Invention Grant
- Patent Title: Method of adhering wire bond loops to reduce loop height
- Patent Title (中): 粘接线接合环以减少环高度的方法
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Application No.: US12046454Application Date: 2008-03-12
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Publication No.: US07875504B2Publication Date: 2011-01-25
- Inventor: Kia Silverbrook , Laval Chung-Long-Shan , Kiangkai Tankongchumruskul
- Applicant: Kia Silverbrook , Laval Chung-Long-Shan , Kiangkai Tankongchumruskul
- Applicant Address: AU Balmain, New South Wales
- Assignee: Silverbrook Research Pty Ltd
- Current Assignee: Silverbrook Research Pty Ltd
- Current Assignee Address: AU Balmain, New South Wales
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of reducing wire bond loop heights in wire bonds electrically connecting an integrated circuit die with a contact pad to a printed circuit board with a conductor, by mounting the integrated circuit die such that the contact pad is spaced from the conductor, positioning an adhesive surface between the contact pad and the conductor on the printed circuit board, attaching wire to one of the contact pad or the conductor, drawing the wire towards the other of the contact pad or the conductor, allowing the wire to contact the adhesive surface, and, attaching the wire to the other of the contact pad of the conductor to form a wire bond adhered to the adhesive surface and a point intermediate its ends.
Public/Granted literature
- US20090081829A1 METHOD OF ADHERING WIRE BOND LOOPS TO REDUCE LOOP HEIGHT Public/Granted day:2009-03-26
Information query
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