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    Method of assembling pressure sensor device
    3.
    发明授权
    Method of assembling pressure sensor device 有权
    压力传感器装置的组装方法

    公开(公告)号：US08501517B1

    公开(公告)日：2013-08-06

    申请号：US13441928

    申请日：2012-04-09

    申请人： Kai Yun Yow ,  Poh Leng Eu

    发明人： Kai Yun Yow ,  Poh Leng Eu

    IPC分类号： H01L21/56

    CPC分类号： H01L21/56 ,  G01L19/0627 ,  G01L19/147 ,  H01L21/50 ,  H01L23/3121 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00

    摘要： A method of assembling a pressure sensor device includes providing a substrate having a plurality of substrate connection pads. A pressure sensor die is attached to a first major surface of the substrate and bond pads of the pressure sensor die are electrically connected to the respective substrate connection pads. A retractable cavity pin is placed on the first major surface of the substrate such that the cavity pin covers the pressure sensor die and the electrical connections to the die. A molding compound is then dispensed onto the first major surface of the substrate such that the molding compound surrounds the pressure sensor die and the cavity pin. The cavity pin is retracted such that a cavity is formed around the pressure sensor die and a gel material is dispensed within the cavity such that the gel material fills the cavity and covers the pressure sensor die.

    摘要翻译： 组装压力传感器装置的方法包括提供具有多个基板连接垫的基板。 压力传感器芯片附接到基板的第一主表面，并且压力传感器芯片的接合焊盘电连接到相应的基板连接焊盘。 可缩回的腔销被放置在基板的第一主表面上，使得空腔销覆盖压力传感器管芯和与管芯的电连接。 然后将模塑料分配到基材的第一主表面上，使得模制化合物围绕压力传感器模头和腔体销。 空腔销缩回，使得在压力传感器模具周围形成空腔，并且将凝胶材料分配在空腔内，使得凝胶材料填充空腔并覆盖压力传感器模具。

    SEMICONDUCTOR PACKAGE WITH STRESS RELIEF AND HEAT SPREADER
    5.
    发明申请
    SEMICONDUCTOR PACKAGE WITH STRESS RELIEF AND HEAT SPREADER 有权
    具有应力消除和散热器的半导体封装

    公开(公告)号：US20150084169A1

    公开(公告)日：2015-03-26

    申请号：US14277801

    申请日：2014-05-15

    申请人： Kai Yun Yow ,  Poh Leng Eu ,  Meng Kong Lye ,  You Ge ,  Penglin Mei

    发明人： Kai Yun Yow ,  Poh Leng Eu ,  Meng Kong Lye ,  You Ge ,  Penglin Mei

    IPC分类号： H01L23/495 ,  H01L23/34

    CPC分类号： H01L23/49568 ,  H01L23/49503 ,  H01L23/49551 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2924/00014 ,  H01L2224/4554

    摘要： A semiconductor device has a die mounted on a die paddle that is elevated above and thermally connected via tie bars to a heat sink structure. Heat generated by the die flows from the die to the die paddle to the tie bars to the heat sink structure and then to either the external environment or to an external heat sink. By elevating the die/paddle sub-assembly above the heat sink structure, the packaged device is less susceptible to delamination between the die and die attach adhesive and/or the die attach adhesive and the die paddle. An optional heat sink ring can surround the die paddle.

    摘要翻译： 半导体器件具有安装在芯片上的管芯，其上升并且经由连接杆热连接到散热器结构。 由模具产生的热量从模具流到模具板到连接杆到散热器结构，然后流到外部环境或外部散热器。 通过将模具/桨叶子组件提升到散热器结构上方，封装的装置不易受到管芯和管芯附接粘合剂和/或管芯附接粘合剂和管芯焊盘之间的分层的影响。 可选的散热片环可围绕裸片。

    Self monitoring braking system for vehicles
    6.
    发明授权
    Self monitoring braking system for vehicles 有权
    汽车自动监控制动系统

    公开(公告)号：US08078353B2

    公开(公告)日：2011-12-13

    申请号：US12557547

    申请日：2009-09-11

    申请人： Kai Yun Yow ,  Poh Leng Eu

    发明人： Kai Yun Yow ,  Poh Leng Eu

    IPC分类号： G01M17/00 ,  G06F19/00

    CPC分类号： B60T8/885 ,  B60T2270/406

    摘要： A self monitoring vehicle braking system includes multiple sensors that gather data associated with the braking system. The data includes wheel speed, road inclination, moisture associated with a surface of the braking system, and audio associated with the road. A processor receives the data from the sensors and processes the data to determine whether a condition of the braking system falls within defined limits and provides to the driver of the vehicle an indication of the braking system condition.

    摘要翻译： 自监控车辆制动系统包括收集与制动系统相关的数据的多个传感器。 数据包括车轮速度，道路倾斜度，与制动系统的表面相关的湿度，以及与道路相关联的音频。 处理器从传感器接收数据并处理数据以确定制动系统的状况是否落在限定的限度内，并向车辆驾驶员提供制动系统状态的指示。

    Semiconductor package with stress relief and heat spreader
    8.
    发明授权
    Semiconductor package with stress relief and heat spreader 有权
    具有应力消除和散热器的半导体封装

    公开(公告)号：US09196576B2

    公开(公告)日：2015-11-24

    申请号：US14277801

    申请日：2014-05-15

    申请人： Kai Yun Yow ,  Poh Leng Eu ,  Meng Kong Lye ,  You Ge ,  Penglin Mei

    发明人： Kai Yun Yow ,  Poh Leng Eu ,  Meng Kong Lye ,  You Ge ,  Penglin Mei

    IPC分类号： H01L23/495 ,  H01L23/34

    CPC分类号： H01L23/49568 ,  H01L23/49503 ,  H01L23/49551 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2924/00014 ,  H01L2224/4554

    摘要： A semiconductor device has a die mounted on a die paddle that is elevated above and thermally connected via tie bars to a heat sink structure. Heat generated by the die flows from the die to the die paddle to the tie bars to the heat sink structure and then to either the external environment or to an external heat sink. By elevating the die/paddle sub-assembly above the heat sink structure, the packaged device is less susceptible to delamination between the die and die attach adhesive and/or the die attach adhesive and the die paddle. An optional heat sink ring can surround the die paddle.

    摘要翻译： 半导体器件具有安装在芯片上的管芯，其上升并且经由连接杆热连接到散热器结构。 由模具产生的热量从模具流到模具板到连接杆到散热器结构，然后流到外部环境或外部散热器。 通过将模具/桨叶子组件提升到散热器结构上方，封装的装置不易受到管芯和管芯附接粘合剂和/或管芯附接粘合剂和管芯焊盘之间的分层的影响。 可选的散热片环可围绕裸片。

    SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED STAND-OFF
    10.
    发明申请
    SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED STAND-OFF 审中-公开
    具有集成定位功能的半导体器件封装

    公开(公告)号：US20110084375A1

    公开(公告)日：2011-04-14

    申请号：US12577722

    申请日：2009-10-13

    申请人： Poh Leng Eu ,  Kai Yun Yow

    发明人： Poh Leng Eu ,  Kai Yun Yow

    IPC分类号： H01L23/498 ,  H01L21/56

    CPC分类号： H05K1/141 ,  H01L23/13 ,  H01L23/3157 ,  H01L23/49816 ,  H01L23/562 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/3511 ,  H05K3/3436 ,  H05K2201/2036 ,  H01L2924/00

    摘要： A semiconductor device includes a substrate having first and second major surfaces and conductive traces, and solder balls attached to the second major surface of the substrate. A semiconductor die including an integrated circuit (IC) is attached to one of the major surfaces of the substrate. The IC is electrically connected to the solder balls by the conductive traces. The substrate includes an integrally molded stand-off feature that prevents the solder balls near the corners and the sides of the substrate from being knocked off during handling. The stand-off feature also maintains a predetermined distance between the substrate and a printed circuit board (PCB) when the substrate is attached to the PCB, and then a reflow process is performed. The stand-off feature also prevents open connections between the solder balls and the PCB that may be caused by warping of the PCB or the weight of the semiconductor die. The semiconductor device may include a stiffener ring attached to the second major surface of the substrate and surrounding the conductive balls.

    摘要翻译： 半导体器件包括具有第一和第二主表面和导电迹线的衬底，以及附着到衬底的第二主表面的焊球。 包括集成电路（IC）的半导体管芯连接到基板的主表面之一。 IC通过导电迹线与焊球电连接。 基板包括一体模制的支座特征，其防止接近拐角处的焊球和基板的侧面在处理期间被撞击。 当衬底附接到PCB时，间隔特征还保持衬底和印刷电路板（PCB）之间的预定距离，然后进行回流处理。 隔离功能还防止可能由PCB的翘曲或半导体管芯的重量引起的焊球和PCB之间的开放连接。 半导体器件可以包括附接到衬底的第二主表面并围绕导电球的加强环。