , H01L2924/01014 , H01L2924/01033 , H01L2924/01082 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/20753 , H05K1/189 , H05K2201/09045 , H05K2203/049 , H01L2924/00 , H01L2224/45099 , H01L2924/20752 , H01L2924/20754 , H01L2224/05599
摘要： A method of forming an asymmetrical encapsulant bead on a series of wire bonds electrically connecting a micro-electronic device to a series of conductors, the micro-electronic device having a planar active surface. The method has the steps of positioning the die and the wire bonds beneath an encapsulant jetter that jets drops of encapsulant on to the wire bonds, the drops of encapsulant following a vertical trajectory, tilting the die such that the active surface is inclined to the horizontal and, jetting the drops of encapsulant to form a bead of encapsulant material covering the series of wire bonds, the bead having a cross sectional profile that is asymmetrical about an axis parallel to a normal to the active surface.
摘要翻译： 在将微电子器件电连接到一系列导体的一系列引线键合上形成不对称密封剂珠的方法，该微电子器件具有平坦的有源表面。 该方法具有以下步骤：将管芯和引线接合在密封剂喷射器下方，将密封剂滴喷射到引线键合上，密封剂液滴沿垂直轨迹移动，倾斜模具使得活性表面倾斜于水平 并且，喷射所述密封剂滴以形成覆盖所述一系列引线接合的密封剂材料珠，所述珠具有围绕平行于所述活性表面的法线的轴线不对称的横截面轮廓。
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